-
公开(公告)号:US10278309B2
公开(公告)日:2019-04-30
申请号:US15785159
申请日:2017-10-16
Applicant: Huawei Technologies Co., Ltd.
Inventor: Zhongjiang Qu , Shanjiu Chi , Yangfan Zhong , Jin Wang
Abstract: The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.
-
公开(公告)号:US20180042141A1
公开(公告)日:2018-02-08
申请号:US15785159
申请日:2017-10-16
Applicant: Huawei Technologies Co., Ltd.
Inventor: Zhongjiang Qu , Shanjiu Chi , Yangfan Zhong , Jin Wang
CPC classification number: H05K7/20736 , H05K7/1489 , H05K7/20145 , H05K7/20172 , H05K7/20181 , H05K7/20336 , H05K7/20409 , H05K7/20745 , H05K7/20818
Abstract: The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.
-