-
公开(公告)号：US20210043998A1
公开(公告)日：2021-02-11
申请号：US17079997
申请日：2020-10-26
Applicant: Huawei Technologies Co., Ltd.
Inventor： Heng Qu , Ming Chang , Hailin Dong , Xinhong Li , Liangsheng Liu , Hongcheng Yin
Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.
-
公开(公告)号：US11189927B2
公开(公告)日：2021-11-30
申请号：US16872920
申请日：2020-05-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Liangsheng Liu , Xinhong Li , HuiLi Fu
Abstract: A patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.
-
公开(公告)号：US10727595B2
公开(公告)日：2020-07-28
申请号：US16049104
申请日：2018-07-30
Applicant: Huawei Technologies Co., Ltd.
Inventor： Liangsheng Liu , Xinhong Li , HuiLi Fu
Abstract: A patch antenna unit and an antenna that relate to the field of communications technology wherein the patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.
-
公开(公告)号：US11462817B2
公开(公告)日：2022-10-04
申请号：US17079997
申请日：2020-10-26
Applicant: Huawei Technologies Co., Ltd.
Inventor： Heng Qu , Ming Chang , Hailin Dong , Xinhong Li , Liangsheng Liu , Hongcheng Yin
Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.
-
公开(公告)号：US20220209426A1
公开(公告)日：2022-06-30
申请号：US17696100
申请日：2022-03-16
Applicant: Huawei Technologies Co., Ltd.
Inventor： Ming Chang , Liangsheng Liu , Qizhang Hong
Abstract: An antenna and a communications apparatus, where the antenna includes surface radiating patches, inner radiating patches, a first dielectric substrate disposed between the surface radiating patches and the inner radiating patches, and a second dielectric substrate disposed below the inner radiating patches and configured to carry antenna feeders coupled to the inner radiating patches. A dielectric constant or dielectric loss of the first dielectric substrate is lower than that of an organic resin substrate, and a coefficient of thermal expansion of the second dielectric substrate is lower than that of the organic resin substrate.
-
Patent Agency Ranking
公开(公告)号：US11784417B2
公开(公告)日：2023-10-10
申请号：US17696100
申请日：2022-03-16
Applicant: Huawei Technologies Co., Ltd.
Inventor： Ming Chang , Liangsheng Liu , Qizhang Hong
CPC classification number: H01Q21/065 , H01Q1/002 , H01Q5/371 , H01Q9/0407
Abstract: An antenna and a communications apparatus, where the antenna includes surface radiating patches, inner radiating patches, a first dielectric substrate disposed between the surface radiating patches and the inner radiating patches, and a second dielectric substrate disposed below the inner radiating patches and configured to carry antenna feeders coupled to the inner radiating patches. A dielectric constant or dielectric loss of the first dielectric substrate is lower than that of an organic resin substrate, and a coefficient of thermal expansion of the second dielectric substrate is lower than that of the organic resin substrate.
-
公开(公告)号：US11489247B2
公开(公告)日：2022-11-01
申请号：US17150365
申请日：2021-01-15
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Weixi Zhou , Ming Chang , Hailin Dong , Liangsheng Liu , Hongcheng Yin
Abstract: Embodiments of this application disclose an integrated circuit and a terminal device, to resolve a problem that an existing dual-band antenna has a relatively small low-frequency band range and is difficult to meet use requirements. An antenna includes a bearer structure, a first radiation patch, a second radiation patch, and a radio frequency processing chip. The first radiation patch, the second radiation patch, and the radio frequency processing chip are separately placed on different layers of the bearer structure. A first feed line and a second feed line are disposed in the bearer structure. The radio frequency processing chip feeds the first radiation patch by using the first feed line. The radio frequency processing chip feeds the second radiation patch by using the second feed line.
-
公开(公告)号：US20200280132A1
公开(公告)日：2020-09-03
申请号：US16872920
申请日：2020-05-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Liangsheng Liu , Xinhong Li , HuiLi Fu
Abstract: A patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.
-
公开(公告)号：US12224254B2
公开(公告)日：2025-02-11
申请号：US17855358
申请日：2022-06-30
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Weixi Zhou , Liangsheng Liu , Guowen Liu
Abstract: The disclosure provides a millimeter-wave antenna chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate.
-
公开(公告)号：US11309639B2
公开(公告)日：2022-04-19
申请号：US17020022
申请日：2020-09-14
Applicant: Huawei Technologies Co., Ltd.
Inventor： Ming Chang , Liangsheng Liu , Qizhang Hong
Abstract: An antenna and a communications apparatus, where the antenna includes surface radiating patches, inner radiating patches, a first dielectric substrate disposed between the surface radiating patches and the inner radiating patches, and a second dielectric substrate disposed below the inner radiating patches and configured to carry antenna feeders coupled to the inner radiating patches. A dielectric constant or dielectric loss of the first dielectric substrate is lower than that of an organic resin substrate, and a coefficient of thermal expansion of the second dielectric substrate is lower than that of the organic resin substrate.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.017 seconds)
