Invention Grant
- Patent Title: Packaging structure
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Application No.: US17079997Application Date: 2020-10-26
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Publication No.: US11462817B2Publication Date: 2022-10-04
- Inventor: Heng Qu , Ming Chang , Hailin Dong , Xinhong Li , Liangsheng Liu , Hongcheng Yin
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Priority: CN201810378310.5 20180425
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q1/36 ; H01Q13/10

Abstract:
A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.
Public/Granted literature
- US20210043998A1 Packaging Structure Public/Granted day:2021-02-11
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