公开(公告)号：US20190081013A1

公开(公告)日：2019-03-14

申请号：US16185869

申请日：2018-11-09

Applicant: Huawei Technologies Co., Ltd.

Inventor： Tewei Chen ,  Guowen Liu

IPC: H01L23/66 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/22

Abstract: An integrated circuit package apparatus deployed with an antenna and a method for manufacturing an integrated circuit package apparatus, where the integrated circuit package apparatus includes a package substrate, an antenna, a chip, and a connection circuit. The package substrate includes at least one ground plane, the antenna is deployed on an external surface of one side of the package substrate and is located on one side of the at least one ground plane, the chip and the connection circuit are deployed on the other side of the at least one ground plane, where the antenna is isolated from the chip and the connection circuit using the at least one ground plane, and the antenna is coupled to the chip using the connection circuit and a first metal through hole in a thickness direction of the package substrate.

公开(公告)号：US12224254B2

公开(公告)日：2025-02-11

申请号：US17855358

申请日：2022-06-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Weixi Zhou ,  Liangsheng Liu ,  Guowen Liu

IPC: H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/42 ,  H01Q21/06

Abstract: The disclosure provides a millimeter-wave antenna chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate.

公开(公告)号：US11049823B2

公开(公告)日：2021-06-29

申请号：US16185869

申请日：2018-11-09

Applicant: Huawei Technologies Co., Ltd.

Inventor： Tewei Chen ,  Guowen Liu

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/58 ,  H01L23/552 ,  H01L21/48 ,  H01L23/498

Abstract: An integrated circuit package apparatus deployed with an antenna and a method for manufacturing an integrated circuit package apparatus, where the integrated circuit package apparatus includes a package substrate, an antenna, a chip, and a connection circuit. The package substrate includes at least one ground plane, the antenna is deployed on an external surface of one side of the package substrate and is located on one side of the at least one ground plane, the chip and the connection circuit are deployed on the other side of the at least one ground plane, where the antenna is isolated from the chip and the connection circuit using the at least one ground plane, and the antenna is coupled to the chip using the connection circuit and a first metal through hole in a thickness direction of the package substrate.

公开(公告)号：US11430760B2

公开(公告)日：2022-08-30

申请号：US16931819

申请日：2020-07-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jiajie Tang ,  Guanhong Ye ,  Laicun Lin ,  Guowen Liu ,  Shuai Zheng ,  Huafeng Zhang

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.