公开(公告)号：US20220320712A1

公开(公告)日：2022-10-06

申请号：US17843582

申请日：2022-06-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Lei Lu ,  Jian Liang ,  Xiuyin Zhang ,  Jinxu Xu ,  Huiyang Li ,  Lian Yang ,  Wanli Zhan ,  Zongzhi Gao ,  Weixi Zhou

IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q9/04

Abstract: A package antenna apparatus including a package substrate, wherein an antenna array is disposed on the package substrate, and a transceiver chip coupled to the antenna array, where the transceiver chip is fastened to the package substrate, and the transceiver chip has a first pad and a second pad, and a filter disposed on the package substrate, where the filter comprises an input port and an output port, the input port is coupled to the first pad of the transceiver chip, the output port is coupled to the second pad of the transceiver chip, and the filter is configured to filter a signal of the transceiver chip that is input through the input port, and is further configured to output a filtered signal to the transceiver chip through the output port.

公开(公告)号：US11489247B2

公开(公告)日：2022-11-01

申请号：US17150365

申请日：2021-01-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Weixi Zhou ,  Ming Chang ,  Hailin Dong ,  Liangsheng Liu ,  Hongcheng Yin

IPC: H01Q1/22 ,  H01Q5/35 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q9/04

Abstract: Embodiments of this application disclose an integrated circuit and a terminal device, to resolve a problem that an existing dual-band antenna has a relatively small low-frequency band range and is difficult to meet use requirements. An antenna includes a bearer structure, a first radiation patch, a second radiation patch, and a radio frequency processing chip. The first radiation patch, the second radiation patch, and the radio frequency processing chip are separately placed on different layers of the bearer structure. A first feed line and a second feed line are disposed in the bearer structure. The radio frequency processing chip feeds the first radiation patch by using the first feed line. The radio frequency processing chip feeds the second radiation patch by using the second feed line.

公开(公告)号：US12224254B2

公开(公告)日：2025-02-11

申请号：US17855358

申请日：2022-06-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Weixi Zhou ,  Liangsheng Liu ,  Guowen Liu

IPC: H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/42 ,  H01Q21/06

Abstract: The disclosure provides a millimeter-wave antenna chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate.