公开(公告)号：US11309639B2

公开(公告)日：2022-04-19

申请号：US17020022

申请日：2020-09-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Ming Chang ,  Liangsheng Liu ,  Qizhang Hong

IPC: H01Q21/06 ,  H01Q5/371 ,  H01Q9/04 ,  H01Q1/00

Abstract: An antenna and a communications apparatus, where the antenna includes surface radiating patches, inner radiating patches, a first dielectric substrate disposed between the surface radiating patches and the inner radiating patches, and a second dielectric substrate disposed below the inner radiating patches and configured to carry antenna feeders coupled to the inner radiating patches. A dielectric constant or dielectric loss of the first dielectric substrate is lower than that of an organic resin substrate, and a coefficient of thermal expansion of the second dielectric substrate is lower than that of the organic resin substrate.

公开(公告)号：US20210305710A1

公开(公告)日：2021-09-30

申请号：US17232798

申请日：2021-04-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： Ming Chang

IPC: H01Q13/18 ,  H01Q1/22 ,  H01Q13/02

Abstract: In an antenna in package structure, a plurality of supporting blocks spaced apart from each other are disposed between a first substrate and a second substrate, and an antenna cavity is formed between every two adjacent supporting blocks. Therefore, a height of the supporting block determines a height of the antenna cavity. The supporting blocks spaced apart from each other are located between the first substrate and the second substrate, and at least one of the first substrate or the second substrate adheres to the supporting blocks spaced apart front each other using an adhesive layer.

公开(公告)号：US11637376B2

公开(公告)日：2023-04-25

申请号：US17351304

申请日：2021-06-18

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ming Chang

IPC: H01Q1/22 ,  H01Q9/04

Abstract: An antenna packaged substrate includes: a substrate, a first antenna radiating patch disposed on a surface of the substrate, a second antenna radiating patch disposed over the first antenna radiating patch, and a dielectric stack disposed between the first antenna radiating patch and the second antenna radiating patch. The dielectric stack includes a first dielectric layer, a bonding layer disposed on a side that is of the first dielectric layer and faces the first antenna radiating patch, and a second dielectric layer disposed on a side that is of the first dielectric layer and faces the second antenna radiating patch. A dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, and an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer.

公开(公告)号：US11462817B2

公开(公告)日：2022-10-04

申请号：US17079997

申请日：2020-10-26

Applicant: Huawei Technologies Co., Ltd.

Inventor： Heng Qu ,  Ming Chang ,  Hailin Dong ,  Xinhong Li ,  Liangsheng Liu ,  Hongcheng Yin

IPC: H01Q1/22 ,  H01Q1/36 ,  H01Q13/10

Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.

公开(公告)号：US20220209426A1

公开(公告)日：2022-06-30

申请号：US17696100

申请日：2022-03-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： Ming Chang ,  Liangsheng Liu ,  Qizhang Hong

IPC: H01Q21/06 ,  H01Q5/371 ,  H01Q1/00 ,  H01Q9/04

Abstract: An antenna and a communications apparatus, where the antenna includes surface radiating patches, inner radiating patches, a first dielectric substrate disposed between the surface radiating patches and the inner radiating patches, and a second dielectric substrate disposed below the inner radiating patches and configured to carry antenna feeders coupled to the inner radiating patches. A dielectric constant or dielectric loss of the first dielectric substrate is lower than that of an organic resin substrate, and a coefficient of thermal expansion of the second dielectric substrate is lower than that of the organic resin substrate.

公开(公告)号：US20210313696A1

公开(公告)日：2021-10-07

申请号：US17351304

申请日：2021-06-18

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ming Chang

IPC: H01Q9/04 ,  H01Q1/22

Abstract: An antenna packaged substrate includes: a substrate, a first antenna radiating patch disposed on a surface of the substrate, a second antenna radiating patch disposed over the first antenna radiating patch, and a dielectric stack disposed between the first antenna radiating patch and the second antenna radiating patch. The dielectric stack includes a first dielectric layer, a bonding layer disposed on a side that is of the first dielectric layer and faces the first antenna radiating patch, and a second dielectric layer disposed on a side that is of the first dielectric layer and faces the second antenna radiating patch. A dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, and an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer.

公开(公告)号：US20230291688A1

公开(公告)日：2023-09-14

申请号：US18315746

申请日：2023-05-11

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yinhai Pan ,  Maobin Fan ,  Ming Chang ,  Xiaowen Cao ,  Hongli Wang ,  Siqing Du ,  Peiyu Yue

IPC: H04L45/74 ,  H04L1/1607 ,  H04L49/90

CPC classification number: H04L45/74 ,  H04L1/1607 ,  H04L49/90

Abstract: A method includes: A first transmission unit packs, at a protocol layer of the first transmission unit, to-be-transmitted data of an application layer of the first transmission unit, to generate a data packet. The data packet includes data type information, the data type information indicates an application scenario of the data packet, and the application scenario includes any one of a camera scenario, a display scenario, and a storage scenario. The first transmission unit sends the data packet to a physical layer of the first transmission unit through the protocol layer of the first transmission unit. The first transmission unit sends the data packet to a second transmission unit through the physical layer of the first transmission unit.

公开(公告)号：US20230308530A1

公开(公告)日：2023-09-28

申请号：US18323854

申请日：2023-05-25

Applicant: Huawei Technologies Co., Ltd.

Inventor： Ming Chang ,  Siqing Du ,  Peiyu Yue ,  Maobin Fan

IPC: H04L69/22 ,  H04N7/035 ,  H04L69/18

CPC classification number: H04L69/22 ,  H04L69/18 ,  H04N7/035

Abstract: A data transmission method and an electronic device are provided. One uplink interface and one downlink interface are deployed on each input device of the electronic device. The uplink interface is connected to a processor or an upper-level input device, and the downlink interface is connected to a lower-level input device. A processing module in each input device may process image data collected by the current-level device and data sent by a lower-level input device connected to a downlink interface, and then transmit processed data to the processor or an upper-level input device through an uplink interface. Thus the plurality of input devices are connected in a cascade manner, and only one of the plurality of input devices needs to be connected to the processor.

公开(公告)号：US20210043998A1

公开(公告)日：2021-02-11

申请号：US17079997

申请日：2020-10-26

Applicant: Huawei Technologies Co., Ltd.

Inventor： Heng Qu ,  Ming Chang ,  Hailin Dong ,  Xinhong Li ,  Liangsheng Liu ,  Hongcheng Yin

IPC: H01Q1/22 ,  H01Q13/10 ,  H01Q1/36

Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.

公开(公告)号：US20230335081A1

公开(公告)日：2023-10-19

申请号：US18332868

申请日：2023-06-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Weiwei Fan ,  Ming Chang ,  Hongli Wang ,  Xiaowen Cao ,  Wenhao Jiang ,  Siqing Du

IPC: G09G5/18 ,  G09G5/12

CPC classification number: G09G5/18 ,  G09G5/12 ,  G09G2310/08 ,  G09G2340/16

Abstract: A method includes: a processor that obtains several lines of data in to-be-displayed display data to generate a data block; generates a synchronization flag corresponding to the data block; encapsulates the data block and the synchronization flag corresponding to the data block to obtain a data packet corresponding to the data block; and sends all data packets corresponding to the display data to the display system. The display system sequentially parses all the data packets sent by the processor to obtain a synchronization flag associated with each data packet, and determines a display location of each data block on a display panel based on the synchronization flag to display the display data.