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公开(公告)号：US11462817B2
公开(公告)日：2022-10-04
申请号：US17079997
申请日：2020-10-26
Applicant: Huawei Technologies Co., Ltd.
Inventor： Heng Qu , Ming Chang , Hailin Dong , Xinhong Li , Liangsheng Liu , Hongcheng Yin
Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.
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公开(公告)号：US20200280132A1
公开(公告)日：2020-09-03
申请号：US16872920
申请日：2020-05-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Liangsheng Liu , Xinhong Li , HuiLi Fu
Abstract: A patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.
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Patent Agency Ranking
公开(公告)号：US20210043998A1
公开(公告)日：2021-02-11
申请号：US17079997
申请日：2020-10-26
Applicant: Huawei Technologies Co., Ltd.
Inventor： Heng Qu , Ming Chang , Hailin Dong , Xinhong Li , Liangsheng Liu , Hongcheng Yin
Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.
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公开(公告)号：US11189927B2
公开(公告)日：2021-11-30
申请号：US16872920
申请日：2020-05-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Liangsheng Liu , Xinhong Li , HuiLi Fu
Abstract: A patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.
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公开(公告)号：US10727595B2
公开(公告)日：2020-07-28
申请号：US16049104
申请日：2018-07-30
Applicant: Huawei Technologies Co., Ltd.
Inventor： Liangsheng Liu , Xinhong Li , HuiLi Fu
Abstract: A patch antenna unit and an antenna that relate to the field of communications technology wherein the patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.
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公开(公告)号：US10693233B2
公开(公告)日：2020-06-23
申请号：US16049104
申请日：2018-07-30
Applicant: Huawei Technologies Co., Ltd.
Inventor： Liangsheng Liu , Xinhong Li , HuiLi Fu
Abstract: A patch antenna unit and an antenna that relate to the field of communications technology wherein the patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.
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公开(公告)号：US20180337456A1
公开(公告)日：2018-11-22
申请号：US16049104
申请日：2018-07-30
Applicant: Huawei Technologies Co., Ltd.
Inventor： Liangsheng Liu , Xinhong Li , HuiLi Fu
Abstract: A patch antenna unit and an antenna that relate to the field of communications technology wherein the patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.
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