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公开(公告)号：US09111915B1
公开(公告)日：2015-08-18
申请号：US14188555
申请日：2014-02-24
IPC分类号： H01L21/44 , H01L23/053 , H01L23/485
CPC分类号： H05K1/0207 , H01L23/36 , H01L23/3675 , H01L23/485 , H01L23/49822 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/16 , H01L2224/04026 , H01L2224/05571 , H01L2224/06051 , H01L2224/06102 , H01L2224/29078 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32268 , H01L2224/83191 , H01L2224/8323 , H01L2224/83815 , H01L2224/83855 , H01L2224/83885 , H01L2224/83986 , H01L2924/10158 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H05K1/0203 , H05K1/111 , H05K1/181 , H05K1/183 , H05K3/303 , H05K3/305 , H05K3/3442 , H05K2201/10446 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01051 , H01L2924/0665 , H01L2924/00014
摘要： An assembly including a substrate that includes a plurality of conductive plane layers including a first group and a second group of common conductive plane layers, where electrically isolated first and second attach pads are on an edge surface of the substrate and at least thermally coupled to the first and second groups of common conductive plane layers, respectively. A surface mount technology (SMT) component, such as a thermal jumper, mounted on the first and second attach pads such that the SMT component is at least thermally coupled to the first and second groups of common conductive plane layers via the first and second attach pads, respectively. Methods of forming such an assembly also are disclosed.
摘要翻译： 一种包括衬底的组件，其包括包括第一组和第二组公共导电平面层的多个导电平面层，其中电隔离的第一和第二附接焊盘位于衬底的边缘表面上，并且至少热耦合到 第一组和第二组共同导电平面层。 安装在第一和第二附接焊盘上的表面贴装技术（SMT）部件，例如热跳线，使得SMT部件至少经由第一和第二连接热耦合到第一和第二组公共导电平面层 垫片。 公开了形成这种组件的方法。
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公开(公告)号：US09946284B1
公开(公告)日：2018-04-17
申请号：US15398415
申请日：2017-01-04
摘要： A single event effects (SEE) immune linear voltage regulator includes an input node, an output node, a first transistor control logic, a second transistor control logic, a first transistor, and a second transistor. The regulator is configured such that when the first transistor is operating in linear regulation mode, the second transistor automatically operates in saturation mode, and the voltage at the output node is controlled by the first transistor and the first transistor control logic to be substantially equal to the first reference voltage. Conversely, when the second transistor is operating in linear regulation mode, the first transistor automatically operates in saturation mode, and the voltage at the output node is controlled by the second transistor and the second transistor control logic to be substantially equal to the second reference voltage.
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公开(公告)号：US20150245465A1
公开(公告)日：2015-08-27
申请号：US14188555
申请日：2014-02-24
IPC分类号： H05K1/02 , H05K3/30 , H05K1/18 , H01L23/367 , H05K1/11
CPC分类号： H05K1/0207 , H01L23/36 , H01L23/3675 , H01L23/485 , H01L23/49822 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/16 , H01L2224/04026 , H01L2224/05571 , H01L2224/06051 , H01L2224/06102 , H01L2224/29078 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32268 , H01L2224/83191 , H01L2224/8323 , H01L2224/83815 , H01L2224/83855 , H01L2224/83885 , H01L2224/83986 , H01L2924/10158 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H05K1/0203 , H05K1/111 , H05K1/181 , H05K1/183 , H05K3/303 , H05K3/305 , H05K3/3442 , H05K2201/10446 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01051 , H01L2924/0665 , H01L2924/00014
摘要： An assembly including a substrate that includes a plurality of conductive plane layers including a first group and a second group of common conductive plane layers, where electrically isolated first and second attach pads are on an edge surface of the substrate and at least thermally coupled to the first and second groups of common conductive plane layers, respectively. A surface mount technology (SMT) component, such as a thermal jumper, mounted on the first and second attach pads such that the SMT component is at least thermally coupled to the first and second groups of common conductive plane layers via the first and second attach pads, respectively. Methods of forming such an assembly also are disclosed.
摘要翻译： 一种包括衬底的组件，其包括包括第一组和第二组公共导电平面层的多个导电平面层，其中电隔离的第一和第二附接焊盘位于衬底的边缘表面上，并且至少热耦合到 第一组和第二组共同导电平面层。 安装在第一和第二附接焊盘上的表面贴装技术（SMT）部件，例如热跳线，使得SMT部件至少经由第一和第二连接热耦合到第一和第二组公共导电平面层 垫片。 公开了形成这种组件的方法。
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公开(公告)号：US20140198820A1
公开(公告)日：2014-07-17
申请号：US13743890
申请日：2013-01-17
IPC分类号： G01K15/00
CPC分类号： G01K15/005 , G01K7/24 , G01K2219/00 , H03M1/181
摘要： Systems and methods for an auto-ranging temperature sensor are provided. In at least one embodiment, a system for sensing and measuring temperature comprises at least one analog signal amplifier that generates an amplified analog signal output based on an analog signal from at least one of a biased thermistor circuit and a calibration circuit and a digital to analog converter that generates an analog offset signal as an input to the at least one analog signal amplifier, wherein the analog offset signal shifts the amplified analog signal within an analog to digital converter input operating range when the amplified analog signal is equal to or greater than a limit of the analog to digital converter input operating range, wherein the analog offset signal is determined based on the magnitude of the amplified analog signal.
摘要翻译： 提供了自动量程温度传感器的系统和方法。 在至少一个实施例中，用于感测和测量温度的系统包括至少一个模拟信号放大器，其基于来自偏置的热敏电阻电路和校准电路以及数字到模拟的至少一个的模拟信号来产生放大的模拟信号输出 转换器，其产生作为至少一个模拟信号放大器的输入的模拟偏移信号，其中当放大的模拟信号等于或大于一个时，模拟偏移信号将放大的模拟信号在模数转换器输入工作范围内移位 模拟 - 数字转换器输入工作范围的限制，其中基于放大的模拟信号的大小确定模拟偏移信号。
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