An assembly including a substrate that includes a plurality of conductive plane layers including a first group and a second group of common conductive plane layers, where electrically isolated first and second attach pads are on an edge surface of the substrate and at least thermally coupled to the first and second groups of common conductive plane layers, respectively. A surface mount technology (SMT) component, such as a thermal jumper, mounted on the first and second attach pads such that the SMT component is at least thermally coupled to the first and second groups of common conductive plane layers via the first and second attach pads, respectively. Methods of forming such an assembly also are disclosed.