知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.017 seconds)

    Charged particle beam apparatus
    1.
    发明授权
    Charged particle beam apparatus 有权

    公开(公告)号：US11557457B2

    公开(公告)日：2023-01-17

    申请号：US17331765

    申请日：2021-05-27

    Applicant: Hitachi High-Tech Corporation

    Inventor： Kosuke Matsumoto ,  Satoshi Takada ,  Takashi Nobuhara ,  Hirohiko Kitsuki ,  Kazuo Aoki

    IPC: H01J37/28 ,  H01J37/21 ,  H01J37/26

    Abstract: There is provided a charged particle beam apparatus that can reduce the processing time. A charged particle beam apparatus includes: an excitation control unit that controls a focal position by changing a control value of excitation of an electronic lens; an electrostatic field control unit that controls the focal position by changing a control value of an electrostatic field; a focal position height estimation unit that estimates a height of the focal position from the control value of the excitation of the electronic lens; and a control unit that controls the excitation control unit and the electrostatic field control unit. The control unit compares the height of the focal position estimated by the focal position height estimation unit with a height of a sample surface of a sample to be observed, and according to a result of comparison, determines whether it is necessary to change the control value of the excitation of the electronic lens before observing the sample.

    Inspection method
    2.
    发明授权
    Inspection method 有权

    公开(公告)号：US12181513B2

    公开(公告)日：2024-12-31

    申请号：US18026718

    申请日：2020-09-30

    Applicant: Hitachi High-Tech Corporation

    Inventor： Shota Mitsugi ,  Yohei Nakamura ,  Daisuke Bizen ,  Junichi Fuse ,  Satoshi Takada ,  Natsuki Tsuno

    IPC: G01R31/26 ,  G01R31/265

    Abstract: A control device controls a contact probe in synchronization with a pulse-controlled light having a predetermined wavelength, a measurement instrument measures a characteristic of a sample to be inspected or an analysis sample, and a circuit constant or a defect structure of the sample to be inspected is estimated based on a circuit model created by an electric characteristic analysis device configured to generate the circuit model based on a value measured by the measurement instrument and a detection signal of secondary electrons detected by the charged particle beam device.

    Computer system of observation device and processing method
    4.
    发明授权
    Computer system of observation device and processing method 有权

    公开(公告)号：US12210338B2

    公开(公告)日：2025-01-28

    申请号：US17456228

    申请日：2021-11-23

    Applicant: Hitachi High-Tech Corporation

    Inventor： Kosuke Matsumoto ,  Satoshi Takada ,  Hideki Nakayama ,  Miyuki Fukuda ,  Kozo Miyake ,  Yuya Isomae

    IPC: G05B19/418 ,  G06T7/00

    Abstract: As a technology for an observation device and an inspection device, a technology capable of reducing a work effort related to generation of a recipe including alignment information is provided. An observation device 1 includes an observation unit 103 that obtains an image for observing a sample 101 on a stage 102. A computer system 2 of the observation device 1 acquires the image from the observation unit 103, specifies a period of a pattern-formed unit region repeatedly formed on a surface of the sample 101 from the image, and generates a recipe including observation or inspection alignment positions of the sample 101 using the specified period.

    Semiconductor inspection device and method for inspecting semiconductor sample
    5.
    发明授权
    Semiconductor inspection device and method for inspecting semiconductor sample 有权

    公开(公告)号：US12196802B2

    公开(公告)日：2025-01-14

    申请号：US18016882

    申请日：2020-09-29

    Applicant: Hitachi High-Tech Corporation

    Inventor： Yasuhiro Shirasaki ,  Natsuki Tsuno ,  Minami Shouji ,  Makoto Sakakibara ,  Satoshi Takada

    IPC: G01R31/265 ,  G01R31/26 ,  G01R31/28 ,  G01R31/307

    Abstract: A semiconductor inspection device 1 having a first measurement mode and a second measurement mode includes: an electron optical system configured to irradiate a sample with an electron beam; an optical system configured to irradiate the sample with light; an electron detector configured to detect a signal electron; a photodetector 29 configured to detect signal light; a control unit 11 configured to control the electron optical system and the optical system such that an electron beam and light are emitted under a first irradiation condition in the first measurement mode, and to control the electron optical system and the optical system such that an electron beam and light are emitted under a second irradiation condition in the second measurement mode; and a computer configured to process a detection signal from the electron detector or the photodetector.

    Computer System of Observation Device and Processing Method
    6.
    发明申请
    Computer System of Observation Device and Processing Method 有权

    公开(公告)号：US20220187810A1

    公开(公告)日：2022-06-16

    申请号：US17456228

    申请日：2021-11-23

    Applicant: Hitachi High-Tech Corporation

    Inventor： Kosuke MATSUMOTO ,  Satoshi Takada ,  Hideki Nakayama ,  Miyuki Fukuda ,  Kozo Miyake ,  Yuya Isomae

    IPC: G05B19/418 ,  G06T7/00

    Abstract: As a technology for an observation device and an inspection device, a technology capable of reducing a work effort related to generation of a recipe including alignment information is provided. An observation device 1 includes an observation unit 103 that obtains an image for observing a sample 101 on a stage 102. A computer system 2 of the observation device 1 acquires the image from the observation unit 103, specifies a period of a pattern-formed unit region repeatedly formed on a surface of the sample 101 from the image, and generates a recipe including observation or inspection alignment positions of the sample 101 using the specified period.

Patent Agency Ranking