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    Electronic package encapsulating electronic components therein
    4.
    发明授权
    Electronic package encapsulating electronic components therein 有权
    在其中封装电子部件的电子封装

    公开(公告)号：US07667978B2

    公开(公告)日：2010-02-23

    申请号：US11826552

    申请日：2007-07-17

    申请人： Shinsuke Nagasaka ,  Kazuo Katoh ,  Akira Shintai ,  Takashi Aoki

    发明人： Shinsuke Nagasaka ,  Kazuo Katoh ,  Akira Shintai ,  Takashi Aoki

    IPC分类号： H01R7/00

    CPC分类号： H01L23/3142 ,  H01L23/3107 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： An electronic component unit including a metallic member and an electronic component, such as a semiconductor element, mounted on the metallic member is encapsulated with molding resin such as epoxy resin, thereby forming an electronic package. The electronic component unit is covered with primer made of a material such as resin to increase an adhesive force of the molding resin to the electronic component unit. A glass transition temperature of both of the molding resin and the primer is set to a temperature higher than 200° C. to keep the adhesive force unchanged at least up to the ambient temperature of 200° C. and to secure a reliability of the electronic package. A metallic lead wire connected to the electronic component may be encapsulated together with the electronic component unit. An entire surface of the electronic component unit may be covered with the primer to further improve the adhesive force.

    摘要翻译： 包括金属构件和安装在金属构件上的诸如半导体元件的电子部件的电子部件单元用诸如环氧树脂的模塑树脂封装，从而形成电子封装。 电子部件单元被由诸如树脂的材料制成的底漆覆盖以增加模制树脂对电子部件单元的粘合力。 将模塑树脂和底漆两者的玻璃化转变温度设定为高于200℃的温度，以保持粘合力至少不超过200℃的环境温度，并确保电子的可靠性 包。 连接到电子部件的金属引线可以与电子部件单元一起封装。 电子部件单元的整个表面可以被底漆覆盖，以进一步提高粘合力。

    Manufacturing method for a resin sealed semiconductor device
    9.
    发明授权
    Manufacturing method for a resin sealed semiconductor device 失效
    树脂密封半导体器件的制造方法

    公开(公告)号：US5920768A

    公开(公告)日：1999-07-06

    申请号：US991250

    申请日：1997-12-16

    申请人： Akira Shintai

    发明人： Akira Shintai

    IPC分类号： B29C45/26 ,  B29C45/02 ,  B29C45/14 ,  B29L31/34 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L21/44

    CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351

    摘要： A hybrid IC substrate and a power transistor are mounted on a mounting base so as to form a lead frame assembly. The hybrid IC substrate and the power transistor are electrically connected by wires. The lead frame assembly is held between upper and lower molding dies. Inner leads are arranged in a vicinity of an air vent communicating with a molding cavity defined between the upper and lower molding dies so as to protrude into the molding cavity. A liquefied molding resin is injected into the molding cavity from a gate at an upstream side of the molding cavity opposed to the inner leads. The injected molding resin is separated into upper and lower resin flows advancing above and below the lead frame assembly. Then, either of the upper and lower resin flows reaches a downstream side of the molding cavity and merges into the other resin flow after passing through clearances between the inner leads at a reduced speed decelerated by the inner leads, thereby filing the molding cavity with the molding resin without causing any void.

    摘要翻译： 混合IC基板和功率晶体管安装在安装基座上以形成引线框组件。 混合IC基板和功率晶体管通过电线电连接。 引线框架组件保持在上模和下模之间。 内引线布置在与形成在上模和下模之间的模制腔相通的排气孔附近，以便突出到模腔中。 将液化模塑树脂从与内引线相对的模腔的上游侧的浇口注入模制腔。 注射成型树脂被分离成在引线框架组件上方和下方前进的上，下树脂流。 然后，上下树脂流中的任一个到达模腔的下游侧，并且在通过内引线减速的通过内引线之间的间隙之后合并到另一树脂流中，从而将成型腔与 模塑树脂而不引起任何空隙。