公开(公告)号：US20070224511A1

公开(公告)日：2007-09-27

申请号：US11798797

申请日：2007-05-17

申请人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

发明人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC分类号： H01M4/62

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

摘要： A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

公开(公告)号：US20050127536A1

公开(公告)日：2005-06-16

申请号：US10969320

申请日：2004-10-21

申请人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

发明人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC分类号： C09J9/02 ,  C09J11/04 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/58 ,  H05K1/09 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

摘要： A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

摘要翻译： 提供一种导体组合物，其能够在低温处理下容易地确保与Ag体积相同的电导率，使用该导体组合物的安装基板和利用导体组合物的安装结构。 在安装结构中，其中安装基板（10）的一个或多个电极（11）和一个或多个表面安装部件（20）通过导体组合物（30）连接，以及一个或多个表面布线（14） 所述安装基板（10），一个或多个内层布线（13）和一个或多个通孔导体（12）由所述导体组合物形成，所述导体组合物包含具有导电性的导电颗粒，并且所述导电颗粒由 结晶尺寸为10nm以下的低结晶性Ag填料。

公开(公告)号：US07667978B2

公开(公告)日：2010-02-23

申请号：US11826552

申请日：2007-07-17

申请人： Shinsuke Nagasaka ,  Kazuo Katoh ,  Akira Shintai ,  Takashi Aoki

发明人： Shinsuke Nagasaka ,  Kazuo Katoh ,  Akira Shintai ,  Takashi Aoki

IPC分类号： H01R7/00

CPC分类号： H01L23/3142 ,  H01L23/3107 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic component unit including a metallic member and an electronic component, such as a semiconductor element, mounted on the metallic member is encapsulated with molding resin such as epoxy resin, thereby forming an electronic package. The electronic component unit is covered with primer made of a material such as resin to increase an adhesive force of the molding resin to the electronic component unit. A glass transition temperature of both of the molding resin and the primer is set to a temperature higher than 200° C. to keep the adhesive force unchanged at least up to the ambient temperature of 200° C. and to secure a reliability of the electronic package. A metallic lead wire connected to the electronic component may be encapsulated together with the electronic component unit. An entire surface of the electronic component unit may be covered with the primer to further improve the adhesive force.

摘要翻译： 包括金属构件和安装在金属构件上的诸如半导体元件的电子部件的电子部件单元用诸如环氧树脂的模塑树脂封装，从而形成电子封装。 电子部件单元被由诸如树脂的材料制成的底漆覆盖以增加模制树脂对电子部件单元的粘合力。 将模塑树脂和底漆两者的玻璃化转变温度设定为高于200℃的温度，以保持粘合力至少不超过200℃的环境温度，并确保电子的可靠性 包。 连接到电子部件的金属引线可以与电子部件单元一起封装。 电子部件单元的整个表面可以被底漆覆盖，以进一步提高粘合力。

公开(公告)号：US07276185B2

公开(公告)日：2007-10-02

申请号：US10969320

申请日：2004-10-21

申请人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

发明人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC分类号： H01B1/22 ,  B32B15/01 ,  B32B27/14

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

摘要： A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

摘要翻译： 提供一种导体组合物，其能够在低温处理下容易地确保与Ag体积相同的电导率，使用该导体组合物的安装基板和利用导体组合物的安装结构。 在安装结构中，其中安装基板（10）的一个或多个电极（11）和一个或多个表面安装部件（20）通过导体组合物（30）连接，以及一个或多个表面布线（14） 所述安装基板（10），一个或多个内层布线（13）和一个或多个通孔导体（12）由所述导体组合物形成，所述导体组合物包含具有导电性的导电颗粒，并且所述导电颗粒由 结晶尺寸为10nm以下的低结晶性Ag填料。

公开(公告)号：US5362775A

公开(公告)日：1994-11-08

申请号：US856767

申请日：1992-03-24

申请人： Akira Shintai ,  Hiroshi Shibata ,  Toshio Shiobara ,  Koji Futatsumori ,  Seizi Katayama ,  Yasutaka Yoshida

发明人： Akira Shintai ,  Hiroshi Shibata ,  Toshio Shiobara ,  Koji Futatsumori ,  Seizi Katayama ,  Yasutaka Yoshida

IPC分类号： C08G59/18 ,  C08G59/30 ,  C08G59/40 ,  C08G59/62 ,  H01L23/29 ,  C08G59/14 ,  C08K5/51

CPC分类号： C08G59/188 ,  C08G59/306 ,  C08G59/4071 ,  C08G59/621 ,  H01L23/293 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/10253 ,  H01L2924/1301

摘要： An epoxy resin composition comprising (i) an epoxy resin, (ii) a phenolic curing agent, (iii) an organophosphorous curing agent, (iv) alumina, and (v) a separating means for separating the organophosphorous curing agent and the alumina, which may be a coating over the surfaces of the organophosphorous curing agent.

摘要翻译： 一种环氧树脂组合物，其包含（i）环氧树脂，（ii）酚类固化剂，（iii）有机磷固化剂，（iv）氧化铝和（v）用于分离有机磷固化剂和氧化铝的分离装置， 其可以是有机磷固化剂的表面上的涂层。

公开(公告)号：US5202753A

公开(公告)日：1993-04-13

申请号：US766347

申请日：1991-09-27

申请人： Akira Shintai

发明人： Akira Shintai

IPC分类号： C08K3/22 ,  C08G59/00 ,  C08K3/36 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373 ,  H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/295 ,  H01L23/3737 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/10253 ,  H01L2924/181

摘要： A resin-sealed semiconductor device, including a lead frame. A semiconductor chip is formed on the lead frame and is electrically connected with the lead frame. At least a part of the lead frame and the semiconductor chip are sealed with a theremosetting resin which includes a base resin, aluminum oxide and fused silica. Stress acting on the semiconductor chip is reduced because the thermal expansion coefficient of the thermosetting resin becomes low due to the fused silica. At the same time the thermal conductivity of the thermosetting resin is increased because of the aluminum oxide.

摘要翻译： 一种树脂密封半导体器件，包括引线框架。 半导体芯片形成在引线框架上并与引线框架电连接。 引线框架和半导体芯片的至少一部分用包括基础树脂，氧化铝和熔融二氧化硅的固定树脂密封。 由于熔融二氧化硅，热固性树脂的热膨胀系数变低，所以作用在半导体芯片上的应力减小。 同时由于氧化铝，热固性树脂的热导率增加。

公开(公告)号：US07807073B2

公开(公告)日：2010-10-05

申请号：US11798797

申请日：2007-05-17

申请人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

发明人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC分类号： H01L23/58 ,  H01B1/22 ,  H05K3/02 ,  B22F1/00

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

摘要： A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 μm or less.

摘要翻译： 提供一种导体组合物，其能够在低温处理下容易地确保与Ag体积相同的电导率，使用该导体组合物的安装基板和利用导体组合物的安装结构。 在安装结构中，其中安装基板（10）的一个或多个电极（11）和一个或多个表面安装部件（20）通过导体组合物（30）连接，以及一个或多个表面布线（14） 所述安装基板（10），一个或多个内层布线（13）和一个或多个通孔导体（12）由所述导体组合物形成，所述导体组合物包含具有导电性的导电颗粒，并且所述导电颗粒由 结晶尺寸为10μm以下的低结晶性Ag填料。

公开(公告)号：US07772025B2

公开(公告)日：2010-08-10

申请号：US11902984

申请日：2007-09-27

申请人： Osamu Arao ,  Akira Shintai ,  Takashige Saitoh

发明人： Osamu Arao ,  Akira Shintai ,  Takashige Saitoh

IPC分类号： H01L21/00

CPC分类号： G01C19/56 ,  B81B2201/025 ,  B81B2201/0264 ,  B81C1/00333 ,  B81C2203/0136 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/125 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  Y10T428/24355 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic device includes an electronic element having a detecting part on one surface thereof, a base member, bumps, and an adhesive film. The base member is arranged to face the one surface of the electric element. The bumps are arranged between the electric element and the base member for electrically coupling the electric element and the base member. The adhesive film is attached to the one surface of the electronic element and has an electronic insulating property. In addition, the adhesive film has a hollow part at a portion corresponding to the detecting part in a manner separated from the detecting part. Furthermore, a first pressure in the hollow part is higher than a second pressure outside the hollow part.

摘要翻译： 电子设备包括在其一个表面上具有检测部分的电子元件，基底构件，凸块和粘合剂膜。 基部构件被布置成面向电气元件的一个表面。 凸起布置在电气元件和基座构件之间，用于电连接电气元件和基座构件。 粘合膜附着在电子元件的一个表面上，具有电子绝缘性。 此外，粘合膜在与检测部分分离的方式在与检测部对应的部分处具有中空部。 此外，中空部分中的第一压力高于中空部分外部的第二压力。

公开(公告)号：US20080130246A1

公开(公告)日：2008-06-05

申请号：US11826552

申请日：2007-07-17

申请人： Shinsuke Nagasaka ,  Kazuo Katoh ,  Akira Shintai ,  Takashi Aoki

发明人： Shinsuke Nagasaka ,  Kazuo Katoh ,  Akira Shintai ,  Takashi Aoki

IPC分类号： H05K7/00

CPC分类号： H01L23/3142 ,  H01L23/3107 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic component unit including a metallic member and an electronic component, such as a semiconductor element, mounted on the metallic member is encapsulated with molding resin such as epoxy resin, thereby forming an electronic package. The electronic component unit is covered with primer made of a material such as resin to increase an adhesive force of the molding resin to the electronic component unit. A glass transition temperature of both of the molding resin and the primer is set to a temperature higher than 200° C. to keep the adhesive force unchanged at least up to the ambient temperature of 200° C. and to secure a reliability of the electronic package. A metallic lead wire connected to the electronic component may be encapsulated together with the electronic component unit. An entire surface of the electronic component unit may be covered with the primer to further improve the adhesive force.

摘要翻译： 包括金属构件和安装在金属构件上的诸如半导体元件的电子部件的电子部件单元用诸如环氧树脂的模塑树脂封装，从而形成电子封装。 电子部件单元被由诸如树脂的材料制成的底漆覆盖以增加模制树脂对电子部件单元的粘合力。 将模塑树脂和底漆两者的玻璃化转变温度设定为高于200℃的温度，以保持粘合力至少不超过200℃的环境温度，并确保电子的可靠性 包。 连接到电子部件的金属引线可以与电子部件单元一起封装。 电子部件单元的整个表面可以被底漆覆盖，以进一步提高粘合力。

公开(公告)号：US5948991A

公开(公告)日：1999-09-07

申请号：US979799

申请日：1997-11-26

申请人： Hiroshi Nomura ,  Yukihiro Kato ,  Akira Shintai

发明人： Hiroshi Nomura ,  Yukihiro Kato ,  Akira Shintai

IPC分类号： B29C45/14 ,  G01L9/00 ,  G01L9/02

CPC分类号： G01L19/143 ,  B29C45/14639 ,  G01L19/0084 ,  G01L19/147 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815

摘要： An IC chip for signal processing circuit is enclosed in a mold IC and a pressure sensitive element unit is integrally provided thereon. When the mold IC is housed in a case, the mold IC is fixed to the case under a state where ends of connector pins insert-molded to the case are electrically connected to external terminals of the mold IC. Thereby, a sensor signal is outputted from other ends of the connector pins. By integrating the IC chip for signal processing circuit in the mold IC, the IC chip for signal processing circuit can be protected against a contaminated environment at a location where the pressure sensitive element unit is arranged.

摘要翻译： 用于信号处理电路的IC芯片封装在模具IC中，并且压敏元件单元一体地设置在其上。 当模具IC被容纳在壳体中时，模具IC被固定到壳体，在插入模制到壳体的连接器针的端部电连接到模具IC的外部端子的状态下。 从而，从连接器针的另一端输出传感器信号。 通过将信号处理电路的IC芯片集成在模具IC中，用于信号处理电路的IC芯片可以防止在设置压敏元件单元的位置处的污染环境。