公开(公告)号：US20130121635A1

公开(公告)日：2013-05-16

申请号：US13293624

申请日：2011-11-10

Applicant: Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

Inventor： Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

IPC: G02B6/26 ,  B23P11/00

CPC classification number: G02B6/26 ,  Y10T29/49826

Abstract: In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.

Abstract translation: 在MCM中，光信号由设置在第一基板的表面上的光波导传送到具有垂直面的光耦合器。 该光耦合器具有与光波导的光学模式不同的光学模式。 例如，与光耦合器相关联的光学模式的空间范围可能更大，从而减少光学损耗和对准误差的灵敏度。 然后，光信号从另一基板上的垂直面到同一光耦合器的面向垂直面直接耦合，并且光信号在设置在另一基板上的另一光波导中传送。

公开(公告)号：US08742576B2

公开(公告)日：2014-06-03

申请号：US13397593

申请日：2012-02-15

Applicant: Hiren D. Thacker ,  Hyung Suk Yang ,  Ivan Shubin ,  John E. Cunningham

Inventor： Hiren D. Thacker ,  Hyung Suk Yang ,  Ivan Shubin ,  John E. Cunningham

IPC: H01L23/48 ,  H01L23/498 ,  H01L21/50

CPC classification number: H01L25/0652 ,  H01L23/48 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/91 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73201 ,  H01L2224/73251 ,  H01L2224/81138 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/81 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An MCM includes a two-dimensional array of facing chips, including island chips and bridge chips that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures are in cavities in a substrate, which house the bridge chips, provide a compressive force on back surfaces of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.

Abstract translation: MCM包括面向芯片的二维阵列，包括使用重叠连接器彼此通信的岛芯片和桥芯片。 为了保持这些连接器的相对垂直间隔，可压缩结构位于衬底中的空腔中，其容纳桥芯片，在桥芯片的后表面上提供压缩力。 这些可压缩结构包括具有形状和体积压缩的柔性材料。 以这种方式，MCM可以确保岛芯片和桥芯片的面对表面以及这些表面上的连接器在不弯曲桥接芯片的情况下大致共面。

公开(公告)号：US08600201B2

公开(公告)日：2013-12-03

申请号：US13032561

申请日：2011-02-22

Applicant: Hiren D. Thacker ,  Ivan Shubin ,  John E. Cunningham

Inventor： Hiren D. Thacker ,  Ivan Shubin ,  John E. Cunningham

IPC: G02B6/12

CPC classification number: G02B6/12007

Abstract: An optical device implemented on a substrate (such as silicon) is described. This optical device includes a wavelength-sensitive optical component with a high thermal resistance to a surrounding external environment and a low thermal resistance to a localized thermal-tuning mechanism (such as a heater), which modifies a temperature of the wavelength-sensitive optical component, thereby specifying an operating wavelength of the wavelength-sensitive optical component. In particular, the thermal resistance associated with a thermal dissipation path from the thermal-tuning mechanism to the external environment via the substrate is increased by removing a portion of the substrate to create a gap that is proximate to the thermal-tuning mechanism and the wavelength-sensitive optical component. Furthermore, the optical device includes a binder material mechanically coupled to the substrate and proximate to the gap, thereby maintaining a mechanical strength of the optical device.

Abstract translation: 描述了在衬底（例如硅）上实现的光学器件。 该光学器件包括对周围的外部环境具有高热阻的波长敏感的光学部件和对局部的热调谐机构（例如加热器）的低热阻，其改变了波长敏感光学部件的温度 从而指定波长敏感光学部件的工作波长。 特别地，通过去除衬底的一部分以产生靠近热调谐机构的间隙和波长的距离，与通过衬底从热调谐机构到外部环境的散热路径相关联的热阻增加 敏感光学部件。 此外，光学装置包括机械耦合到基板并且靠近间隙的粘合剂材料，从而保持光学装置的机械强度。

公开(公告)号：US20130015578A1

公开(公告)日：2013-01-17

申请号：US13182220

申请日：2011-07-13

Applicant: Hiren D. Thacker ,  John E. Cunningham ,  Ivan Shubin ,  Ashok V. Krishnamoorthy

Inventor： Hiren D. Thacker ,  John E. Cunningham ,  Ivan Shubin ,  Ashok V. Krishnamoorthy

IPC: H01L23/498 ,  H01L21/50 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13027 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/14183 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/481 ,  H01L2224/48227 ,  H01L2224/73103 ,  H01L2224/81138 ,  H01L2224/81899 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06593 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are aligned by positive features that are mechanically coupled to negative features recessed below the surfaces of adjacent semiconductor dies. Moreover, the chip package includes an interposer plate at approximately a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the interposer plate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as solder balls or spring connectors. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the interposer plate.

Abstract translation: 在芯片封装中，半导体管芯或芯片（被称为板堆叠）的垂直堆叠中的半导体管芯通过机械耦合到相邻半导体管芯的表面下方的负特性的正特性对准。 此外，芯片封装包括与板堆叠大致成直角的插入板，其沿着板堆的边缘电耦合到半导体管芯。 特别地，靠近插入板的表面（沿着板堆叠的堆叠方向）的电焊盘通过中间导电材料（例如焊料球）电耦合到靠近半导体管芯的边缘的焊盘， 弹簧连接器。 注意，芯片封装可以促进半导体管芯和插入板之间的信号的高带宽通信。

公开(公告)号：US20120213467A1

公开(公告)日：2012-08-23

申请号：US13032561

申请日：2011-02-22

Applicant: Hiren D. Thacker ,  Ivan Shubin ,  John E. Cunningham

Inventor： Hiren D. Thacker ,  Ivan Shubin ,  John E. Cunningham

IPC: G02B6/12 ,  B05D5/00

CPC classification number: G02B6/12007

Abstract: An optical device implemented on a substrate (such as silicon) is described. This optical device includes a wavelength-sensitive optical component with a high thermal resistance to a surrounding external environment and a low thermal resistance to a localized thermal-tuning mechanism (such as a heater), which modifies a temperature of the wavelength-sensitive optical component, thereby specifying an operating wavelength of the wavelength-sensitive optical component. In particular, the thermal resistance associated with a thermal dissipation path from the thermal-tuning mechanism to the external environment via the substrate is increased by removing a portion of the substrate to create a gap that is proximate to the thermal-tuning mechanism and the wavelength-sensitive optical component. Furthermore, the optical device includes a binder material mechanically coupled to the substrate and proximate to the gap, thereby maintaining a mechanical strength of the optical device.

Abstract translation: 描述了在衬底（例如硅）上实现的光学器件。 该光学器件包括对周围的外部环境具有高热阻的波长敏感的光学部件和对局部的热调谐机构（例如加热器）的低热阻，其改变了波长敏感光学部件的温度 从而指定波长敏感光学部件的工作波长。 特别地，通过去除衬底的一部分以产生靠近热调谐机构的间隙和波长的距离，与通过衬底从热调谐机构到外部环境的散热路径相关联的热阻增加 敏感光学部件。 此外，光学装置包括机械耦合到基板并且靠近间隙的粘合剂材料，从而保持光学装置的机械强度。

公开(公告)号：US08772920B2

公开(公告)日：2014-07-08

申请号：US13182220

申请日：2011-07-13

Applicant: Hiren D. Thacker ,  John E. Cunningham ,  Ivan Shubin ,  Ashok V. Krishnamoorthy

Inventor： Hiren D. Thacker ,  John E. Cunningham ,  Ivan Shubin ,  Ashok V. Krishnamoorthy

IPC: H01L23/02

CPC classification number: H01L25/0657 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13027 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/14183 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/481 ,  H01L2224/48227 ,  H01L2224/73103 ,  H01L2224/81138 ,  H01L2224/81899 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06593 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are aligned by positive features that are mechanically coupled to negative features recessed below the surfaces of adjacent semiconductor dies. Moreover, the chip package includes an interposer plate at approximately a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the interposer plate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as solder balls or spring connectors. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the interposer plate.

Abstract translation: 在芯片封装中，半导体管芯或芯片（被称为“板堆叠”）的垂直堆叠中的半导体管芯通过机械耦合到相邻半导体管芯的表面下方的负特性的正特征对准。 此外，芯片封装包括与板堆叠大致成直角的插入板，其沿着板堆的边缘电耦合到半导体管芯。 特别地，靠近插入板的表面（沿着板堆叠的堆叠方向）的电焊盘通过中间导电材料（例如焊料球）电耦合到靠近半导体管芯的边缘的焊盘， 弹簧连接器。 注意，芯片封装可以促进半导体管芯和插入板之间的信号的高带宽通信。

公开(公告)号：US08548287B2

公开(公告)日：2013-10-01

申请号：US13293624

申请日：2011-11-10

Applicant: Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

Inventor： Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

IPC: G02B6/12

CPC classification number: G02B6/26 ,  Y10T29/49826

Abstract: In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.

Abstract translation: 在MCM中，光信号由设置在第一基板的表面上的光波导传送到具有垂直面的光耦合器。 该光耦合器具有与光波导的光学模式不同的光学模式。 例如，与光耦合器相关联的光学模式的空间范围可能更大，从而减少光学损耗和对准误差的灵敏度。 然后，光信号从另一基板上的垂直面到同一光耦合器的面向垂直面直接耦合，并且光信号在设置在另一基板上的另一光波导中传送。

公开(公告)号：US20130207261A1

公开(公告)日：2013-08-15

申请号：US13397593

申请日：2012-02-15

Applicant: Hiren D. Thacker ,  Hyung Suk Yang ,  Ivan Shubin ,  John E. Cunningham

Inventor： Hiren D. Thacker ,  Hyung Suk Yang ,  Ivan Shubin ,  John E. Cunningham

IPC: H01L23/498 ,  H01L21/50 ,  H01L23/488

CPC classification number: H01L25/0652 ,  H01L23/48 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/91 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73201 ,  H01L2224/73251 ,  H01L2224/81138 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/81 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An MCM includes a two-dimensional array of facing chips, including island chips and bridge chips that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures are in cavities in a substrate, which house the bridge chips, provide a compressive force on back surfaces of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.

Abstract translation: MCM包括面向芯片的二维阵列，包括使用重叠连接器彼此通信的岛芯片和桥芯片。 为了保持这些连接器的相对垂直间隔，可压缩结构位于衬底中的空腔中，其容纳桥芯片，在桥芯片的后表面上提供压缩力。 这些可压缩结构包括具有形状和体积压缩的柔性材料。 以这种方式，MCM可以确保岛芯片和桥芯片的面对表面以及这些表面上的连接器在不弯曲桥接芯片的情况下大致共面。

公开(公告)号：US08648463B2

公开(公告)日：2014-02-11

申请号：US12781732

申请日：2010-05-17

Applicant: Hiren D. Thacker ,  Jing Shi ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

Inventor： Hiren D. Thacker ,  Jing Shi ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/02 ,  H01L23/34 ,  H01L21/00

CPC classification number: H01L23/13 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05571 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1319 ,  H01L2224/13541 ,  H01L2224/13561 ,  H01L2224/1357 ,  H01L2224/13578 ,  H01L2224/13611 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17517 ,  H01L2224/81141 ,  H01L2224/81211 ,  H01L2224/81815 ,  H01L2225/06531 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15787 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/206 ,  H01L2924/01028 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A multi-chip module (MCM) that includes at least two substrates, having facing surfaces, which are mechanically coupled by a set of coupling elements having a reflow characteristic, is described. One of the two substrates includes another set of coupling elements having another reflow characteristic, which is different than the reflow characteristic. These different reflow characteristics of the sets of coupling elements allow different temperature profiles to be used when bonding the two substrates to each other than when bonding the one of the two substrates to a carrier. For example, the temperature profiles may have different peak temperatures and/or different durations from one another. These reflow characteristics may facilitate low-cost, high-yield assembly and alignment of the substrates in the MCM, and may allow temperature-sensitive components to be included in the MCM.

Abstract translation: 描述了包括具有面对表面的至少两个基板的多芯片模块（MCM），其通过一组具有回流特性的耦合元件机械耦合。 两个基板中的一个包括另一组具有不同于回流特性的另外的回流特性的耦合元件。 耦合元件组的这些不同的回流特性允许在将两个基板彼此接合时使用不同的温度曲线，而不是将两个基板中的一个接合到载体上。 例如，温度分布可以具有不同的峰值温度和/或彼此不同的持续时间。 这些回流特性可以促进MCM中的基板的低成本，高产量组装和对准，并且可以允许将温度敏感组件包括在MCM中。

公开(公告)号：US09082808B2

公开(公告)日：2015-07-14

申请号：US13489401

申请日：2012-06-05

Applicant: Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

Inventor： Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

IPC: H01L23/48 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L24/72 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/26 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13009 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/72 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/12042 ,  H01L2924/37001 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/90 ,  H01L2924/00

Abstract: A chip package is described which includes a first chip having a first surface and first sides having a first side-wall angle, and a second chip having a second surface and second sides having a second side-wall angle, which faces and is mechanically coupled to the first chip. The chip package is fabricated using a batch process, and the chips in the chip package were singulated from their respective wafers after the chip package is assembled. This is accomplished by etching the first and second side-wall angles and thinning the wafer thicknesses prior to assembling the chip package. For example, the first and/or the second side walls can be fabricated using wet etching or dry etching. Therefore, the first and/or the second side-wall angles may be other than vertical or approximately vertical.

Abstract translation: 描述了一种芯片封装，其包括具有第一表面和第一侧面具有第一侧壁角度的第一芯片和具有第二表面和第二侧面的第二侧面的第二芯片，所述第二表面和第二侧面具有第二侧壁角度， 到第一个芯片。 使用间歇工艺制造芯片封装，并且在芯片封装组装之后，芯片封装中的芯片从它们各自的晶片分离。 这通过在组装芯片封装之前蚀刻第一和第二侧壁角度并使晶片厚度变薄来实现。 例如，可以使用湿蚀刻或干蚀刻来制造第一和/或第二侧壁。 因此，第一和/或第二侧壁角度可以不同于垂直或近似垂直。