公开(公告)号：US09053721B1

公开(公告)日：2015-06-09

申请号：US14292760

申请日：2014-05-30

Applicant: HGST Netherlands B.V.

Inventor： Yongchul Ahn ,  David P. Druist ,  Zheng Gao ,  Ying Hong ,  Yunhe Huang ,  Quang Le ,  Thomas L. Leong ,  Guangli Liu ,  Xiaoyong Liu ,  David J. Seagle

IPC: G11B5/39 ,  G11B5/33 ,  G11B5/127

CPC classification number: G11B5/398 ,  G11B5/3163 ,  G11B5/3909 ,  G11B5/3912 ,  G11B2005/3996

Abstract: A magnetic read sensor having a magnetic seed layer, a pinned layer structure formed over the magnetic seed layer, a non-magnetic barrier or spacer layer formed over the pinned layer structure and a magnetic free layer structure formed over the non-magnetic barrier or spacer layer. The pinned layer has a stripe height (measured from the media facing surface) that is greater than a stripe height of the magnetic free layer structure. In addition, the magnetic seed layer structure has a stripe height (also measured from the media facing surface) that is greater than the stripe height of the magnetic pinned layer structure and the magnetic free layer structure. The stripe height of the magnetic seed layer structure can be controlled independently of the stripe heights of the magnetic pinned layer structure and the magnetic free layer structure.

Abstract translation: 具有磁性种子层的磁性读取传感器，形成在磁性种子层上的钉扎层结构，形成在被钉扎层结构之上的非磁性阻挡层或间隔层以及形成在非磁性屏障或间隔物上的无磁性层结构 层。 被钉扎层具有大于无磁性层结构的条带高度的条带高度（从介质面向表面测量）。 此外，磁性种子层结构具有大于磁性被钉扎层结构和无磁性层结构的条带高度的条纹高度（也从介质面向表面测量）。 可以独立于磁性钉扎层结构和无磁性层结构的条带高度来控制磁性种子层结构的条纹高度。

公开(公告)号：US20140175048A1

公开(公告)日：2014-06-26

申请号：US13725479

申请日：2012-12-21

Applicant: HGST NETHERLANDS B.V.

Inventor： David P. Druist ,  Quang Le ,  Yang Li ,  David J. Seagle ,  Petrus A. Van Der Heijden

IPC: G11B5/31

CPC classification number: G11B5/3169 ,  G11B5/3166

Abstract: A method of manufacturing a magnetic sensor having a hard bias structure located at a back edge of the sensor. The method forms an electrical lapping guide that is compatible for use with such a sensor having a back edge hard bias structure and which can accurately determine a termination point for a lapping operation that forms an air bearing surface of the slider and determines the sensor stripe height.

Abstract translation: 一种制造具有位于传感器后缘的硬偏置结构的磁传感器的方法。 该方法形成电气研磨引导件，其与具有后缘硬偏置结构的这种传感器兼容使用，并且可以精确地确定形成滑块的空气轴承表面的研磨操作的终止点，并且确定传感器条带高度 。

公开(公告)号：US20160027459A1

公开(公告)日：2016-01-28

申请号：US14341701

申请日：2014-07-25

Applicant: HGST Netherlands B.V.

Inventor： Tuan M. Dinh ,  David P. Druist ,  David J. Seagle ,  Michael M.H. Yang

IPC: G11B5/48 ,  H01L27/02 ,  H01L21/285 ,  H01L21/02 ,  H01L49/02 ,  H01L21/311

CPC classification number: H01L28/60 ,  G11B5/102 ,  G11B5/6035 ,  G11B5/6082 ,  G11B5/6094 ,  H01L27/0288 ,  H01L28/20

Abstract: In one embodiment, a slider includes a substrate, a magnetic head, and a coupling capacitor. In one embodiment, a slider includes a substrate, a magnetic head, and a coupling capacitor configured to AC couple an electronics ground of the slider to the substrate and DC decouple the electronics ground of the slider from the substrate, the coupling capacitor including: a first conductive layer, a gap layer positioned above the first conductive layer, a dielectric layer positioned above the gap layer and the first conductive layer, and a second conductive layer positioned above the dielectric layer. In another embodiment, a method for forming a capacitor includes forming a substrate, forming a first conductive layer above the substrate, forming a gap layer above the first conductive layer, forming a dielectric layer above the gap layer and the first conductive layer, and forming a second conductive layer above the dielectric layer.

Abstract translation: 在一个实施例中，滑块包括基板，磁头和耦合电容器。 在一个实施例中，滑块包括衬底，磁头和耦合电容器，其被配置为将滑块的电子接地AC耦合到衬底，并且DC将滑块的电子接地与衬底分离，耦合电容器包括： 第一导电层，位于第一导电层上方的间隙层，位于间隙层上方的电介质层和第一导电层，以及位于介电层上方的第二导电层。 在另一个实施例中，形成电容器的方法包括：形成衬底，在衬底上形成第一导电层，在第一导电层之上形成间隙层，在间隙层和第一导电层之上形成电介质层，以及形成 介电层上方的第二导电层。

公开(公告)号：US08956200B2

公开(公告)日：2015-02-17

申请号：US13690685

申请日：2012-11-30

Applicant: HGST Netherlands B.V.

Inventor： David P. Druist ,  Glenn P. Gee ,  Unal M. Guruz ,  Edward H. Lee ,  David J. Seagle ,  Darrick T. Smith

IPC: B24B37/005 ,  B24B49/10 ,  G11B5/48

CPC classification number: G11B5/4853 ,  B24B37/005 ,  G11B5/3166 ,  G11B5/3169 ,  G11B5/3173

Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 μm, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.

Abstract translation: 本文描述的实施例通常涉及将电子研磨指南（ELG）连接到研磨控制器以减少来自当前拥挤的阻力，同时减少与ELG的连接。 器件和系统可以包括具有至少10μm的半径的周边接地通孔的晶片，具有磁阻（MR）元件的多个滑块; 通过晶片和接地焊盘的组合电耦合到研磨控制器的多个ELG和电耦合到ELG的焊盘。 ELG或接合焊盘可以位于切口或行的设备区域中。 如果ELG和焊盘位于分开的区域，则应使用贵金属连接。 此外，可以通过以特定间隔和特定尺寸的接地通孔来减少接地焊盘的数量。

公开(公告)号：US09275665B2

公开(公告)日：2016-03-01

申请号：US14341701

申请日：2014-07-25

Applicant: HGST Netherlands B.V.

Inventor： Tuan M. Dinh ,  David P. Druist ,  David J. Seagle ,  Michael M. H. Yang

IPC: G11B5/60 ,  G11B5/48 ,  H01L49/02 ,  H01L21/311 ,  H01L21/285 ,  H01L21/02 ,  H01L27/02

CPC classification number: H01L28/60 ,  G11B5/102 ,  G11B5/6035 ,  G11B5/6082 ,  G11B5/6094 ,  H01L27/0288 ,  H01L28/20

Abstract: In one embodiment, a slider includes a substrate, a magnetic head, and a coupling capacitor. In one embodiment, a slider includes a substrate, a magnetic head, and a coupling capacitor configured to AC couple an electronics ground of the slider to the substrate and DC decouple the electronics ground of the slider from the substrate, the coupling capacitor including: a first conductive layer, a gap layer positioned above the first conductive layer, a dielectric layer positioned above the gap layer and the first conductive layer, and a second conductive layer positioned above the dielectric layer. In another embodiment, a method for forming a capacitor includes forming a substrate, forming a first conductive layer above the substrate, forming a gap layer above the first conductive layer, forming a dielectric layer above the gap layer and the first conductive layer, and forming a second conductive layer above the dielectric layer.

Abstract translation: 在一个实施例中，滑块包括基板，磁头和耦合电容器。 在一个实施例中，滑块包括衬底，磁头和耦合电容器，其被配置为将滑块的电子接地AC耦合到衬底，并且DC将滑块的电子接地与衬底分离，耦合电容器包括： 第一导电层，位于第一导电层上方的间隙层，位于间隙层上方的电介质层和第一导电层，以及位于介电层上方的第二导电层。 在另一个实施例中，形成电容器的方法包括：形成衬底，在衬底上形成第一导电层，在第一导电层之上形成间隙层，在间隙层和第一导电层之上形成电介质层，以及形成 介电层上方的第二导电层。

公开(公告)号：US08956201B2

公开(公告)日：2015-02-17

申请号：US13690694

申请日：2012-11-30

Applicant: HGST Netherlands B.V.

Inventor： David P. Druist ,  Glenn P. Gee ,  Edward H. Lee ,  David J. Seagle ,  Darrick T. Smith

IPC: B24B49/10 ,  B24B37/013 ,  B24B37/005 ,  B24B7/22 ,  H01L23/00 ,  G11B5/00

CPC classification number: B24B37/005 ,  B24B7/228 ,  G11B5/00 ,  G11B5/3166 ,  G11B5/3169 ,  G11B5/3173 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/04042 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2924/3025 ,  H01L2924/00014

Abstract: Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time.

Abstract translation: 本文所描述的实施例通常涉及将电子研磨导轨（ELG）连接到研磨控制器以防止电流拥挤的影响，同时减少在单垫研磨中与ELG的连接。 设备和系统可以包括一排滑块，包括磁阻（MR）元件，连接到晶片和至少一个焊盘的多个高电阻ELG以及连接到晶片的至少两个外围接地通孔。 方法和系统包括包括多个滑块的晶片，其中每个滑块连接到研磨控制器，并且向ELG传递电流是与滑块组成顺序的，使得在任何时间只测量一组ELG。