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公开(公告)号:US11502478B2
公开(公告)日:2022-11-15
申请号:US16674918
申请日:2019-11-05
Applicant: Gigaphoton Inc.
Inventor: Hiroyuki Masuda , Osamu Wakabayashi
Abstract: A laser apparatus according to the present disclosure includes: a laser output unit configured to perform laser oscillation; and a control unit configured to acquire first laser performance data obtained when the laser output unit performs laser oscillation based on a first laser control parameter, and second laser performance data obtained when the laser output unit performs laser oscillation based on a second laser control parameter, while laser output from the laser output unit to an external device is stopped, and determine whether the second laser performance data has been improved as compared to the first laser performance data.
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公开(公告)号:US10164396B2
公开(公告)日:2018-12-25
申请号:US15720122
申请日:2017-09-29
Applicant: GIGAPHOTON INC.
Inventor: Akihiko Kurosu , Takashi Matsunaga , Hiroyuki Masuda , Osamu Wakabayashi , Hiroaki Tsushima , Masanori Yashiro , Takeshi Ohta
IPC: H01S3/036 , H01S3/097 , H01S3/0971 , H01S3/104 , H01S3/04 , H01S3/03 , H01S3/08 , H01S3/134 , H01S3/13 , H01S3/225 , H01S3/041
Abstract: There may be provided a laser unit including a display configured to display one or both of electric power consumed by the laser unit and electric energy consumed by the laser unit.
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公开(公告)号:US09825417B2
公开(公告)日:2017-11-21
申请号:US15144081
申请日:2016-05-02
Applicant: GIGAPHOTON INC.
Inventor: Akihiko Kurosu , Takashi Matsunaga , Hiroyuki Masuda , Osamu Wakabayashi , Hiroaki Tsushima , Masanori Yashiro , Takeshi Ohta
IPC: H01S3/036 , H01S3/097 , H01S3/0971 , H01S3/104 , H01S3/04 , H01S3/03 , H01S3/08 , H01S3/134 , H01S3/13 , H01S3/225 , H01S3/041
CPC classification number: H01S3/036 , H01S3/03 , H01S3/0404 , H01S3/0407 , H01S3/041 , H01S3/08009 , H01S3/08031 , H01S3/09702 , H01S3/0971 , H01S3/104 , H01S3/1306 , H01S3/134 , H01S3/2258
Abstract: There may be provided a laser unit including a display configured to display one or both of electric power consumed by the laser unit and electric energy consumed by the laser unit.
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公开(公告)号:US10971886B2
公开(公告)日:2021-04-06
申请号:US16266189
申请日:2019-02-04
Applicant: Gigaphoton Inc.
Inventor: Takeshi Asayama , Hiroyuki Masuda
IPC: H01S3/097 , H01S3/036 , H01S3/134 , H01S3/225 , H01S3/104 , H01S3/038 , H01S3/0971 , H01S3/10 , H01S3/08 , H01S3/23 , H01S3/00
Abstract: A laser apparatus includes a chamber accommodating a pair of discharge electrodes, a gas supply and exhaust device configured to supply laser gas to an interior of the chamber and exhaust laser gas from the interior of the chamber, and a controller. The controller performs first control to control the gas supply and exhaust device so as to suspend laser oscillation and replace laser gas in the chamber at every first number of pulses or first elapsed time, and second control to control the gas supply and exhaust device so as to suspend laser oscillation and replace laser gas in the chamber before the first control at every second number of pulses less than the first number of pulses or second elapsed time less than the first elapsed time.
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公开(公告)号:US09841684B2
公开(公告)日:2017-12-12
申请号:US14629282
申请日:2015-02-23
Applicant: GIGAPHOTON INC.
Inventor: Hiroshi Tanaka , Akihiko Kurosu , Hiroyuki Masuda , Hideyuki Ochiai , Osamu Wakabayashi , Masato Moriya
IPC: G03F7/20 , H01L21/268 , H01L21/67 , H01L21/66
CPC classification number: G03F7/70483 , G03F7/70041 , G03F7/70058 , G03F7/70358 , H01L21/268 , H01L21/67115 , H01L21/67253 , H01L22/10 , H01L22/26
Abstract: A light source apparatus according to an embodiment may be used for an exposure apparatus which exposes a plurality of wafers by repeating a wafer exposure for exposing a total exposure area of each wafer. The wafer exposure may include a sequential execution of scanning exposures in which each divided area defined by dividing the total exposure area of each wafer is scanned by pulsed light. The apparatus may comprise: a light source controller configured to execute a control for outputting the pulsed light based on a luminescence trigger signal received from the exposure apparatus; a detector configured to detect a characteristic of the pulsed light; and a data collection processor configured to collect at least a piece of data in data included in a pulse light data group related to the pulsed light detected by the detector and a control data group related to the control, and execute a mapping process of mapping the collected data by at least one of scanning exposure basis and wafer exposure basis.
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