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    SYSTEMS AND METHODS FOR HYBRID GLASS AND ORGANIC PACKAGING FOR RADIO FREQUENCY ELECTRONICS
    1.
    发明申请
    SYSTEMS AND METHODS FOR HYBRID GLASS AND ORGANIC PACKAGING FOR RADIO FREQUENCY ELECTRONICS 有权

    公开(公告)号：US20210204397A1

    公开(公告)日：2021-07-01

    申请号：US16730435

    申请日：2019-12-30

    Applicant: General Electric Company

    Inventor： Christopher James Kapusta ,  Stanton Earl Weaver, JR. ,  Joseph Alfred Iannotti

    IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46

    Abstract: An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.

    Oven Appliance
    2.
    发明申请
    Oven Appliance 审中-公开

    公开(公告)号：US20170130967A1

    公开(公告)日：2017-05-11

    申请号：US14933116

    申请日：2015-11-05

    Applicant: General Electric Company

    Inventor： Stanton Earl Weaver, JR. ,  Gary Dwayne Mandrusiak ,  Nandini Nagraj

    IPC: F24C15/20 ,  F24C15/18 ,  F24C15/32 ,  F24C15/00

    CPC classification number: F24C15/2007

    Abstract: The present subject matter provides an oven appliance with a fluid analysis assembly fluidly mounted to a duct. The fluid analysis assembly includes a casing and a sensor array. A fluid inlet of the casing extends between the duct and a dilution chamber of the casing. An ambient inlet of the casing is contiguous with ambient air about the casing and the dilution chamber. The sensor array includes a plurality of fluid sensors positioned at the dilution chamber of the casing.

    SYSTEM FOR COOLING DEVICES
    4.
    发明申请
    SYSTEM FOR COOLING DEVICES 有权
    冷却装置系统

    公开(公告)号：US20140240993A1

    公开(公告)日：2014-08-28

    申请号：US13779822

    申请日：2013-02-28

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Charles Erklin Seeley ,  Stanton Earl Weaver, JR. ,  Brian Magann Rush ,  Mark Howard Giammattei

    IPC: F21V29/00

    CPC classification number: F15D1/007 ,  F04B43/046 ,  F04B43/095 ,  F04B45/027 ,  F21V29/60 ,  F21V29/63 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A cooling system is provided. The cooling system includes an enclosure. The enclosure is defined by walls among which at least one is movable. The enclosure further includes at least one aperture on at least one wall. The system further includes an amplification element that is coupled with at least one walls of the enclosure. Further, the cooling system includes an actuation unit mechanically coupled with the amplification element. The actuation unit includes at least one actuation signal triggered actuator configured to cause a displacement the amplification element. In the cooling system, the amplification element is configured to amplify the actuator caused displacement through to the at least one wall of the enclosure such that fluid enters and exits the enclosure from the at least one aperture.

    Abstract translation: 提供冷却系统。 冷却系统包括一个外壳。 外壳由墙壁限定，其中至少一个是可移动的。 外壳还包括至少一个壁上的至少一个孔。 该系统还包括与外壳的至少一个壁耦合的放大元件。 此外，冷却系统包括与放大元件机械耦合的致动单元。 致动单元包括至少一个致动信号触发的致动器，其构造成使放大元件发生位移。 在冷却系统中，放大元件被配置为放大致动器，使得位移通过至壳体的至少一个壁，使得流体从至少一个孔进入和离开外壳。

    HEAT TRANSFER DEVICE AND AN ASSOCIATED METHOD OF FABRICATION
    7.
    发明申请
    HEAT TRANSFER DEVICE AND AN ASSOCIATED METHOD OF FABRICATION 审中-公开
    热传递装置和相关的制造方法

    公开(公告)号：US20150060021A1

    公开(公告)日：2015-03-05

    申请号：US14018579

    申请日：2013-09-05

    Applicant: General Electric Company

    Inventor： Shakti Singh Chauhan ,  William Harold King ,  Stanton Earl Weaver, JR. ,  Binoy Milan Shah ,  Tao Deng

    IPC: F28D15/04 ,  B21D53/02

    CPC classification number: F28D15/046 ,  B22F7/002 ,  B22F7/06 ,  B22F2999/00 ,  Y10T29/49353 ,  B22F3/02 ,  B22F2202/01

    Abstract: A heat transfer device includes a casing and a wick disposed within the casing. The wick includes a first sintered layer and a second sintered layer. The first sintered layer includes a plurality of first sintered particles, having a first porosity and a plurality of first pores. The first sintered layer is disposed proximate to an inner surface of the casing. The second sintered layer includes a plurality of second sintered particles, having a second porosity and a plurality of second pores. The second sintered layer is disposed on the first sintered layer. The heat transfer device includes at least one first sintered particle smaller than at least one second pore and the first porosity is smaller than the second porosity.

    Abstract translation: 传热装置包括壳体和设置在壳体内的芯。 芯包括第一烧结层和第二烧结层。 第一烧结层包括具有第一孔隙和多个第一孔的多个第一烧结颗粒。 第一烧结层设置在壳体的内表面附近。 第二烧结层包括具有第二孔隙率和多个第二孔隙的多个第二烧结颗粒。 第二烧结层设置在第一烧结层上。 传热装置包括至少一个小于至少一个第二孔的第一烧结颗粒，并且第一孔隙度小于第二孔隙率。

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