-
公开(公告)号：US20150116940A1
公开(公告)日：2015-04-30
申请号：US14068697
申请日：2013-10-31
Applicant: General Electric Company
Inventor： Joo Han Kim , Hendrik Pieter Jacobus de Bock , Jay Todd Labhart , Shakti Singh Chauhan , Graham Charles Kirk , Stuart Connolly
IPC: H05K1/02
CPC classification number: H05K1/0203 , H05K7/1461 , H05K7/20672 , Y10T29/49002
Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.
Abstract translation: 提供电路卡组件。 电路卡组件包括印刷电路板，安装在印刷电路板上的至少一个电子部件和耦合到印刷电路板的框架，使得电子部件设置在印刷电路板和框架之间。 电路卡组件还包括耦合到框架的传热装置。 传热装置具有至少部分地设置在框架和印刷电路板之间的热管。 电路卡组件还包括将热管朝向电子部件偏置的可枢转支架，以便于冷却电子部件。
-
公开(公告)号：US09615486B2
公开(公告)日：2017-04-04
申请号：US14225461
申请日：2014-03-26
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus De Bock , Jay Todd Labhart , Shakti Singh Chauhan , Graham Charles Kirk , Joo Han Kim
IPC: G06F1/16 , H05K5/00 , H05K7/00 , H05K7/20 , H01L23/42 , H01L23/427 , H01L23/433
CPC classification number: H05K7/2039 , H01L23/42 , H01L23/427 , H01L23/4275 , H01L23/433 , H01L2924/15311
Abstract: A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall, where the containment structure is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor disposed at least in a portion of the containment structure. Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device is a re-workable device.
-
公开(公告)号：US20150282380A1
公开(公告)日：2015-10-01
申请号：US14225461
申请日：2014-03-26
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus De Bock , Jay Todd Labhart , Shakti Singh Chauhan , Graham Charles Kirk , Joo Han Kim
IPC: H05K7/20
CPC classification number: H05K7/2039 , H01L23/42 , H01L23/427 , H01L23/4275 , H01L23/433 , H01L2924/15311
Abstract: A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall, where the containment structure is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor disposed at least in a portion of the containment structure. Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device is a re-workable device.
Abstract translation: 提供具有容纳结构和热导体的热接口装置。 此外，容纳结构包括至少一个壁，其中容纳结构构造成有助于热量的通过。 此外，热接口装置包括至少设置在容纳结构的一部分中的热导体。 此外，热导体构造成在固态和液态之间可逆地切换。 此外，热接口设备是可重新加工的设备。
-
Patent Agency Ranking
公开(公告)号：US20150181763A1
公开(公告)日：2015-06-25
申请号：US14135678
申请日：2013-12-20
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, JR. , Tao Deng , Jay Todd Labhart , Pramod Chamarthy , Shakti Singh Chauhan , Graham Charles Kirk , Brian Patrick Hoden
CPC classification number: B23P15/26 , B23P2700/09 , B23P2700/10 , F28D15/0266 , F28D15/0275 , H05K7/20681 , H05K9/0062 , Y10T29/49826
Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.
Abstract translation: 提供电子底盘。 电子机箱包括限定内部空间的多个面板。 所述多个面板中的一个面板具有具有内表面和外表面的复合区段。 电子底盘还包括导电热路径，其从复合段的内表面延伸穿过面板到复合段的外表面。
-
公开(公告)号：US20150168087A1
公开(公告)日：2015-06-18
申请号：US14103868
申请日：2013-12-12
Applicant: General Electric Company
Inventor： Joo Han Kim , Graham Charles Kirk , Jay Todd Labhart , Binoy Milan Shah , Yogen Vishwas Utturkar , Pramod Charmarthy , Tao Deng
CPC classification number: H05K7/20454 , C09K5/063 , F28F21/08 , H01L23/4275 , H01L2924/0002 , H05K1/0203 , H05K7/20672 , H01L2924/00
Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.
Abstract translation: 提供了具有金属基泡沫和易熔金属基合金的可重复使用的相变热界面结构。 在可熔金属基合金的固相中，可熔金属基合金至少设置在金属基泡沫的一部分中。 此外，在可熔金属基合金的液相中，可熔融金属基合金至少设置在金属基泡沫的一个或多个外表面的一部分上。
-
公开(公告)号：US09826662B2
公开(公告)日：2017-11-21
申请号：US14103868
申请日：2013-12-12
Applicant: General Electric Company
Inventor： Joo Han Kim , Graham Charles Kirk , Jay Todd Labhart , Binoy Milan Shah , Yogen Vishwas Utturkar , Pramod Charmarthy , Tao Deng
IPC: H05K7/20 , F28F21/08 , C09K5/06 , H01L23/427 , H05K1/02
CPC classification number: H05K7/20454 , C09K5/063 , F28F21/08 , H01L23/4275 , H01L2924/0002 , H05K1/0203 , H05K7/20672 , H01L2924/00
Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.
-
公开(公告)号：US09333599B2
公开(公告)日：2016-05-10
申请号：US14135678
申请日：2013-12-20
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, Jr. , Tao Deng , Jay Todd Labhart , Pramod Chamarthy , Shakti Singh Chauhan , Graham Charles Kirk , Brian Patrick Hoden
CPC classification number: B23P15/26 , B23P2700/09 , B23P2700/10 , F28D15/0266 , F28D15/0275 , H05K7/20681 , H05K9/0062 , Y10T29/49826
Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.
Abstract translation: 提供电子底盘。 电子机箱包括限定内部空间的多个面板。 所述多个面板中的一个面板具有具有内表面和外表面的复合区段。 电子底盘还包括导电热路径，其从复合段的内表面延伸穿过面板到复合段的外表面。
-
公开(公告)号：US09253871B2
公开(公告)日：2016-02-02
申请号：US14068697
申请日：2013-10-31
Applicant: General Electric Company
Inventor： Joo Han Kim , Hendrik Pieter Jacobus de Bock , Jay Todd Labhart , Shakti Singh Chauhan , Graham Charles Kirk , Stuart Connolly
CPC classification number: H05K1/0203 , H05K7/1461 , H05K7/20672 , Y10T29/49002
Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.
Abstract translation: 提供电路卡组件。 电路卡组件包括印刷电路板，安装在印刷电路板上的至少一个电子部件和耦合到印刷电路板的框架，使得电子部件设置在印刷电路板和框架之间。 电路卡组件还包括耦合到框架的传热装置。 传热装置具有至少部分地设置在框架和印刷电路板之间的热管。 电路卡组件还包括将热管朝向电子部件偏置的可枢转支架，以便于冷却电子部件。
-
-
-
-
-
-
-
Search Results
8
records
(took 0.013 seconds)
