公开(公告)号：US10084153B2

公开(公告)日：2018-09-25

申请号：US15191258

申请日：2016-06-23

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Naoaki Mihara ,  Yasushi Ishizaka ,  Tetsuya Mieda

IPC: H01L51/00 ,  H01L51/52 ,  C08K5/057 ,  C08K3/36 ,  C08K5/56 ,  C08L23/22

CPC classification number: H01L51/5253 ,  C08K3/36 ,  C08K5/057 ,  C08K5/56 ,  C08L23/22 ,  H01L51/0001 ,  H01L51/004 ,  H01L51/0077 ,  H01L51/0081 ,  H01L2251/5369 ,  C08L57/02 ,  C08K3/34

Abstract: A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a organometallic compound and a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 20,000, and an iodine value less than 40 g/100 g, and having no polar group, wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon being heated at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.

公开(公告)号：US10043996B2

公开(公告)日：2018-08-07

申请号：US14868088

申请日：2015-09-28

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masami Aoyama ,  Tetsuya Mieda ,  Keiji Saito ,  Kunihiko Ishiguro ,  Toshimitsu Nakamura ,  Naoaki Mihara ,  Takumi Asanuma

IPC: H01L51/52 ,  H01L51/00 ,  C08L65/00

Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.

公开(公告)号：US10556974B2

公开(公告)日：2020-02-11

申请号：US15663371

申请日：2017-07-28

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Tetsuya Mieda ,  Takumi Asanuma ,  Yasushi Ishizaka

IPC: C07F5/06 ,  C07F7/00 ,  C08F20/06 ,  C08F20/18 ,  C08F2/48

Abstract: A curable and hygroscopic resin composition for sealing electronic devices, having at least a (meth)acrylate oligomer (a) having the number-average molecular weight of 1,500 to 5,000, a low molecular weight (meth)acrylate (b) having an average molecular weight of 170 to 500, a moisture-reactive organometallic compound (c), and a polymerization initiator (d), wherein the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b) are multifunctional (meth)acrylates in which the number of (meth)acryloyl groups is from 1.5 to 3 in one molecule of each of the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b); a sealing resin; and an electronic device.

公开(公告)号：US10196534B2

公开(公告)日：2019-02-05

申请号：US15248041

申请日：2016-08-26

Applicant: Furukawa Electric Co., Ltd.

Inventor： Takumi Asanuma ,  Masami Aoyama ,  Yasushi Ishizaka ,  Tetsuya Mieda

IPC: H01L31/042 ,  H02N6/00 ,  C09D115/00 ,  C08F2/44 ,  H01L31/048 ,  C08F2/48 ,  H01L51/10 ,  H01L51/44 ,  C08F290/04 ,  C09K3/10 ,  C09D123/20 ,  C09D123/22 ,  C09D157/02 ,  H01L23/29 ,  H01L51/52 ,  C09D7/63 ,  C08K5/07

Abstract: A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C═C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.

公开(公告)号：US11990253B2

公开(公告)日：2024-05-21

申请号：US17599166

申请日：2020-03-30

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Tetsuya Mieda ,  Takahiro Kanaya

IPC: H01B9/04 ,  B29C48/00 ,  B29C48/08 ,  B29C48/88 ,  B32B15/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  C08J5/18 ,  C08L23/04 ,  H01B3/44 ,  H01B13/14 ,  B29L7/00

CPC classification number: H01B3/441 ,  B29C48/0022 ,  B29C48/022 ,  B29C48/08 ,  B29C48/9135 ,  B32B15/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  C08J5/18 ,  C08L23/04 ,  H01B9/04 ,  H01B13/14 ,  B29K2023/06 ,  B29K2995/0007 ,  B29L2007/007 ,  B32B2264/108 ,  B32B2307/206 ,  B32B2307/732 ,  B32B2457/00 ,  C08J2323/04 ,  C08J2423/26 ,  C08L2203/202 ,  C08L2205/02

Abstract: An insulating resin composition includes at least a base resin, and an antioxidant. The base resin includes a polyolefin resin modified with a polar group-containing molecule and an unmodified polyolefin resin. The polar group-containing molecule is at least one selected from an unsaturated dicarboxylic acid, an unsaturated dicarboxylic acid anhydride, and an unsaturated dicarboxylic acid anhydride derivative. The base resin has a sea-island structure including a first phase having the unmodified polyolefin resin and a second phase provided in the first phase and having the modified polyolefin resin. The second phase has an average diameter of 2 μm or less.

公开(公告)号：US11139449B2

公开(公告)日：2021-10-05

申请号：US15280198

申请日：2016-09-29

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Tetsuya Mieda ,  Kunihiko Ishiguro

IPC: H01L51/52 ,  C08L23/22 ,  C08L53/02 ,  C08L45/00 ,  C08L9/02 ,  C08L9/06 ,  C09D109/02 ,  C09D109/06 ,  C09D123/22 ,  H01L51/00

Abstract: A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus.

公开(公告)号：US10829669B2

公开(公告)日：2020-11-10

申请号：US15875391

申请日：2018-01-19

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Tetsuya Mieda ,  Takumi Asanuma ,  Yasushi Ishizaka

IPC: C09J11/06 ,  C09J163/00 ,  C09J171/02 ,  C09J145/00 ,  H01L51/52 ,  C08K5/55 ,  C09D163/00 ,  H01L51/44 ,  H01L23/31 ,  C08K5/057 ,  H01L51/00 ,  C08K3/24

Abstract: A curable and hygroscopic resin composition for sealing electronic devices, comprising: a cationically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a cationic polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.

公开(公告)号：US10115904B2

公开(公告)日：2018-10-30

申请号：US14857335

申请日：2015-09-17

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Kunihiko Ishiguro ,  Tetsuya Mieda

IPC: C08L53/00 ,  H01L51/00 ,  C08K5/00 ,  C08K5/098 ,  H01L27/32 ,  H01L51/52

Abstract: A transparent resin composition for organic EL element sealing and other things having a sufficient moisture blocking effect and excellent flexibility is provided. A thermoplastic resin, a tackifying resin, and an organometallic compound having at least an ester bond and represented by the following formula are included, and in which the light transmittance for light is 85% or higher, the relationship: AM/Y

公开(公告)号：US09913324B2

公开(公告)日：2018-03-06

申请号：US14566961

申请日：2014-12-11

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Naoaki Mihara ,  Kunihiko Ishiguro ,  Toshimitsu Nakamura ,  Tetsuya Mieda

IPC: B32B27/36 ,  H05B33/00 ,  H05B33/04 ,  C08J5/18 ,  C08G59/72 ,  C08L67/02 ,  C08G59/24 ,  H01L51/52

CPC classification number: H05B33/04 ,  B32B27/36 ,  C08G59/24 ,  C08G59/72 ,  C08J5/18 ,  C08L67/02 ,  H01L51/5253 ,  Y10T428/31511 ,  C08L63/00

Abstract: A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.

公开(公告)号：US10988646B2

公开(公告)日：2021-04-27

申请号：US16008675

申请日：2018-06-14

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Tetsuya Mieda ,  Takumi Asanuma ,  Yasushi Ishizaka

IPC: C09J163/00 ,  C09J5/00 ,  C08G59/22 ,  C08G59/68 ,  B32B27/38 ,  C08F2/48 ,  C08G59/42 ,  C08L71/02 ,  C09J133/08 ,  C09J133/10

Abstract: An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same: wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.