Invention Grant
- Patent Title: Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same
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Application No.: US16008675Application Date: 2018-06-14
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Publication No.: US10988646B2Publication Date: 2021-04-27
- Inventor: Tetsuya Mieda , Takumi Asanuma , Yasushi Ishizaka
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2015-247963 20151218
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C09J5/00 ; C08G59/22 ; C08G59/68 ; B32B27/38 ; C08F2/48 ; C08G59/42 ; C08L71/02 ; C09J133/08 ; C09J133/10

Abstract:
An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same: wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.
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