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公开(公告)号：US20180305563A1
公开(公告)日：2018-10-25
申请号：US15954484
申请日：2018-04-16
Inventor： Ji-Young OH , Rae-Man PARK , Kyung Hyun KIM , Hyun Woo DANG , Yong Suk YANG , Kyu Sung LEE
IPC: C09D5/24 , C09D101/02 , C09D129/04 , C09D133/02 , C09D127/16 , C09D7/61 , H05K1/09 , H05K3/12 , H01B1/22
CPC classification number: C09D5/24 , C09D7/61 , C09D101/02 , C09D127/16 , C09D129/04 , C09D133/02 , H01B1/22 , H05K1/028 , H05K1/095 , H05K3/1258 , H05K3/1283 , H05K3/38 , H05K2201/0129 , H05K2201/0221 , H05K2203/0522 , H05K2203/0545
Abstract: Provided are a liquid metal mixture, and a method of forming a conductive pattern using the same. The liquid metal mixture includes a polymer powder of about 10 to about 90 wt %, and a liquid metal included in an amount of about 10 to about 90 wt % and covering surfaces of particles of the polymer powder, wherein the polymer powder has a polar functional group. The method includes preparing a liquid metal mixture, forming a first pattern on a substrate with the liquid metal mixture, and forming a second pattern by pressing or heating the first pattern.
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公开(公告)号：US20180162050A1
公开(公告)日：2018-06-14
申请号：US15787195
申请日：2017-10-18
Inventor： Ji-Young OH , Yong Suk YANG , Kyung Hyun KIM , Kyu Sung LEE
IPC: B29C64/209 , B29C64/171 , B29C64/165 , B29C64/241
CPC classification number: B29C64/209 , B29C64/106 , B29C64/159 , B29C64/165 , B29C64/171 , B29C64/236 , B29C64/241 , B29C64/321 , B33Y10/00 , B33Y30/00
Abstract: Disclosed are a system for and a method of manufacturing a three-dimensional (3D) structure. The method may include injecting a fluid with a first pressure toward a surface of a first output layer to form a softening layer in the first output layer, injecting the fluid with a second pressure toward the softening layer to form an uneven structure in the softening layer, the second pressure being higher than the first pressure, and forming a second output layer on the softening layer with the uneven structure.
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3.发明申请NOBLE METAL MATERIAL FOR 3-DIMENSIONAL PRINTING, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR 3-DIMENSIONAL PRINTING USING THE SAME 审中-公开用于三维印刷的金属材料及其制造方法和使用其的三维印刷方法公开(公告)号：US20160298213A1
公开(公告)日：2016-10-13
申请号：US15094604
申请日：2016-04-08
Inventor： Yong Suk YANG , Hong Hyun SHIN , In-Kyu YOU , Sunghoon HONG
CPC classification number: C22C5/02 , B22D21/005 , B22D23/00 , B22D23/003 , B22F3/1055 , B22F3/115 , B22F3/20 , B33Y10/00 , B33Y70/00 , C04B35/26 , C04B35/45 , C04B35/653 , C04B2235/6021 , C04B2235/6026 , C04B2235/6565 , C22C1/02 , C22C1/0466 , Y02P10/295
Abstract: Provided is a noble metal material for 3D printing, the noble metal material including an alloy that contains gold (Au) and a first metal that is different from the gold, wherein the alloy contains about 50 wt % to about 100 wt % of the gold and contains more than about 0 wt % and at most about 50 wt % of the first metal, and the melting point of the alloy is at most 400° C.
Abstract translation: 提供了一种用于3D印刷的贵金属材料，该贵金属材料包括含有金（Au）和不同于金的第一金属的合金，其中该合金含有约50wt％至约100wt％的金 并且包含大于约0重量％且至多约50重量％的第一金属，并且合金的熔点为至多400℃。
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4.发明申请公开(公告)号：US20150109719A1
公开(公告)日：2015-04-23
申请号：US14264497
申请日：2014-04-29
Inventor： Ho-Gyeong YUN , In-Kyu YOU , Yong Suk YANG , Sunghoon HONG
Abstract: Provided is a method of forming a graphene electrode including providing a solution including graphenes on a substrate, pressing a mold having a pattern onto the substrate to fill up the solution in the pattern of the mold, applying a temperature and a pressure to the mold so that the graphenes are arranged in a vertical direction with respect to a surface of the substrate, removing the solution, and separating the mold from the substrate to form an electrode including the graphenes on the substrate.
Abstract translation: 提供了一种形成石墨烯电极的方法，其包括在基板上提供包括石墨烯的溶液，将具有图案的模具压在基板上以将模具填充到模具的图案中，向模具施加温度和压力， 所述石墨烯相对于所述基板的表面在垂直方向上排列，去除所述溶液，并且将所述模具与所述基板分离以形成包括所述基板上的所述石墨烯的电极。
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公开(公告)号：US20210064952A1
公开(公告)日：2021-03-04
申请号：US16926630
申请日：2020-07-10
Inventor： Yong Suk YANG , Sunghoon HONG , Woo Seok YANG
IPC: G06K19/077 , H01Q1/22 , H05K1/16 , G06K7/10
Abstract: Provided are a radio frequency identification tag and a method of manufacturing the same. The radio frequency identification tag includes a substrate, an antenna unit provided on the substrate and configured to transmit and receive signals, an integrated circuit unit spaced apart from the antenna unit on the substrate, and an interrupter and a delay circuit unit connected in parallel between the antenna unit and the integrated circuit unit, wherein the interrupter includes a variable portion and a fixed portion opposite the variable portion, wherein the delay circuit unit includes a capacitor and a resistor.
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Patent Agency Ranking
公开(公告)号：US20180053604A1
公开(公告)日：2018-02-22
申请号：US15633071
申请日：2017-06-26
Inventor： In Gyoo KIM , In-Kyu YOU , Bit Na KIM , Ji Hwan SUL , Yong Suk YANG , Seok Hun KANG , Sunghoon HONG
CPC classification number: H01G11/30 , C01B32/198 , C02F1/46109 , C02F2001/46128 , C02F2001/46138 , C25B11/0478 , H01B1/04 , H01B1/22 , H01G11/28 , H01G11/86
Abstract: Disclosed are an apparatus for manufacturing electrodes and a method of manufacturing electrodes. The method of manufacturing electrodes includes providing a metal substrate having first and second surfaces opposite to each other, performing a patterning process on the first surface of the metal substrate, coating an electrode material on the first surface of the metal substrate, after the patterning process, and irradiating the electrode material, which is coated on the metal substrate, with light. The patterning process includes forming a plurality of holes to penetrate the metal substrate or forming a plurality of grooves to have a shape recessed from the first surface toward the second surface.
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公开(公告)号：US20150303002A1
公开(公告)日：2015-10-22
申请号：US14467506
申请日：2014-08-25
Inventor： Ho-Gyeong YUN , In-Kyu YOU , Yong Suk YANG , Sunghoon HONG
CPC classification number: H01G11/52 , H01G9/0029 , H01G9/02 , H01G9/04 , H01G11/24 , H01G11/84 , Y02E60/13
Abstract: Provided is a method for manufacturing a capacitor. The method includes forming a separator on a first electrode, forming a second electrode on the separator, and filling pores with an electrolyte, wherein the separator includes patterns and pores defined by the patterns, and the patterns formed by directly applying an ink to the first electrode through a printing process.
Abstract translation: 提供一种制造电容器的方法。 该方法包括在第一电极上形成隔板，在隔膜上形成第二电极，并用电解质填充孔，其中隔板包括由图案限定的图案和孔，以及通过直接将墨水直接涂于第一 电极通过印刷过程。
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公开(公告)号：US20170312849A1
公开(公告)日：2017-11-02
申请号：US15583155
申请日：2017-05-01
Inventor： Yong Suk YANG , hong hyun SHIN , Bonjin KOO , In-Kyu YOU , sunghoon HONG
CPC classification number: B23K13/01 , B22F3/008 , B22F2999/00 , B23K37/06 , B28B1/001 , B29C48/00 , B29C48/15 , B29C64/209 , B33Y30/00 , B33Y40/00 , B33Y70/00 , H05B6/14 , H05B6/44 , B22F3/20 , B22F3/003
Abstract: An extruder for a metal material includes a cylinder having a receiving space in which a solid metal material is provided, a nozzle extending from a lower end of the cylinder, an upper coil provided on an outer surface of the cylinder and melting the solid metal material to form a liquid metal material, and a first lower coil provided on an outer surface of the nozzle to control an extruded shape of the liquid metal material.
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9.发明申请ACTIVE CLICHE FOR LARGE-AREA PRINTING, MANUFACTURING METHOD OF THE SAME, AND PRINTING METHOD USING THE SAME 有权用于大面积打印的主动夹层及其制造方法及使用其的印刷方法公开(公告)号：US20150273833A1
公开(公告)日：2015-10-01
申请号：US14738047
申请日：2015-06-12
Inventor： Yong Suk YANG , In-Kyu YOU , Soon-Won JUNG , Bock Soon NA , Seok-Hwan MOON
IPC: B41J2/16
CPC classification number: B41J2/1626 , B41J2/06 , B41J2/14 , B41J2/16 , B41J2/162 , B41J2/1621 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/1642 , B41J2/1646 , B41J2202/04
Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.
Abstract translation: 提供了一种大面积纳米级活性印刷装置及其制造方法，以及使用其的印刷方法。 打印装置可以包括基板，沿着第一方向延伸的第一互连线，在基板上，设置在第一互连线上的具有部分地暴露第一互连线的孔的层间电介质层，邻近孔的第二互连线 所述层间电介质层与所述第一互连线交叉，以及设置在与所述第一和第二互连线交叉并与所述第一互连线连接的楔形电极。 楔形电极在孔的中心向上突出。
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10.发明申请公开(公告)号：US20140076610A1
公开(公告)日：2014-03-20
申请号：US13934635
申请日：2013-07-03
Inventor： Yong Suk YANG , In-Kyu You , Minseok Kim , Soon-Won Jung , Bock Soon Na , Sang Chul Lim
CPC classification number: H05K1/02 , H01L51/0022 , H01L51/003 , H01L51/102 , H01L51/441 , H01L51/5203 , H05K1/0393 , H05K3/0058 , H05K3/207 , H05K2201/0376
Abstract: Disclosed are a method for manufacturing a planarizing printed electronic device and a planarizing printed electronic device manufactured by using the same by simply implementing a large-area embedded printed electronic device by coupling a printing process such as inkjet printing and gravure printing and a transferring process using a laminating device and particularly, solving defects due to large surface roughness and a thickness of a printed layer included in the printed electronic device, when manufacturing an embedded printed electronic device where a printed layer is embedded in a substrate.
Abstract translation: 公开了一种制造平面印刷电子器件的方法和通过使用它们简单地实现大面积嵌入式印刷电子器件而制造的平面化印刷电子器件，其通过联接诸如喷墨印刷和凹版印刷的印刷工艺和使用 层压装置，特别是在制造嵌入印刷电子器件时，其中印刷层嵌入基板中，特别是解决了印刷电子器件中包括的印刷层的大的表面粗糙度和厚度的缺陷。
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