Abstract:
The present invention provides a lubricant container inside a microelectromechanical device package. The lubricant container contains selected lubricant that evaporates from the container and contact to a surface of the microelectromechanical device for lubricating the surface.
Abstract:
The present invention provides a lubricant container inside a microelectromechanical device package. The lubricant container contains selected lubricant that evaporates from the container and contact to a surface of the microelectromechanical device for lubricating the surface.
Abstract:
Lubricants for lubricating surfaces of microelectromechanical devices are disclosed. Specifically, the lubricants can be applied to the contacting surfaces of the microelectromechanical devices so as to remove stiction of the contacting surfaces.
Abstract:
The present invention provides a lubricant container inside a microelectromechanical device package. The lubricant container contains selected lubricant that evaporates from the container and contact to a surface of the microelectromechanical device for lubricating the surface.
Abstract:
The present invention provides a lubricant container inside a microelectromechanical device package. The lubricant container contains selected lubricant that evaporates from the container and contact to a surface of the microelectromechanical device for lubricating the surface.
Abstract:
A method for altering surfaces of a microstructure is disclosed. The modification comprises cleaning the surfaces using an ozone-containing cleaning agent. The modification may also comprise coating the surfaces of the microstructure using a vapor phase coating agent that reacts chemically with the surface. The modification may also comprise coating the surfaces of the microstructure using a lubricant that interacts physically with the surface. The modification can be performed after removal of sacrificial materials of the microstructure during the fabrication process. In particular, the modification method is applicable during the packaging stage for the microstructure.
Abstract:
For processing call center data, an access module receives call system data for a plurality of users. The access module further receives customer relationship management (CRM) data and receives user data for the plurality of users. A display module displays the call system data, the CRM data, and the user data in a temporal relationship for a first user as dashboard data.
Abstract:
A dispensing cap for a container includes a body portion and an integrally formed chamber for holding an additive substance. The body portion includes a closed top end and an inner wall that defines the chamber whose open end is sealed by a chamber closure member. The closed top end includes a diaphragm and a plunger extends axially from the diaphragm within the chamber for unsealing the chamber closure member. The body portion, the closed top end, the plunger, and the inner wall are integrally formed in one-piece.
Abstract:
A method of finding an unknown value from within a range of values is disclosed that divides the range into weighted subranges and then, beginning with an arbitrary search value within the range, performs a number of simple comparisons to determine the value for each subrange that will result in a match with the target value. This method can also detect those cases where the target value lies outside the range. In one embodiment, the method of finding an unknown value within a range of values is applied to impedance matching. In this embodiment, the output impedance of a pin on an integrated circuit is automatically matched to the impedance of the load connected to it. The output driver has a controllable impedance that can be adjusted within a specific range of impedances to match the external load impedance it is to drive.
Abstract:
An SRAM memory cell is provided having a pair of cross-coupled CMOS inverters. The sources of the pull-up transistors forming each of the CMOS inverters are coupled to VCC through parasitic resistance of the substrate in which each is formed. The source of the p-type pull-up transistor is therefore always at a potential less than or equal to the potential of the N-well such that the emitter-base junction of the parasitic PNP transistor cannot become forward biased and latch-up cannot occur.