公开(公告)号：US4084406A

公开(公告)日：1978-04-18

申请号：US651386

申请日：1976-01-22

申请人： Daniel A. Brenneman

发明人： Daniel A. Brenneman

IPC分类号： F04D27/02 ,  F25B1/053 ,  F25B31/00 ,  F25B49/02 ,  H02H3/353 ,  H02H7/08 ,  H02H7/09 ,  H02H11/00 ,  H02K17/30 ,  H02P1/28 ,  H02P1/26 ,  F25B49/00

CPC分类号： H02H7/0833 ,  F04D27/0284 ,  F25B31/006 ,  F25B49/025 ,  H02H11/004 ,  H02H3/353 ,  H02H7/09 ,  H02K17/30 ,  H02P1/28 ,  F25B1/053 ,  F25B2600/021 ,  Y02B30/741

摘要： A solid state starter for a chiller compressor motor mounts directly on the compressor motor and comprises a bank of SCR's which are controllably switched to conduct current to the motor for starting and running. Electronic control modules are provided including a trigger module for triggering the SCR's, a current module (including current overload protection) for controlling the trigger module so that motor current is controllably delivered to the motor, and a voltage safety module for protecting against electrical faults. The SCR's are cooled by liquid refrigerant.

摘要翻译： 用于冷却器压缩机电动机的固态起动器直接安装在压缩机电动机上，并且包括可控地切换以将电流传导到电动机以启动和运行的SCR组。 提供电子控制模块，包括用于触发SCR的触发模块，用于控制触发模块的电流模块（包括电流过载保护），使得电动机电流可控地传递到电动机;以及电压安全模块，用于防止电气故障。 SCR由液体制冷剂冷却。

公开(公告)号：US4329701A

公开(公告)日：1982-05-11

申请号：US888116

申请日：1978-03-20

申请人： Daniel A. Brenneman

发明人： Daniel A. Brenneman

IPC分类号： H01L23/051 ,  H01L29/34 ,  H01L23/02 ,  H01L23/28

CPC分类号： H01L23/051 ,  H01L2924/0002

摘要： An improved semiconductor package is disclosed wherein a semiconductor wafer assembly includes first and second generally planar surfaces having respective first and second membrane members in overlying relationship thereto. Encompassing the periphery of the wafer assembly is a mass of retaining material, such as epoxy resin, which may overlie outer edge portions of the wafer assembly and sealingly engage the first and second membrane members. In a preferred embodiment, the semiconductor wafer assembly comprises a thyristor having a gate associated therewith having conductor means attached thereto which are embedded in a suitable layer of adhesive material which is disposed between the wafer assembly and the mass of retaining material. Another feature of the invention includes the provision of a temperature sensing element, such as a thermistor, which is disposed in intimate heat exchange relationship to the wafer assembly so as to accurately sense its operating temperature. In order to provide such heat exchange relationship, the element is preferably disposed between one of the planar surfaces of the wafer assembly and its associated membrane member, which is made to conform at least partially to the outer surface of the temperature sensing element. The element is also embedded in the aforementioned layer of adhesive material and includes signal conductor means which pass through said layer and the mass of retaining material.

摘要翻译： 公开了一种改进的半导体封装，其中半导体晶片组件包括第一和第二大体上平坦的表面，其具有与其相重叠的相应的第一和第二膜构件。 包围晶片组件的周边是保留材料（例如环氧树脂）的质量，其可覆盖在晶片组件的外边缘部分并且密封地接合第一和第二膜部件。 在优选实施例中，半导体晶片组件包括晶闸管，其具有与其相关联的栅极，其具有连接到其上的导体装置，其嵌入合适的粘合材料层中，所述粘合材料层设置在晶片组件和保持材料块之间。 本发明的另一特征包括提供温度感测元件，例如热敏电阻，其与晶片组件以紧密的热交换关系设置，以便精确地感测其工作温度。 为了提供这种热交换关系，该元件优选地设置在晶片组件的一个平面表面和其相关联的膜构件之间，该膜构件至少部分地与温度感测元件的外表面相一致。 该元件也嵌入在上述粘合材料层中，并且包括通过所述层和保持材料块的信号导体装置。