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公开(公告)号：US11926917B2
公开(公告)日：2024-03-12
申请号：US17790545
申请日：2020-06-10
发明人： Yukiya Kato , Hirotaka Kotani , Tatsuhiro Doi , Takao Tomiya , Hiroto Narieda
摘要： There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.
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公开(公告)号：US20140083671A1
公开(公告)日：2014-03-27
申请号：US14036551
申请日：2013-09-25
发明人： Satoru Ideguchi , Hideyo Osanai , Hirotaka Kotani
IPC分类号： F28F21/08
CPC分类号： F28F21/08 , H01L21/4871 , H01L21/4882 , H01L23/367 , H01L23/3672 , H01L23/3677 , H01L23/3733 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.
摘要翻译： 金属材料的散热板10包括平板部分10a，从平板部分的一个主表面突出并与平板部分一体化的多个柱状突出部分10b，以及加强板部件 12，其具有比平板部分和柱状突出部分更高的熔点，并且布置在布置在平板部分中并且靠近平板的一个主表面的区域中 所述加强构件穿过所述平板部分，以在大致平行于所述平板部分的一个主表面的方向延伸并且具有暴露于外部的端面，除了所述端面之外的加强构件的整个表面被接合 直接到平板部分。
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公开(公告)号：US11162745B2
公开(公告)日：2021-11-02
申请号：US16666798
申请日：2019-10-29
发明人： Satoru Ideguchi , Hideyo Osanai , Hirotaka Kotani
IPC分类号： F28F21/08 , H01L23/367 , H01L21/48 , H01L23/373
摘要： A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.
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公开(公告)号：US10829862B2
公开(公告)日：2020-11-10
申请号：US15122568
申请日：2015-02-25
发明人： Tatsunori Murata , Hirotaka Kotani , Hideki Endo , Akira Sugawara , Yuta Sonoda , Tetsuo Kato , Hideki Ohsumi , Jyun Toyoizumi
IPC分类号： C25D5/50 , B32B15/01 , C25D5/34 , C25D5/12 , C25D7/00 , C25D3/12 , C25D3/32 , C25D3/38 , C25F1/00
摘要： In a tin-plated product wherein a surface of a substrate 10 of copper or a copper alloy is plated with tin, an underlying layer 12 of at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate 10, and an outermost layer formed on the surface of the underlying layer 12 is composed of a copper-tin alloy layer 14 and tin layers 16, the copper-tin alloy 14 being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers 16 being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layers 16 on the outermost surface being 20 to 80%, and the maximum thickness of the tin layers 16 being smaller than the average particle diameter of the crystal grains of the copper-tin alloy.
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公开(公告)号：US20180080135A1
公开(公告)日：2018-03-22
申请号：US15564538
申请日：2016-04-20
发明人： Hirotaka Kotani , Hiroto Narieda , Hideki Endo , Akira Sugawara , Yuta Sonoda , Takaya Kondo , Jyun Toyoizumi , Yuya Kishibata
摘要： There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 μm by electroplating, a tin-copper plating layer 12 containing tin 12b mixed with a copper-tin alloy 12a is formed thereon so as to have a thickness of 0.6 to 10 μm by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 μm or less by electroplating if necessary.
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公开(公告)号：US20220259753A1
公开(公告)日：2022-08-18
申请号：US17630564
申请日：2020-06-04
发明人： Hirotaka Kotani , Yukiya Kato , Tatsuhiro Doi , Takao Tomiya , Hiroto Narieda
摘要： There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.
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公开(公告)号：US20200064087A1
公开(公告)日：2020-02-27
申请号：US16666798
申请日：2019-10-29
发明人： Satoru Ideguchi , Hideyo Osanai , Hirotaka Kotani
IPC分类号： F28F21/08 , H01L23/367 , H01L21/48
摘要： A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.
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公开(公告)号：US20190136398A1
公开(公告)日：2019-05-09
申请号：US16099791
申请日：2017-04-18
发明人： Hirotaka Kotani , Hiroto Narieda , Akira Sugawara , Yuta Sonoda , Yoshitaka Ito
摘要： After drying the surface of a tin plating layer having a thickness of 0.4 to 3 μm which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dm2 in a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.
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公开(公告)号：US11920255B2
公开(公告)日：2024-03-05
申请号：US17630564
申请日：2020-06-04
发明人： Hirotaka Kotani , Yukiya Kato , Tatsuhiro Doi , Takao Tomiya , Hiroto Narieda
摘要： There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.
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公开(公告)号：US11078587B2
公开(公告)日：2021-08-03
申请号：US15752996
申请日：2016-08-23
发明人： Yuta Sonoda , Hiroto Narieda , Hideki Endo , Akira Sugawara , Hirotaka Kotani , Jyun Toyoizumi , Takaya Kondo , Yuya Kishibata
摘要： A tin-plated product contains: a substrate 10 of copper or a copper alloy; an underlying layer 12 of nickel which is formed on the surface of the substrate 10; and an outermost layer 14 containing tin, the outermost layer 14 being formed on the surface of the underlying layer 12, the outermost layer 14 being composed of a copper-tin alloy layer 14a of a large number of crystal grains of a copper-tin alloy, tin layers 14b of tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layers 14c of a copper-nickel-tin alloy, each of the tin layers 14b being formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers 14c being arranged on the side of the underlying layer 12 in the copper-tin alloy layer 14a so as to be apart from each other.
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