公开(公告)号：US10829862B2

公开(公告)日：2020-11-10

申请号：US15122568

申请日：2015-02-25

申请人： DOWA METALTECH CO., LTD. ,  YAZAKI CORPORATION

发明人： Tatsunori Murata ,  Hirotaka Kotani ,  Hideki Endo ,  Akira Sugawara ,  Yuta Sonoda ,  Tetsuo Kato ,  Hideki Ohsumi ,  Jyun Toyoizumi

IPC分类号： C25D5/50 ,  B32B15/01 ,  C25D5/34 ,  C25D5/12 ,  C25D7/00 ,  C25D3/12 ,  C25D3/32 ,  C25D3/38 ,  C25F1/00

摘要： In a tin-plated product wherein a surface of a substrate 10 of copper or a copper alloy is plated with tin, an underlying layer 12 of at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate 10, and an outermost layer formed on the surface of the underlying layer 12 is composed of a copper-tin alloy layer 14 and tin layers 16, the copper-tin alloy 14 being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers 16 being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layers 16 on the outermost surface being 20 to 80%, and the maximum thickness of the tin layers 16 being smaller than the average particle diameter of the crystal grains of the copper-tin alloy.

公开(公告)号：US20170088965A1

公开(公告)日：2017-03-30

申请号：US15122568

申请日：2015-02-25

申请人： DOWA METALTECH CO., LTD. ,  YAZAKI CORPORATION

发明人： Tatsunori Murata ,  Hirotaka Kotani ,  Hideki Endo ,  Akira Sugawara ,  Yuta Sonoda ,  Tetsuo Kato ,  Hideki Ohsumi ,  Jyun Toyoizumi

IPC分类号： C25D5/12 ,  C25F1/00 ,  B32B15/01 ,  C25D3/38 ,  C25D3/32 ,  C25D5/50 ,  C25D5/34 ,  C25D3/12

摘要： In a tin-plated product wherein a surface of a substrate 10 of copper or a copper alloy is plated with tin, an underlying layer 12 of at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate 10, and an outermost layer formed on the surface of the underlying layer 12 is composed of a copper-tin alloy layer 14 and tin layers 16, the copper-tin alloy 14 being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers 16 being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layers 16 on the outermost surface being 20 to 80%, and the maximum thickness of the tin layers 16 being smaller than the average particle diameter of the crystal grains of the copper-tin alloy.

公开(公告)号：US20130224979A1

公开(公告)日：2013-08-29

申请号：US13862051

申请日：2013-04-12

申请人： YAZAKI CORPORATION

发明人： Akira Sato ,  Kenji Takahashi ,  Hideki Ohsumi

IPC分类号： H01R13/52

CPC分类号： H01R13/521 ,  H01R13/5202 ,  H01R13/5216 ,  H01R2201/26

摘要： A connector includes an inner plate including cavities for holding terminals connected to electric wires, a cylindrical housing which accommodates therein the inner plate, and a filling material which is filled in an interior of the housing so as to surround a periphery of the inner plate. A plurality of air bleeding holes are formed in a portion of the inner plate other than portions where the cavities are provided so as to penetrate from a front side to a back side thereof.

摘要翻译： 连接器包括内板，其包括用于保持连接到电线的端子的空腔，容纳内板的圆柱形壳体和填充在壳体的内部以围绕内板的周边的填充材料。 在内板的一部分形成有多个排气孔，除了从其前侧到后侧的方式设置空腔的部分以外。

公开(公告)号：US09033747B2

公开(公告)日：2015-05-19

申请号：US13862051

申请日：2013-04-12

申请人： YAZAKI CORPORATION

发明人： Akira Sato ,  Kenji Takahashi ,  Hideki Ohsumi

IPC分类号： H01R13/405 ,  H01R13/52

CPC分类号： H01R13/521 ,  H01R13/5202 ,  H01R13/5216 ,  H01R2201/26

摘要： A connector includes an inner plate including cavities for holding terminals connected to electric wires, a cylindrical housing which accommodates therein the inner plate, and a filling material which is filled in an interior of the housing so as to surround a periphery of the inner plate. A plurality of air bleeding holes are formed in a portion of the inner plate other than portions where the cavities are provided so as to penetrate from a front side to a back side thereof.

摘要翻译： 连接器包括内板，其包括用于保持连接到电线的端子的空腔，容纳内板的圆柱形壳体和填充在壳体的内部以围绕内板的周边的填充材料。 在内板的一部分形成有多个排气孔，除了设置有空腔的部分以从其前侧到后侧的方式形成。

公开(公告)号：US20140329399A1

公开(公告)日：2014-11-06

申请号：US14361346

申请日：2012-11-05

申请人： YAZAKI CORPORATION

发明人： Hideki Ohsumi ,  Kazuhide Takahashi ,  Shigeru Tanaka ,  Haruki Tsuchiya

IPC分类号： H01R13/52 ,  H01R43/24

CPC分类号： H01R13/5216 ,  H01R13/5202 ,  H01R43/24 ,  H01R2201/26 ,  H05K5/0082

摘要： A connector (1) includes: a terminal receiving chamber (3) provided in a connector housing (2) and configured to receive therein (3) a terminal; and a potting material filling portion (9) provided in the terminal receiving chamber (3) with a potting material filled in the potting material filling portion (9), thus allowing the potting material filling portion (9) to seal the terminal receiving chamber (3). With respect to the potting material filling portion (9), based on an occurring stress characteristic showing a filling amount of the potting material relative to a stress occurring in the potting material filling portion (9) and based on a peel strength characteristic showing the filling amount of the potting material relative to a peel strength of the potting material filling portion (9), the filling amount of the potting material is set within such a range as that the peel strength becomes larger than the occurring stress.

摘要翻译： 连接器（1）包括：设置在连接器壳体（2）中并构造成在其中容纳（3）端子的端子容纳室（3） 以及设置在所述端子容纳室（3）中的灌封材料填充部（9），其具有填充在所述灌封材料填充部（9）中的灌封材料，从而允许所述灌封材料填充部（9）密封所述端子容纳室 3）。 相对于灌封材料填充部分（9），基于发生的灌封材料相对于灌封材料填充部分（9）中产生的应力的填充量产生的应力特性，并且基于显示填充材料的剥离强度特性 灌封材料的相对于灌封材料填充部分（9）的剥离强度的量，灌封材料的填充量设定在剥离强度变得大于所产生的应力的范围内。