- 专利标题: TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
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申请号: US15564538申请日: 2016-04-20
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公开(公告)号: US20180080135A1公开(公告)日: 2018-03-22
- 发明人: Hirotaka Kotani , Hiroto Narieda , Hideki Endo , Akira Sugawara , Yuta Sonoda , Takaya Kondo , Jyun Toyoizumi , Yuya Kishibata
- 申请人: Dowa Metaltech Co., Ltd. , Yazaki Corporation
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: Dowa Metaltech Co., Ltd.,Yazaki Corporation
- 当前专利权人: Dowa Metaltech Co., Ltd.,Yazaki Corporation
- 当前专利权人地址: JP Tokyo JP Tokyo
- 优先权: JP2015-094832 20150507
- 国际申请: PCT/JP2016/002103 WO 20160420
- 主分类号: C25D3/60
- IPC分类号: C25D3/60 ; C25D5/10 ; C25D5/12 ; C25D3/30 ; C25D3/12 ; H01R13/03
摘要:
There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 μm by electroplating, a tin-copper plating layer 12 containing tin 12b mixed with a copper-tin alloy 12a is formed thereon so as to have a thickness of 0.6 to 10 μm by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 μm or less by electroplating if necessary.
公开/授权文献
- US10676835B2 Tin-plated product and method for producing same 公开/授权日:2020-06-09
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