公开(公告)号：US11104788B2

公开(公告)日：2021-08-31

申请号：US16470420

申请日：2017-12-14

Applicant: DIC Corporation

Inventor： Masato Otsu ,  Kazuo Arita ,  Etsuko Suzuki ,  Junji Yamaguchi ,  Tomohiro Shimono

IPC: C08L35/00 ,  C08F222/40 ,  C08J5/24 ,  H01L23/29 ,  H05K1/03

Abstract: An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.

公开(公告)号：US11117873B2

公开(公告)日：2021-09-14

申请号：US15781890

申请日：2016-11-24

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Tomohiro Shimono ,  Masato Otsu ,  Junji Yamaguchi ,  Etsuko Suzuki

IPC: C07D265/16 ,  C08J5/24 ,  H01L23/31 ,  B32B15/08 ,  H01L23/29 ,  H05K1/03 ,  H05K1/09

Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

公开(公告)号：US20200331832A1

公开(公告)日：2020-10-22

申请号：US16772858

申请日：2018-11-20

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Masato Otsu ,  Etsuko Suzuki

IPC: C07C43/23 ,  C09J163/00 ,  C08K3/013 ,  C08G59/46 ,  C08G59/32 ,  B32B15/092 ,  B32B27/38 ,  B32B15/20 ,  B32B7/12 ,  H05K1/03

Abstract: The invention provides an epoxy compound A represented by the following formula (1): in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R3 to R8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R3 to R8 is a glycidyl ether group or a 2-methylglycidyl ether group; R9 to R12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p1, p2, and q are average values of repetition, m is 0.5 to 10, p1 and p2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).

公开(公告)号：US20150118499A1

公开(公告)日：2015-04-30

申请号：US14386476

申请日：2013-03-19

Applicant: DIC Corporation

Inventor： Etsuko Suzuki ,  Kazuo Arita

IPC: C08G8/32 ,  H05K1/05 ,  H05K3/00 ,  C08L61/14

CPC classification number: C08G8/32 ,  C08G8/28 ,  C08G16/0243 ,  C08G16/04 ,  C08G2190/00 ,  C08J5/24 ,  C08L61/14 ,  C08L2201/02 ,  C08L2203/206 ,  H01L23/293 ,  H01L2924/0002 ,  H05K1/0353 ,  H05K1/056 ,  H05K3/0067 ,  H05K2201/012 ,  H05K2201/0145 ,  Y10T428/31529 ,  H01L2924/00

Abstract: A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.

Abstract translation: 固化产物具有良好的耐热性和阻燃性以及低介电常数和低损耗角正切。 通过在核上具有烷氧基作为取代基的芳香醛（a1）与具有P-H基或P-OH基的有机磷化合物（a2）之间的反应获得的含磷化合物（i） 使分子结构与酚类物质（a3）反应，得到含磷酚类物质（A1）。 然后将含磷酚类物质（A1）与芳族二羧酸或芳族二羧酸或C2-6饱和二羧酸的酸酐或二卤化物或C2-6饱和二羧酸的二卤化物（A2 ）使得酚类物质（A1）的全部或部分羟基形成酯键。

公开(公告)号：US20160130391A1

公开(公告)日：2016-05-12

申请号：US14897100

申请日：2014-02-06

Applicant: DIC CORPORATION

Inventor： Kazuo Arita ,  Etsuko Suzuki

IPC: C08G63/692 ,  C08G59/42

CPC classification number: C08G63/692 ,  C08G59/40 ,  C08G59/423 ,  C08J5/24 ,  C08J2363/00 ,  H05K1/0326

Abstract: The present invention provides an active ester resin containing a phosphorus atom capable of providing a cured product having all of flame retardancy, heat resistance, and dielectric characteristics, an epoxy resin composition containing the same as a curing agent, a cured product thereof, a prepreg, a circuit board, and a build-up film. The active ester resin containing a phosphorus atom has Structure (I) in which a structural unit (α) in which a plurality of aromatic nuclei (X) are connected through an alicyclic hydrocarbon group is connected with another structural unit (α) through an arylene dicarbonyloxy group, and, at least one of the aromatic nuclei (X) present in the resin has a structural site (Y) represented by any one of the following Structural Formulas (y1) to (y4) as a substituent on the aromatic nucleus.

Abstract translation: 本发明提供含有能够提供具有全部阻燃性，耐热性和介电特性的固化产物的磷原子的活性酯树脂，含有该固化产物的环氧树脂组合物，其固化产物，预浸料 ，电路板和积聚膜。 含有磷原子的活性酯树脂具有其中通过脂环族烃基连接多个芳香核（X）的结构单元（α）的结构（I）通过亚芳基与另一结构单元（α）连接 并且存在于树脂中的芳香族核（X）中的至少一种具有作为芳香核上的取代基的以下结构式（y1）〜（y4）中的任一个表示的结构部位（Y）。

公开(公告)号：US11760711B2

公开(公告)日：2023-09-19

申请号：US16772858

申请日：2018-11-20

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Masato Otsu ,  Etsuko Suzuki

IPC: B32B15/092 ,  B32B27/38 ,  C08G59/24 ,  C08G59/32 ,  C09J163/00 ,  C08L63/00 ,  C07C43/23 ,  C08K3/013 ,  B32B7/12 ,  B32B15/20 ,  C08G59/46 ,  H05K1/03

CPC classification number: C07C43/23 ,  B32B7/12 ,  B32B15/092 ,  B32B15/20 ,  B32B27/38 ,  C08G59/3218 ,  C08G59/46 ,  C08K3/013 ,  C09J163/00 ,  H05K1/0373 ,  B32B2250/40 ,  B32B2457/08 ,  C08G2170/00

Abstract: The invention provides an epoxy compound A represented by the following formula (1):






in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R3 to R8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R3 to R8 is a glycidyl ether group or a 2-methylglycidyl ether group; R9 to R12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p1, p2, and q are average values of repetition, m is 0.5 to 10, p1 and p2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).

公开(公告)号：US09963544B2

公开(公告)日：2018-05-08

申请号：US14897100

申请日：2014-02-06

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Etsuko Suzuki

IPC: C08G63/692 ,  C08G59/42 ,  C08J5/24 ,  C08G59/40 ,  H05K1/03

CPC classification number: C08G63/692 ,  C08G59/40 ,  C08G59/423 ,  C08J5/24 ,  C08J2363/00 ,  H05K1/0326

Abstract: The present invention provides an active ester resin containing a phosphorus atom capable of providing a cured product having all of flame retardancy, heat resistance, and dielectric characteristics, an epoxy resin composition containing the same as a curing agent, a cured product thereof, a prepreg, a circuit board, and a build-up film. The active ester resin containing a phosphorus atom has Structure (I) in which a structural unit (α) in which a plurality of aromatic nuclei (X) are connected through an alicyclic hydrocarbon group is connected with another structural unit (α) through an arylene dicarbonyloxy group, and, at least one of the aromatic nuclei (X) present in the resin has a structural site (Y) represented by any one of the following Structural Formulas (y1) to (y4) as a substituent on the aromatic nucleus.

公开(公告)号：US09217053B2

公开(公告)日：2015-12-22

申请号：US14386476

申请日：2013-03-19

Applicant: DIC Corporation

Inventor： Etsuko Suzuki ,  Kazuo Arita

IPC: B32B27/08 ,  H05K1/05 ,  C08L63/00 ,  C08G8/32 ,  C08J5/24 ,  H01L23/29 ,  H05K1/03 ,  C08G16/02 ,  C08L61/14 ,  H05K3/00 ,  C08G8/28 ,  C08G16/04

CPC classification number: C08G8/32 ,  C08G8/28 ,  C08G16/0243 ,  C08G16/04 ,  C08G2190/00 ,  C08J5/24 ,  C08L61/14 ,  C08L2201/02 ,  C08L2203/206 ,  H01L23/293 ,  H01L2924/0002 ,  H05K1/0353 ,  H05K1/056 ,  H05K3/0067 ,  H05K2201/012 ,  H05K2201/0145 ,  Y10T428/31529 ,  H01L2924/00

Abstract: A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.

Abstract translation: 固化产物具有良好的耐热性和阻燃性以及低介电常数和低损耗角正切。 通过在核上具有烷氧基作为取代基的芳香醛（a1）与具有P-H基或P-OH基的有机磷化合物（a2）之间的反应获得的含磷化合物（i） 使分子结构与酚类物质（a3）反应，得到含磷酚类物质（A1）。 然后将含磷酚类物质（A1）与芳族二羧酸或芳族二羧酸或C2-6饱和二羧酸的酸酐或二卤化物或C2-6饱和二羧酸的二卤化物（A2 ）使得酚类物质（A1）的全部或部分羟基形成酯键。