Invention Application
US20150118499A1 ACTIVE ESTER RESIN, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM
有权
活性酯树脂，热固性树脂组合物，固化产物，半导体封装材料，PREPREG，电路板和建筑电影
- Patent Title: ACTIVE ESTER RESIN, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM
- Patent Title (中): 活性酯树脂，热固性树脂组合物，固化产物，半导体封装材料，PREPREG，电路板和建筑电影
-
Application No.: US14386476Application Date: 2013-03-19
-
Publication No.: US20150118499A1Publication Date: 2015-04-30
- Inventor: Etsuko Suzuki , Kazuo Arita
- Applicant: DIC Corporation
- Priority: JP2012-063539 20120321
- International Application: PCT/JP2013/057853 WO 20130319
- Main IPC: C08G8/32
- IPC: C08G8/32 ; H05K1/05 ; H05K3/00 ; C08L61/14
Abstract:
A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.
Public/Granted literature
Information query
