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公开(公告)号：US10774173B2
公开(公告)日：2020-09-15
申请号：US16313298
申请日：2017-06-29
发明人： Hee Jin Cho , Do Kyung Sung , Sae Rom Nam
IPC分类号： B32B27/38 , B32B27/26 , C08G59/22 , C08G59/24 , C08G59/40 , C08G59/56 , C08J5/24 , C08L63/00 , C08G59/46 , C08L63/08 , C08K5/357 , C08G59/50 , C08K5/00 , C08K5/17 , C08G59/42 , C08K5/10 , C08G59/62 , C08G59/64 , C08G73/22 , H05K1/03
摘要： The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.
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2.发明申请公开(公告)号：US20200157292A1
公开(公告)日：2020-05-21
申请号：US16611358
申请日：2018-05-21
摘要： An epoxy resin composition for fiber reinforced composite materials comprising components (A) to (E): component (A), an epoxy resin; component (B), a dicyandiamide or a derivative thereof; component (C), a polyisocyanate compound; component (D), a urea compound as represented by formula (1): (wherein R1 and R2 are each independently H, CH3, OCH3, 0C2H5, NO2, halogen, or NH—CO NR3R4; and R3 and R4 are each independently a hydrocarbon group, allyl group, alkoxy group, alkenyl group, aralkyl group, or an alicyclic compound containing both R3 and R4, all containing 1 to 8 carbon atoms); and component (E), at least one compound selected from the group consisting of quaternary ammonium salts, phosphonium salts, imidazole compounds, and phosphine compounds.
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公开(公告)号：US20200148811A1
公开(公告)日：2020-05-14
申请号：US16604264
申请日：2018-04-11
发明人： Timothy A. Morley , Rainer Koeniger , Luca Lotti , Nebojsa Jeiic , Zeljko Sikman , Martin Reimers
摘要： A novel sulfanilamide containing epoxy resin composition capable of fast curing without negative impact on glass transition temperature or mechanical performance.
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公开(公告)号：US10259952B2
公开(公告)日：2019-04-16
申请号：US15501105
申请日：2015-09-15
发明人： Hiroaki Umeda , Kazuhiro Matsuda
IPC分类号： C09D5/24 , C09D7/40 , C08G59/46 , C08G59/56 , H01L21/56 , H01L23/29 , C09D163/00 , H01L23/00 , H01L23/28 , H01L23/31 , C08K5/07 , C08L33/26 , C09D5/03 , H01L23/552
摘要： Provided herein is a conductive coating material that can be spray coated to form a shielding layer having desirable shielding performance, and desirable adhesion to a package. A shielded package producing method using the conductive coating material is also provided. The conductive coating material comprises at least (A) 100 parts by mass of a binder component containing 5 to 30 parts by mass of a solid epoxy resin that is solid at ordinary temperature, and 20 to 90 parts by mass of a liquid epoxy resin that is liquid at ordinary temperature, (B) 200 to 1800 parts by mass of metallic particles, and (C) 0.3 to 40 parts by mass of a curing agent. The conductive coating material has a viscosity of 3 to 30 dPa·s.
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公开(公告)号：US09862798B2
公开(公告)日：2018-01-09
申请号：US14041927
申请日：2013-09-30
申请人： EVONIK DEGUSSA GMBH
摘要： The present disclosure provides a liquid curing agent composition comprising at least 50% by weight of a polyamine and 0.2% to 10% by weight of dicyandiamide, the amine/epoxy composition and the product from the cured amine/epoxy composition.
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6.发明授权Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins 失效液晶环氧单体和液晶环氧树脂含有介晶双胞胎
公开(公告)号：US5811504A
公开(公告)日：1998-09-22
申请号：US510867
申请日：1995-08-03
IPC分类号： C07D303/04 , C08G59/20 , C08G59/22 , C08G59/50 , C09K19/38 , C08G59/06 , C08G59/40 , C08G59/46
CPC分类号： C08G59/20 , C08G59/50 , C09K19/3814
摘要： Monomers of formula (I) ##STR1## where ##STR2## is a mesogen, ##STR3## is a spacer, and --X is a group having an epoxy function exhibit a reduced tendency to undergo self-condensation via addition polymerization and afford liquid crystalline polymers upon condensation with a crosslinking agent.
摘要翻译： 式（I）的单体
其中 是介晶， 是间隔基，-X是具有环氧官能团的基团通过加成聚合呈现自缩合的倾向，并提供液晶 聚合物与交联剂缩合。 -
7.发明授权Curing agent for aqueous epoxy resin dispersions, process for its preparation and its use 失效水性环氧树脂分散体的固化剂，其制备方法及其用途
公开(公告)号：US5382606A
公开(公告)日：1995-01-17
申请号：US53426
申请日：1993-04-28
IPC分类号： C04B24/28 , C08G59/00 , C08G59/18 , C08G59/46 , C08G59/56 , C08K3/00 , C08K5/17 , C08L63/00 , C08K3/20 , C08L63/02
CPC分类号： C08G59/184 , C04B24/281 , C08L63/00
摘要： A curing agent for aqueous epoxy resin emulsions is described, which curing agent contains 10-80% by weight of at least one emulsifier, 1-80% by weight of at least one coemulsifier, and 5-80% by weight of at least one bis(diamine)-diepoxide adduct. Optionally, the curing agent furthermore contains 0-80% by weight of a diamine or a mixture of two or more diamines. Said curing agent has the ability of forming microemulsions when water is added, preferably non-ionic oil-in-water microemulsions. Said microemulsions have a good shelf life. They are useful as curing agent for any desired aqueous epoxy resin dispersions, and they can also be used as curing agent in compositions based on epoxy resin and cement mortar.
摘要翻译： 描述了用于水性环氧树脂乳液的固化剂，其中固化剂含有10-80重量％的至少一种乳化剂，1-80重量％的至少一种共乳化剂和5-80重量％的至少一种 双（二胺） - 二环加成物。 任选地，固化剂还含有0-80重量％的二胺或两种或更多种二胺的混合物。 当加入水时，所述固化剂具有形成微乳液的能力，优选非离子型水包油微乳液。 所述微乳液具有良好的保质期。 它们可用作任何所需水性环氧树脂分散体的固化剂，并且它们也可用作基于环氧树脂和水泥砂浆的组合物中的固化剂。
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公开(公告)号：US5284702A
公开(公告)日：1994-02-08
申请号：US745302
申请日：1991-08-15
IPC分类号： C08G59/00 , C08G59/46 , C08G59/62 , C08J5/24 , C08L33/26 , C08L61/04 , C08L61/06 , C08L61/10 , C08L63/00 , B32B7/00 , B32B17/02 , B32B27/00
CPC分类号： C08J5/24 , C08L61/06 , C08J2361/06 , C08L33/26 , C08L63/00 , Y10T442/2738
摘要： A low fuming phenolic resin prepreg comprising a fibrous base impregnated with 20 to 60% by weight of a resin composition comprising (a) 100 parts by weight of a resol phenolic resin, (b) from 1.5 to 15 parts by weight of polyacrylamide, (c) from 1.5 to 25 parts by weight of an epoxy resin, and (d) from 1.5 to 15 parts by weight of an inorganic filler, and the method for preparing the prepreg by impregnating a solution of (a), (b) and (c) having dispersed therein the filler into a fibrous base. The method for the prepreg comprising impregnating the fibrous base with the resin composition. The phenolic resin prepreg has low fuming properties as well as excellent self-adhesion.
摘要翻译： 一种低发泡酚醛树脂预浸料，其包含浸渍有20至60重量％的树脂组合物的纤维基料，所述树脂组合物包含（a）100重量份的甲阶酚醛树脂酚醛树脂，（b）1.5至15重量份的聚丙烯酰胺，（ c）1.5〜25重量份的环氧树脂，（d）1.5〜15重量份的无机填料，以及通过浸渍（a），（b）和 （c）将填料分散在纤维基材中。 预浸料的方法包括用树脂组合物浸渍纤维基料。 酚醛树脂预浸料具有低发烟性和良好的自粘性。
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9.发明授权Thermosettable resin compositions containing a polyepoxide and an alkenyl phenyl cyanate 失效含有聚环氧化物和烯基苯基氰酸酯的热固性树脂组合物
公开(公告)号：US4558115A
公开(公告)日：1985-12-10
申请号：US710356
申请日：1985-03-11
CPC分类号： C07C261/02 , C08G59/4014
摘要： Compositions comprising a material containing (a) alkenyl phenyl cyanate groups, (b) a material containing epoxide groups and optionally any one or more of (c) an aromatic polycyanate, (d) a polymaleimide or (e) a polymerizable ethylenically unsaturated aromatic material are curable to products having excellent mechanical, thermal and chemical resistant properties.
摘要翻译： 包含（a）烯基苯基氰酸酯基团的材料的组合物，（b）含有环氧基团和任选的（c）芳族聚氰酸酯，（d）聚马来酰亚胺或（e）可聚合的烯属不饱和芳族物质 可固化成具有优异的机械，耐热和耐化学性能的产品。
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公开(公告)号：US4113697A
公开(公告)日：1978-09-12
申请号：US743818
申请日：1976-11-22
申请人： Heinz Schulze , Harold G. Waddill
发明人： Heinz Schulze , Harold G. Waddill
CPC分类号： C08G59/4215 , C08L63/00
摘要： Resistance to thermal shock of certain anhydride cured epoxy resins is unexpectedly enhanced by addition of certain polyether diamide additives. This superior resistance does not appreciably compromise heat deflection properties. The resins comprise a vicinal polyepoxide, a curing amount of certain bicyclic anhydride and an effective amount of a polyether diamide having terminal amido groups and a molecular weight of from about 2000 to about 3000.
摘要翻译： 通过加入某些聚醚二酰胺添加剂，某些酸酐固化环氧树脂的耐热冲击性出人意料地得到提高。 这种优异的阻力不会明显损害热偏转性能。 树脂包括邻位聚环氧化物，固化量的某些双环酸酐和有效量的具有末端酰氨基并且分子量为约2000至约3000的聚醚二酰胺。
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