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    Packaged microelectronic imagers and methods of packaging microelectronic imagers
    1.
    发明申请
    Packaged microelectronic imagers and methods of packaging microelectronic imagers 有权
    封装的微电子成像器和包装微电子成像器的方法

    公开(公告)号：US20050285154A1

    公开(公告)日：2005-12-29

    申请号：US10879398

    申请日：2004-06-29

    Applicant: Salman Akram ,  Charles Watkins ,  Kyle Kirby ,  Alan Wood ,  William Hiatt

    Inventor： Salman Akram ,  Charles Watkins ,  Kyle Kirby ,  Alan Wood ,  William Hiatt

    IPC: H01L27/146 ,  H01L27/148 ,  H01L31/02 ,  H01L21/00

    CPC classification number: H01L27/146 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/148 ,  H01L31/02016 ,  H01L2224/48227 ,  H01L2924/01046 ,  H01L2924/01066 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00

    Abstract: Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microelectronic substrate, an integrated circuit, and an image sensor electrically coupled to the integrated circuit. A bond-pad is carried by the substrate and electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the substrate and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad, a dielectric liner deposited into the passage and in contact with the substrate, first and second conductive layers deposited onto at least a portion of the dielectric liner, and a conductive fill material deposited into the passage over at least a portion of the second conductive layer and electrically coupled to the bond-pad.

    Abstract translation: 本文公开了微电子成像器，用于封装微电子成像器的方法，以及用于在微电子成像器中形成导电晶片间互连的方法。 在一个实施例中，微电子成像管芯可以包括微电子衬底，集成电路和电耦合到集成电路的图像传感器。 接合焊盘由衬底承载并电耦合到集成电路。 导电晶片互连延伸穿过衬底并与接合焊盘接触。 互连可以包括完全延伸穿过衬底和接合焊盘的通道，沉积到通道中并与衬底接触的电介质衬垫，沉积在电介质衬垫的至少一部分上的第一和第二导电层以及导电 在第二导电层的至少一部分上沉积到通道中并且电耦合到接合焊盘的填充材料。

    Systems and methods for testing microelectronic imagers and microfeature devices
    5.
    发明申请
    Systems and methods for testing microelectronic imagers and microfeature devices 有权
    用于测试微电子成像器和微特征器件的系统和方法

    公开(公告)号：US20060255826A1

    公开(公告)日：2006-11-16

    申请号：US11409060

    申请日：2006-04-24

    Applicant: Salman Akram ,  William Hiatt ,  Alan Wood ,  Charles Watkins ,  Kyle Kirby

    Inventor： Salman Akram ,  William Hiatt ,  Alan Wood ,  Charles Watkins ,  Kyle Kirby

    IPC: G01R31/26

    CPC classification number: G01R31/2635 ,  G01R31/2831

    Abstract: Systems and methods for testing microelectronic imagers and microfeature devices are disclosed herein. In one embodiment, a method includes providing a microfeature workpiece including a substrate having a front side, a backside, and a plurality of microelectronic dies. The individual dies include an integrated circuit and a plurality of contact pads at the backside of the substrate operatively coupled to the integrated circuit. The method includes contacting individual contact pads with corresponding pins of a probe card. The method further includes testing the dies. In another embodiment, the individual dies can further comprise an image sensor at the front side of the substrate and operatively coupled to the integrated circuit. The image sensors are illuminated while the dies are tested.

    Abstract translation: 本文公开了用于测试微电子成像器和微特征器件的系统和方法。 在一个实施例中，一种方法包括提供微功能工件，其包括具有正面，背面和多个微电子管芯的衬底。 各个管芯包括集成电路和在衬底的背面可操作地耦合到集成电路的多个接触焊盘。 该方法包括使各个接触垫与探针卡的相应引脚接触。 该方法还包括测试模具。 在另一个实施例中，各个管芯还可以包括在衬底的前侧的图像传感器，并可操作地耦合到集成电路。 在测试模具时，图像传感器被照亮。

    Programmed material consolidation processes for fabricating electrical contacts and the resulting electrical contacts
    6.
    发明申请
    Programmed material consolidation processes for fabricating electrical contacts and the resulting electrical contacts 审中-公开
    用于制造电触点和由此产生的电触头的程序化材料固结工艺

    公开(公告)号：US20060211313A1

    公开(公告)日：2006-09-21

    申请号：US11429012

    申请日：2006-05-04

    Applicant: Warren Farnworth ,  William Hiatt ,  Charles Watkins

    Inventor： Warren Farnworth ,  William Hiatt ,  Charles Watkins

    IPC: H01R13/02

    CPC classification number: H01R13/02 ,  B33Y30/00 ,  B33Y80/00 ,  H01R13/2414 ,  H01R2201/20

    Abstract: An electrical contact for use with a semiconductor device, a carrier, a probe card, or another substrate includes a dielectric core, a conductive coating on at least a portion of the core, or both that are at least partially fabricated by a programmed material consolidation process, such as, but not limited to, stereolithography, in which unconsolidated material is selectively consolidated in accordance with a program. The electrical contact may be flexible and resilient or it may be rigid. Protective structures may accompany flexible, resilient contacts to prevent deformation thereof beyond their elastic limits.

    Abstract translation: 与半导体器件，载体，探针卡或另一基底一起使用的电触点包括介电芯，芯的至少一部分上的导电涂层或两者，至少部分地由编程材料固结 方法，例如但不限于立体光刻术，其中根据程序选择性地固结未固结的材料。 电接触可以是柔性的和弹性的，或者它可以是刚性的。 保护结构可以伴随柔性弹性触点，以防止其变形超出其弹性极限。

    Methods for fabricating electronic device components that include protruding contacts and electronic device components so fabricated
    7.
    发明申请
    Methods for fabricating electronic device components that include protruding contacts and electronic device components so fabricated 审中-公开
    用于制造包括突出接触件和如此制造的电子器件部件的电子器件部件的方法

    公开(公告)号：US20060205291A1

    公开(公告)日：2006-09-14

    申请号：US11429011

    申请日：2006-05-04

    Applicant: Warren Farnworth ,  William Hiatt ,  Charles Watkins

    Inventor： Warren Farnworth ,  William Hiatt ,  Charles Watkins

    IPC: H01R13/02

    CPC classification number: H01R13/02 ,  B33Y30/00 ,  B33Y80/00 ,  H01R13/2414 ,  H01R2201/20

    Abstract: A method for fabricating a semiconductor device component, such as a probe card, includes providing a support plate with at least one aperture therethrough and providing at least one contact in the at least one aperture. Ends of the at least one contact may be enlarged to retain the same within the at least one aperture. A protective structure may be provided to prevent excessive compression of the at least one contact. The support plate, all or part of the at least one contact, the protective structure, or a combination thereof may be formed by a programmed material consolidation process, such as stereolithography, in which unconsolidated material is selectively consolidated in accordance with a program.

    Abstract translation: 用于制造诸如探针卡的半导体器件部件的方法包括提供具有穿过其中的至少一个孔的支撑板，并在所述至少一个孔中提供至少一个触点。 可以扩大至少一个触点的端部以将其保持在至少一个孔内。 可以提供保护结构以防止至少一个接触件的过度压缩。 支撑板，全部或部分至少一个触点，保护结构或其组合可以通过程序化材料固结工艺（例如立体光刻）形成，其中根据程序选择性地固结未固结的材料。

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