-
公开(公告)号:US11048334B2
公开(公告)日:2021-06-29
申请号:US16229765
申请日:2018-12-21
摘要: Aspects of the technology described herein relate to methods and apparatuses for identifying gestures based on ultrasound data. Performing gesture recognition may include obtaining, with a wearable device, ultrasound data corresponding to an anatomical gesture; and identifying the anatomical gesture based on the obtained ultrasound data. Interfacing with a computing device may include identifying, with a wearable device, an anatomical gesture using ultrasound data obtained by the wearable device; and causing the computing device to perform a specific function based on the anatomical gesture identified by the wearable device. Training a wearable device to perform gesture recognition may include obtaining, with the wearable device, ultrasound data corresponding to an anatomical gesture; obtaining non-ultrasound data corresponding to the anatomical gesture; and training a machine learning model accessed by the wearable device to recognize the anatomical gesture based on correlating the non-ultrasound data and the ultrasound data.
-
公开(公告)号:US11005435B2
公开(公告)日:2021-05-11
申请号:US16011755
申请日:2018-06-19
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
IPC分类号: G01S15/89 , G01S7/523 , G01N29/44 , H03F3/45 , H03M1/12 , B06B1/02 , G01H17/00 , G01S7/526 , G01N29/36 , G01N29/24 , H03F3/30 , G01S7/52
摘要: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.
-
公开(公告)号:US20210048517A1
公开(公告)日:2021-02-18
申请号:US17088477
申请日:2020-11-03
发明人: Liewei Bao , Kailiang Chen , Tyler S. Ralston , Nevada J. Sanchez
摘要: Circuitry for ultrasound devices is described. A multi-level pulser is described, which can support time-domain and spatial apodization. The multi-level pulser may be controlled through a software-defined waveform generator. In response to the execution of a computer code, the waveform generator may access master segments from a memory, and generate a stream of packets directed to pulsing circuits. The stream of packets may be serialized. A plurality of decoding circuits may modulate the streams of packets to obtain spatial apodization.
-
公开(公告)号:US10710873B2
公开(公告)日:2020-07-14
申请号:US16290188
申请日:2019-03-01
发明人: Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
-
公开(公告)号:US20200205670A1
公开(公告)日:2020-07-02
申请号:US16728844
申请日:2019-12-27
IPC分类号: A61B5/00
摘要: Methods and apparatuses are provided for photoacoustic imaging. One such apparatus may include an ultrasound-on-a-chip device attached to a housing, an optical emitter attached to the housing, and a controller enclosed at least partially in the housing. The ultrasound-on-a-chip device may include a plurality of ultrasonic transducers. The optical emitter may include an array of diodes arranged at a periphery of the plurality of ultrasonic transducers. The controller may be configured to control the optical emitter to emit pulses of light, to control the plurality of ultrasonic transducers to detect ultrasonic waves emitted from a target to be imaged in response to exposure to the pulses of light, and to convert the ultrasonic waves to digital signals. For example, the optical emitter may be controlled to emit chirped optical pulses. The digital signals may be processed by the controller to produce image-formation data.
-
公开(公告)号:US10518292B2
公开(公告)日:2019-12-31
申请号:US15868989
申请日:2018-01-11
发明人: Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
-
7.
公开(公告)号:US10416298B2
公开(公告)日:2019-09-17
申请号:US15273377
申请日:2016-09-22
摘要: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.
-
公开(公告)号:US20190154820A1
公开(公告)日:2019-05-23
申请号:US16252382
申请日:2019-01-18
CPC分类号: G01S7/5208 , A61B5/7257 , A61B8/4483 , A61B8/5207 , G01S7/5202 , G01S7/52025 , G01S7/52026 , G01S7/52033 , G01S7/52034 , G01S7/52047 , G01S15/8915
摘要: Ultrasound signal processing circuitry and related apparatus and methods are described. Signal samples received from an ultrasound transducer array in an ultrasound transducer based imaging system may be processed, or conditioned, by application of one or more weighting functions. In some embodiments, one or more weighting functions may be applied to the signal samples in the time domain. In other embodiments, the signal samples may be converted to the frequency domain and one or more weighting functions may be applied in the frequency domain. In further embodiments, one or more weighting functions may be applied in the time domain and one or more weighting functions may be applied in the frequency domain. The weighting functions may be channel dependent and/or channel independent. The processed data can be provided to an image formation processor.
-
公开(公告)号:US20190149110A1
公开(公告)日:2019-05-16
申请号:US16245202
申请日:2019-01-10
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
CPC分类号: H03F3/45179 , B06B1/0223 , G01H17/00 , G01N29/2406 , G01N29/36 , G01N29/4463 , G01S7/52033 , G01S7/523 , G01S7/526 , G01S15/89 , H03F3/30 , H03F2200/129 , H03F2200/294 , H03F2203/45524 , H03M1/12 , H03M1/124
摘要: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.
-
公开(公告)号:US10272470B2
公开(公告)日:2019-04-30
申请号:US15581511
申请日:2017-04-28
发明人: Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
-
-
-
-
-
-
-
-
-