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公开(公告)号:US20210093291A1
公开(公告)日:2021-04-01
申请号:US17033510
申请日:2020-09-25
发明人: Nevada J. Sanchez
摘要: Aspects of the technology described herein related to monitoring fetal heartbeat and uterine contraction signals. An ultrasound system may be configured to sweep a volume to collect ultrasound data, detect a fetal heartbeat and/or uterine contraction signal in the ultrasound data, and automatically steer an ultrasound beam to monitor the fetal heartbeat and/or uterine contraction signal. The ultrasound system may be further configured to determine a location where the fetal heartbeat and/or uterine contraction signal is detectable or detectable at a highest quality. The ultrasound system may include a wearable ultrasound device, such as an ultrasound patch coupled to a subject. The wearable ultrasound device may have a two-dimensional array of ultrasonic transducers capable of steering ultrasound beams in three dimensions.
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公开(公告)号:US20210048517A1
公开(公告)日:2021-02-18
申请号:US17088477
申请日:2020-11-03
发明人: Liewei Bao , Kailiang Chen , Tyler S. Ralston , Nevada J. Sanchez
摘要: Circuitry for ultrasound devices is described. A multi-level pulser is described, which can support time-domain and spatial apodization. The multi-level pulser may be controlled through a software-defined waveform generator. In response to the execution of a computer code, the waveform generator may access master segments from a memory, and generate a stream of packets directed to pulsing circuits. The stream of packets may be serialized. A plurality of decoding circuits may modulate the streams of packets to obtain spatial apodization.
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公开(公告)号:US10710873B2
公开(公告)日:2020-07-14
申请号:US16290188
申请日:2019-03-01
发明人: Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
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公开(公告)号:US10518292B2
公开(公告)日:2019-12-31
申请号:US15868989
申请日:2018-01-11
发明人: Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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5.
公开(公告)号:US10416298B2
公开(公告)日:2019-09-17
申请号:US15273377
申请日:2016-09-22
摘要: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.
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6.
公开(公告)号:US20190164956A1
公开(公告)日:2019-05-30
申请号:US16197438
申请日:2018-11-21
IPC分类号: H01L27/06 , H01L27/092 , H01L23/528 , H01L23/522 , H01L21/768 , B81C1/00 , B06B1/02 , H01L21/56 , H01L21/3213 , H01L21/8238 , A61B8/00 , B81B3/00 , B81B7/00
摘要: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
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公开(公告)号:US20190154820A1
公开(公告)日:2019-05-23
申请号:US16252382
申请日:2019-01-18
CPC分类号: G01S7/5208 , A61B5/7257 , A61B8/4483 , A61B8/5207 , G01S7/5202 , G01S7/52025 , G01S7/52026 , G01S7/52033 , G01S7/52034 , G01S7/52047 , G01S15/8915
摘要: Ultrasound signal processing circuitry and related apparatus and methods are described. Signal samples received from an ultrasound transducer array in an ultrasound transducer based imaging system may be processed, or conditioned, by application of one or more weighting functions. In some embodiments, one or more weighting functions may be applied to the signal samples in the time domain. In other embodiments, the signal samples may be converted to the frequency domain and one or more weighting functions may be applied in the frequency domain. In further embodiments, one or more weighting functions may be applied in the time domain and one or more weighting functions may be applied in the frequency domain. The weighting functions may be channel dependent and/or channel independent. The processed data can be provided to an image formation processor.
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公开(公告)号:US10272470B2
公开(公告)日:2019-04-30
申请号:US15581511
申请日:2017-04-28
发明人: Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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公开(公告)号:US10266401B2
公开(公告)日:2019-04-23
申请号:US15910776
申请日:2018-03-02
发明人: Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
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公开(公告)号:US20190069842A1
公开(公告)日:2019-03-07
申请号:US16122956
申请日:2018-09-06
发明人: Jonathan M. Rothberg , Gregg Fergus , Keith G. Fife , Tyler S. Ralston , Nevada J. Sanchez , Jaime Scott Zahorian , Kailiang Chen , Christopher Thomas McNulty
摘要: Aspects of the technology described herein relate to an apparatus including an ultrasound-on-a-chip device configured to be bound to a user's wrist. The ultrasound-on-a-chip device may include a two-dimensional array of ultrasonic transducers. The transducers may be capacitive micromachined ultrasonic transducers (CMUTs) and may be configured to emit ultrasound waves having a frequency between approximately 5-20 MHz. A coupling strip may be coupled to the ultrasound-on-a-chip device to reduce the air gap between the ultrasound-on-a-chip device and the user's wrist. The ultrasound-on-a-chip device may be waterproof and may be able to perform both transverse and longitudinal ultrasound scanning without being rotated. The ultrasound-on-a-chip device may be configured to calculate pulse wave velocity through a blood vessel in a user's wrist.
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