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公开(公告)号:US11005435B2
公开(公告)日:2021-05-11
申请号:US16011755
申请日:2018-06-19
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
IPC分类号: G01S15/89 , G01S7/523 , G01N29/44 , H03F3/45 , H03M1/12 , B06B1/02 , G01H17/00 , G01S7/526 , G01N29/36 , G01N29/24 , H03F3/30 , G01S7/52
摘要: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.
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公开(公告)号:US20190149110A1
公开(公告)日:2019-05-16
申请号:US16245202
申请日:2019-01-10
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
CPC分类号: H03F3/45179 , B06B1/0223 , G01H17/00 , G01N29/2406 , G01N29/36 , G01N29/4463 , G01S7/52033 , G01S7/523 , G01S7/526 , G01S15/89 , H03F3/30 , H03F2200/129 , H03F2200/294 , H03F2203/45524 , H03M1/12 , H03M1/124
摘要: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.
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公开(公告)号:US10857567B2
公开(公告)日:2020-12-08
申请号:US16011776
申请日:2018-06-19
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
摘要: An ultrasound device is describe in which analog ultrasonic transducer output signal are directly converted to digital signals. The ultrasound device includes microfabricated ultrasonic transducers directly coupled to a sigma delta analog-to-digital converter in some instances. The direct digital conversion may allow for omission of undesirable analog processing stages in the ultrasound circuitry chain. In some situations, the ADC may be integrated on the same substrate as the ultrasound transducer.
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公开(公告)号:US20190142389A1
公开(公告)日:2019-05-16
申请号:US16244739
申请日:2019-01-10
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
摘要: An ultrasound circuit comprising a multi-stage trans-impedance amplifier (TIA) is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA may include multiple stages, at least two of which operate with different supply voltages. The TIA may be followed by further processing circuitry configured to filter, amplify, and digitize the signal produced by the TIA.
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公开(公告)号:US10340866B2
公开(公告)日:2019-07-02
申请号:US16244934
申请日:2019-01-10
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
摘要: An ultrasound circuit comprising a single-ended trans-impedance amplifier (TIA) is described, The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TEA is followed by further processing circuitry configured to filter, amplify, and digitize the signal produced by the TIA.
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公开(公告)号:US20210313939A1
公开(公告)日:2021-10-07
申请号:US17200675
申请日:2021-03-12
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
IPC分类号: H03F3/45 , H03M1/12 , B06B1/02 , G01S15/89 , G01N29/44 , G01S7/523 , G01H17/00 , G01S7/526 , G01N29/36 , G01N29/24 , H03F3/30 , G01S7/52
摘要: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.
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公开(公告)号:US10340867B2
公开(公告)日:2019-07-02
申请号:US16245202
申请日:2019-01-10
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
摘要: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.
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