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公开(公告)号：US06927081B2
公开(公告)日：2005-08-09
申请号：US10422545
申请日：2003-04-24
CPC分类号： G01B11/08
摘要： A method of blind assembly processing a wafer by pick and place equipment is described. This method includes determining the wafer diameter or radius and determining the bad die edge exclusive zone. This determined diameter or radius and the determined edge exclusive zone is used to make a black paper mask and place it over the wafer or to cut or saw away from the wafer the bad die edge exclusive zone. This enables the pick and place equipment to avoid the bad dies in the bad die edge exclusive zone.
摘要翻译： 描述了通过拾取和放置设备盲片组装处理晶片的方法。 该方法包括确定晶片直径或半径并确定不良裸片边缘专属区域。 该确定的直径或半径和确定的边缘独占区域用于制造黑色纸掩模并将其放置在晶片上或者从晶片上切割或锯离不良的裸片边缘专属区域。 这使得拾取和放置设备避免了坏死边缘专属区域中的坏死。
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2.发明授权Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame 有权具有封装芯片的模具材料和引线框架的一部分的半导体封装公开(公告)号：US08072770B2
公开(公告)日：2011-12-06
申请号：US12411713
申请日：2009-03-26
IPC分类号： H01R9/00
CPC分类号： H01L25/105 , H01L23/3107 , H01L23/49541 , H01L23/49551 , H01L23/49589 , H01L24/16 , H01L24/31 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73253 , H01L2224/73265 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connected with one side of the lead frame. The opposite side of the lead frame including, for example, lead segments, can be exposed from the mold material. A variety of other components, devices, and packages can then be assembled, e.g., over the disclosed packaging component, through the exposed regions so as to improve packaging densities.
摘要翻译： 各种示例性实施例提供半导体封装的部件，装置和方法。 所公开的封装部件可以包括设置在引线框架周围的模具材料和至少一个集成电路（IC），其中IC与引线框架的一侧电连接。 包括例如引线段的引线框架的相对侧可以从模具材料露出。 然后可以通过暴露的区域来组装各种其它部件，装置和包装件，例如超过公开的包装部件，以便改善包装密度。
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3.发明申请Ball-Grid Array Device Having Chip Assembled on Half-Etched metal Leadframe 审中-公开具有芯片组装在半蚀刻金属引线框上的球栅阵列器件公开(公告)号：US20110248392A1
公开(公告)日：2011-10-13
申请号：US12902306
申请日：2010-10-12
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L21/4828 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49582 , H01L24/73 , H01L25/105 , H01L2224/05554 , H01L2224/32245 , H01L2224/48095 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/181 , H01L2924/3511 , H01L2224/45099 , H01L2924/00012
摘要： A ball grid array device (100) based on a metallic leadframe (110) that has the footprint of a BGA package with terminals (112) in a full two-dimensional array, and combines the structure of a leadframe with the function of a substrate. At least one terminal (112a) is at the center of the device bottom. The terminals and leads (111) are made of metal having a greater thickness at the terminals than at the leads. The terminals may have a solderable surface. A semiconductor chip (120) is attached to the leadframe surface opposite the terminals, extending across adjacent leads.
摘要翻译： 一种基于金属引线框架（110）的球栅阵列器件（100），其具有完全二维阵列中具有端子（112）的BGA封装的覆盖区，并且将引线框架的结构与衬底的功能相结合 。 至少一个终端（112a）位于设备底部的中心。 端子和引线（111）由端子处的厚度大于导线的金属制成。 端子可以具有可焊接表面。 半导体芯片（120）被附接到与端子相对的引线框架表面，延伸穿过相邻引线。
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公开(公告)号：US20100091472A1
公开(公告)日：2010-04-15
申请号：US12411713
申请日：2009-03-26
CPC分类号： H01L25/105 , H01L23/3107 , H01L23/49541 , H01L23/49551 , H01L23/49589 , H01L24/16 , H01L24/31 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73253 , H01L2224/73265 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connected with one side of the lead frame. The opposite side of the lead frame including, for example, lead segments, can be exposed from the mold material. A variety of other components, devices, and packages can then be assembled, e.g., over the disclosed packaging component, through the exposed regions so as to improve packaging densities.
摘要翻译： 各种示例性实施例提供半导体封装的部件，装置和方法。 所公开的封装部件可以包括设置在引线框架周围的模具材料和至少一个集成电路（IC），其中IC与引线框架的一侧电连接。 包括例如引线段的引线框架的相对侧可以从模具材料露出。 然后可以通过暴露的区域来组装各种其它部件，装置和包装件，例如超过公开的包装部件，以便改善包装密度。
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公开(公告)号：US07531893B2
公开(公告)日：2009-05-12
申请号：US11458417
申请日：2006-07-19
IPC分类号： H01L23/495
CPC分类号： H01L23/495 , H01F17/045 , H01F27/027 , H01F27/40 , H01L23/3121 , H01L23/49575 , H01L23/645 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/16 , H01L2224/13099 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48092 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48472 , H01L2224/48599 , H01L2224/49 , H01L2224/73253 , H01L2224/73265 , H01L2224/85 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： An electronic device (100) with one or more semiconductor chips (102) has an inductor (101) assembled on or under the chips. The inductor includes a ferromagnetic body (111) and a wire (104) wrapped around the body to form at least a portion of a loop; the wire ends (104a) are connected to the chips. The assembly is attached to a substrate (103), which may be a leadframe. The device may be encapsulated in molding compound (140) so that the inductor can double as a heat spreader (111c), enhancing the thermal device characteristics.
摘要翻译： 具有一个或多个半导体芯片（102）的电子设备（100）具有组装在芯片上或芯片下的电感器（101）。 所述电感器包括铁磁体（111）和围绕所述主体缠绕以形成环的至少一部分的线（104）; 电线端部（104a）连接到芯片。 组件附接到可以是引线框架的基板（103）。 该装置可以封装在模制化合物（140）中，使得电感器可以作为散热器（111c）加倍，从而增强热装置特性。
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6.发明授权公开(公告)号：US07189938B2
公开(公告)日：2007-03-13
申请号：US11036714
申请日：2005-01-14
IPC分类号： B07C5/344
CPC分类号： H01L21/67271 , H01L21/67132 , H01L21/67144
摘要： Various preferred processes and equipment are described herein that more efficiently handle residual semiconductor parts during packaging. The processes include picking and removing all of the bad parts from a wafer before picking the good parts and picking all of the good parts first without picking any part necessary to align the wafer. The equipment includes several embodiments of a transfer machine that accommodates the efficient transfer of semiconductor parts between tacky film, waffle packs and tape and reel containment systems. Residual good parts are stored in waffle packs and can be subsequently reused in the packaging process.
摘要翻译： 本文描述了各种优选的方法和设备，其在包装期间更有效地处理残余的半导体部件。 这些过程包括在挑选好的部件之前从晶片中挑选和去除所有不良部件，并首先挑选所有的良好部件，而不需要选择任何必要的对准晶片的部分。 该设备包括转移机器的几个实施例，其适应于胶粘膜，华夫饼纸包和带卷收容系统之间的半导体部件的有效转移。 剩余的良好部件储存在华夫饼包中，随后可以在包装过程中重复使用。
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公开(公告)号：US06734532B2
公开(公告)日：2004-05-11
申请号：US10006576
申请日：2001-12-06
IPC分类号： H01L2358
CPC分类号： H01L23/562 , H01L23/3157 , H01L23/552 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/16 , H01L2924/01019 , H01L2924/01055 , H01L2924/01087 , H01L2924/04941
摘要： A semiconductor device comprising a semiconductor chip having an active and a passive surface; the active surface includes an integrated circuit and input/output pads suitable for metallurgical contacts. Further, the device has a protective plastic film (polyimide, epoxy resin, or silicone) of controlled and uniform thickness (20 to 60 &mgr;m) selectively attached to the passive surface. The film is suitable to absorb light of visible and ultraviolet wavelengths, to remain insensitive to moisture absorption, and to exert thermomechanical stress on the chip such that this stress at least partially neutralizes the stress exerted by an outside part after chip assembly.
摘要翻译： 一种半导体器件，包括具有有源和无源表面的半导体芯片; 主动表面包括集成电路和适用于冶金接触的输入/输出焊盘。 此外，该装置具有选择性地连接到被动表面的受控均匀厚度（20至60μm）的保护性塑料膜（聚酰亚胺，环氧树脂或硅树脂）。 该膜适于吸收可见光和紫外线波长的光，对吸湿不敏感，并在芯片上施加热机械应力，使得该应力至少部分地中和芯片组装后由外部部分施加的应力。
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公开(公告)号：US06555401B2
公开(公告)日：2003-04-29
申请号：US09921811
申请日：2001-08-03
IPC分类号： H01L2166
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4845 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/78301 , H01L2224/85201 , H01L2224/85205 , H01L2224/859 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/01026 , H01L2924/01004 , H01L2924/00 , H01L2924/00015 , H01L2924/013 , H01L2924/00013
摘要： A computerized system and method for inspecting and measuring a ball-shaped wire bond formed by an automated bonder pre-programmed to attach a connecting bond onto a bond pad of an integrated circuit by first obtaining a first image of said bond pad before bond attachment, then determining the coordinates of the center of said pad. Second, the bonder is instructed to attach a ball-shaped wire bond to the center of said pad. Next, a second image of said bond pad is obtained after bond attachment; this second image comprises an image of the ball-shaped portion of the bond and an image of the wire portion of said bond. The coordinates of the center of the ball-shaped portion of the bond are obtained by computer processing of the first and second images. The coordinates of the bond center and the pad center are compared, creating information for quality control of the bonder instruction and the bonding process. Finally, the bond process quality is controlled by inputting new bonder instruction for correcting any identified differences between the center coordinates.
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公开(公告)号：US6006977A
公开(公告)日：1999-12-28
申请号：US993101
申请日：1997-12-18
CPC分类号： H01L24/78 , B23K20/005 , H01L2224/78302 , H01L2224/78822 , H01L2224/78901 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01082 , H01L2924/12042 , H01L2924/14
摘要： An alignment system is provided for aligning a wire bonding capillary. The system includes at least one indicator coupled to the capillary. The system can include a plurality of indicators on the capillary and one or more detectors spaced from the capillary. An indicator and detector cooperate to produce a signal having a strength. The strength of the signal is based on the distance between the indicator and the detector. The signal strength corresponds to a rotational alignment of the capillary. The system further includes a display for displaying the strength of the signal. The at least one indicator or the at least one detector may be coupled to a computer which controls rotation of the capillary. The various system components can be incorporated into a wire bonding machine upon which the capillary is mounted.
摘要翻译： 提供了用于对准引线键合毛细管的对准系统。 该系统包括耦合到毛细管的至少一个指示器。 该系统可以包括毛细管上的多个指示器和与毛细管间隔开的一个或多个检测器。 一个指示器和检测器配合产生具有强度的信号。 信号的强度取决于指示器与检测器之间的距离。 信号强度对应于毛细管的旋转对准。 该系统还包括用于显示信号强度的显示器。 至少一个指示器或至少一个检测器可以联接到控制毛细管旋转的计算机。 各种系统部件可以结合到安装有毛细管的引线接合机中。
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公开(公告)号：US5927587A
公开(公告)日：1999-07-27
申请号：US992830
申请日：1997-12-17
CPC分类号： H01L24/78 , B23K20/005 , H01L2224/78302 , H01L2224/78822 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/14
摘要： A capillary holder is provided for holding a wire bonding capillary. The holder has a base and an extension extending therefrom to hold the capillary by contacting the capillary at at least two points. The extension can hold the capillary by frictional contact with either an inner or outer surface of the capillary. The base can either constitute a drive element or be coupled to a drive element which can be rotated by a rotation element. This imparts rotation to a capillary held by the capillary holder.
摘要翻译： 提供了用于保持引线接合毛细管的毛细管保持器。 保持器具有从其延伸的基部和延伸部，以通过在至少两个点处接触毛细管来保持毛细管。 延伸部可以通过与毛细管的内表面或外表面的摩擦接触来保持毛细管。 基座可以构成驱动元件，或者可以联接到能够被旋转元件旋转的驱动元件。 这赋予毛细管支架所保持的毛细管旋转。
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