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1.发明授权公开(公告)号：US06374149B1
公开(公告)日：2002-04-16
申请号：US09080902
申请日：1998-05-18
IPC分类号： G06F1900
CPC分类号： H01L21/681 , H01L2223/54466 , Y10S414/136
摘要： A method for determining the center (62) of a silicon wafer (54) on a wafer table (14) is provided. The method includes measuring silicon wafer data with a sensor (22). The silicon wafer data is received at a wafer center computing system (38). The coordinates of the wafer center (Xw,Yw) in a wafer table Cartesian coordinate system (72) are computed. The coordinates of the edge of the silicon wafer (54) are then determined from the wafer center coordinates (Xw,Yw).
摘要翻译： 提供了一种用于确定晶片台（14）上的硅晶片（54）的中心（62）的方法。 该方法包括用传感器（22）测量硅晶片数据。 硅晶片数据在晶片中心计算系统（38）处被接收。 计算晶圆台笛卡尔坐标系（72）中的晶片中心（Xw，Yw）的坐标。 然后，从晶片中心坐标（Xw，Yw）确定硅晶片（54）边缘的坐标。
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公开(公告)号：US06927081B2
公开(公告)日：2005-08-09
申请号：US10422545
申请日：2003-04-24
CPC分类号： G01B11/08
摘要： A method of blind assembly processing a wafer by pick and place equipment is described. This method includes determining the wafer diameter or radius and determining the bad die edge exclusive zone. This determined diameter or radius and the determined edge exclusive zone is used to make a black paper mask and place it over the wafer or to cut or saw away from the wafer the bad die edge exclusive zone. This enables the pick and place equipment to avoid the bad dies in the bad die edge exclusive zone.
摘要翻译： 描述了通过拾取和放置设备盲片组装处理晶片的方法。 该方法包括确定晶片直径或半径并确定不良裸片边缘专属区域。 该确定的直径或半径和确定的边缘独占区域用于制造黑色纸掩模并将其放置在晶片上或者从晶片上切割或锯离不良的裸片边缘专属区域。 这使得拾取和放置设备避免了坏死边缘专属区域中的坏死。
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3.发明授权Method of identifying wafer cutting positions of different size partial wafers 有权识别不同尺寸部分晶片的晶片切割位置的方法公开(公告)号：US06821866B2
公开(公告)日：2004-11-23
申请号：US10386240
申请日：2003-03-11
IPC分类号： H01L21301
CPC分类号： H01L21/67294 , H01L21/67092 , H01L21/67259 , H01L21/68 , H01L2223/54466
摘要： A tool and method is described to decide partial wafer sizes to process multiple random sizes of wafers in pick and place equipment for wafermap operation. The tool identifies the wafer and gets wafermap data. The position of one or more cutters is displayed. The position of the cutters relative to the wafer is displayed. The tool generates and displaying the results of the type of dies in each partial that would result from a cut according to said displayed position of the cutters.
摘要翻译： 描述了一种工具和方法来确定部分晶片尺寸以处理用于瓦片机操作的拾取和放置设备中的多个随机尺寸的晶片。 该工具识别晶片并获取wafermap数据。 显示一个或多个切割器的位置。 显示刀具相对于晶片的位置。 该工具生成并显示根据切割器的所述显示位置的切割产生的每个部分中的模具类型的结果。
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4.发明申请Semiconductor Wafer Adapted to Support Transparency in Partial Wafer Processing 审中-公开半导体晶片适用于支持部分晶圆处理中的透明度公开(公告)号：US20130214388A1
公开(公告)日：2013-08-22
申请号：US13400219
申请日：2012-02-20
IPC分类号： H01L23/544 , H01L21/66
CPC分类号： H01L23/544 , H01L22/14 , H01L22/20 , H01L2223/54426 , H01L2223/54453 , H01L2223/54466 , H01L2223/54493 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor wafer is adapted to support partial wafer processing generally transparently to a facility capable of processing a full wafer. The wafer has provided thereon a plurality of semiconductor dice and a plurality of visible reference features. The reference features are positioned among the dice to support a predetermined partitioning of the wafer into partial wafers. The positioning of the reference features may render each partial wafer uniquely visually distinguishable from every other partial wafer. Each partial wafer may contain at least one of the reference features, with the position of each reference feature identified in accordance with a coordinate system of an electronic wafer map. The positioning of the reference features may provide a visual indication of where to cut the wafer to effect the partitioning.
摘要翻译： 半导体晶片适于通常透明地支持能够处理整个晶片的设备的部分晶片处理。 晶片在其上设置有多个半导体管芯和多个可见参考特征。 参考特征位于骰子之间，以支持将晶片预定分割成部分晶片。 参考特征的定位可以使得每个部分晶片在每个其他部分晶片之间独特地可视地区分。 每个部分晶片可以包含参考特征中的至少一个，每个参考特征的位置根据电子晶片图的坐标系确定。 参考特征的定位可提供在何处切割晶片以实现分割的视觉指示。
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公开(公告)号：US06756796B2
公开(公告)日：2004-06-29
申请号：US10216454
申请日：2002-08-09
IPC分类号： G01R31302
CPC分类号： H01L21/67259 , H01L21/67271 , H01L21/68 , H01L23/544 , H01L2223/54453 , H01L2223/54466 , H01L2924/0002 , H01L2924/00
摘要： An improved method for pick and place equipment operation is provided by an improved method for identifying the reference die on a wafer. A recording of good die, partial die, mirror die, and partial mirror die information about the neighboring dies about the reference die is formed by recording step is performed by starting at the reference die and moving clockwise about the reference die one die at a time to form a stored neighborhood matrix. Searching and identifying the reference die on a wafer includes aligning the wafer table with a wafer thereon at the reference die location coordinates determined by the recording step and starting at this location moving the wafer table one die at a time about the aligned reference die recording the neighboring die or partial die as full good die, partial die, mirror die, or partial mirror die and comparing to the information about dies or partial dies neighboring said reference die to identify the reference die.
摘要翻译： 用于拾取和放置设备操作的改进方法通过用于在晶片上识别参考管芯的改进方法来提供。 通过记录步骤通过记录步骤通过记录步骤在参考模具处开始并一次一周地围绕参考模具一个模具顺时针移动来进行记录关于围绕参考管芯的相邻模具的良好模具，部分模具，镜模具和部分反射镜模具信息 以形成存储的邻域矩阵。 在晶片上搜索和识别参考裸片包括：在由记录步骤确定的参考管芯位置坐标处将晶片台与晶片对准，并从该位置开始移动晶片台一个管芯，该时间是在对准的参考管芯记录 相邻的模具或部分模具作为完全良好的模具，部分模具，镜模具或部分反射镜模具，并且与与所述参考模具相邻的模具或部分模具的信息进行比较以识别参考模具。
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6.发明授权Method of arranging dies in a wafer for easy inkless partial wafer process 有权在晶片中设置模具以方便无油部分晶片工艺的方法公开(公告)号：US07915087B2
公开(公告)日：2011-03-29
申请号：US12418909
申请日：2009-04-06
IPC分类号： H01L21/00
CPC分类号： H01L21/67294 , H01L21/78
摘要： In a method and system for fabricating a full wafer (600) having dies, an orientation marker (606), and a reference die (608), includes configuring a reticle pattern (602) that is configured by arranging the dies in an array having m rows and n columns, where the m rows start in a row adjacent to the orientation marker (606), and m and n are integers. The reticle pattern (602) is transferred to the full wafer (600) to sequentially form a portion of the dies. The transferring includes placing an inkless marker (620) in the form of one or more non-circuit dies between the n columns of adjacent reticle patterns. The reticle pattern (602) is repeatedly transferred to form a remaining portion of the dies to complete the full wafer (600). A wafer map for the full wafer (600) is stored, with the wafer map including a non-circuit bin containing data describing the inkless marker (620).
摘要翻译： 在用于制造具有管芯的全晶片（600）的方法和系统中，定向标记（606）和参考管芯（608）包括配置掩模版图案（602），该掩模版图案 m行和n列，其中m行以与定向标记（606）相邻的行开始，并且m和n是整数。 标线图案（602）被传送到全晶片（600）以顺序地形成一部分模具。 转移包括在相邻标线图案的n列之间放置一个或多个非电路管芯形式的无墨标记（620）。 重复转印标线图案（602）以形成模具的剩余部分以完成全晶片（600）。 存储用于全晶片（600）的晶片图，其中晶片图包括包含描述无墨标记（620）的数据的非电路箱。
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7.发明申请Method of Arranging Dies in a Wafer for Easy Inkless Partial Wafer Process 有权将晶片上的芯片排列成易于无墨部分晶片工艺的方法公开(公告)号：US20090191689A1
公开(公告)日：2009-07-30
申请号：US12418909
申请日：2009-04-06
IPC分类号： H01L21/78
CPC分类号： H01L21/67294 , H01L21/78
摘要： In a method and system for fabricating a full wafer (600) having dies, an orientation marker (606), and a reference die (608), includes configuring a reticle pattern (602) that is configured by arranging the dies in an array having m rows and n columns, where the m rows start in a row adjacent to the orientation marker (606), and m and n are integers. The reticle pattern (602) is transferred to the full wafer (600) to sequentially form a portion of the dies. The transferring includes placing an inkless marker (620) in the form of one or more non-circuit dies between the n columns of adjacent reticle patterns. The reticle pattern (602) is repeatedly transferred to form a remaining portion of the dies to complete the full wafer (600). A wafer map for the full wafer (600) is stored, with the wafer map including a non-circuit bin containing data describing the inkless marker (620).
摘要翻译： 在用于制造具有管芯的全晶片（600）的方法和系统中，定向标记（606）和参考管芯（608）包括配置掩模版图案（602），该掩模版图案 m行和n列，其中m行以与定向标记（606）相邻的行开始，并且m和n是整数。 标线图案（602）被传送到全晶片（600）以顺序地形成一部分模具。 转移包括在相邻标线图案的n列之间放置一个或多个非电路管芯形式的无墨标记（620）。 重复转印标线图案（602）以形成模具的剩余部分以完成全晶片（600）。 存储用于全晶片（600）的晶片图，其中晶片图包括包含描述无墨标记（620）的数据的非电路箱。
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8.发明授权Method of arranging dies in a wafer for easy inkless partial wafer process 有权在晶片中设置模具以方便无油部分晶片工艺的方法公开(公告)号：US07534655B2
公开(公告)日：2009-05-19
申请号：US11545191
申请日：2006-10-10
IPC分类号： H01L21/00
CPC分类号： H01L21/67294 , H01L21/78
摘要： In a method and system for fabricating a full wafer (600) having dies, an orientation marker (606), and a reference die (608), includes configuring a reticle pattern (602) that is configured by arranging the dies in an array having m rows and n columns, where the m rows start in a row adjacent to the orientation marker (606), and m and n are integers. The reticle pattern (602) is transferred to the full wafer (600) to sequentially form a portion of the dies. The transferring includes placing an inkless marker (620) in the form of one or more non-circuit dies between the n columns of adjacent reticle patterns. The reticle pattern (602) is repeatedly transferred to form a remaining portion of the dies to complete the full wafer (600). A wafer map for the full wafer (600) is stored, with the wafer map including a non-circuit bin containing data describing the inkless marker (620).
摘要翻译： 在用于制造具有管芯的全晶片（600）的方法和系统中，定向标记（606）和参考管芯（608）包括配置掩模版图案（602），该掩模版图案 m行和n列，其中m行以与定向标记（606）相邻的行开始，并且m和n是整数。 标线图案（602）被传送到全晶片（600）以顺序地形成一部分模具。 转移包括在相邻标线图案的n列之间放置一个或多个非电路管芯形式的无墨标记（620）。 重复转印标线图案（602）以形成模具的剩余部分以完成全晶片（600）。 存储用于全晶片（600）的晶片图，其中晶片图包括包含描述无墨标记（620）的数据的非电路箱。
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9.发明申请Method of arranging dies in a wafer for easy inkless partial wafer process 有权在晶片中设置模具以方便无油部分晶片工艺的方法公开(公告)号：US20080085588A1
公开(公告)日：2008-04-10
申请号：US11545191
申请日：2006-10-10
IPC分类号： H01L21/00
CPC分类号： H01L21/67294 , H01L21/78
摘要： In a method and system for fabricating a full wafer (600) having dies, an orientation marker (606), and a reference die (608), includes configuring a reticle pattern (602) that is configured by arranging the dies in an array having m rows and n columns, where the m rows start in a row adjacent to the orientation marker (606), and m and n are integers. The reticle pattern (602) is transferred to the full wafer (600) to sequentially form a portion of the dies. The transferring includes placing an inkless marker (620) in the form of one or more non-circuit dies between the n columns of adjacent reticle patterns. The reticle pattern (602) is repeatedly transferred to form a remaining portion of the dies to complete the full wafer (600). A wafer map for the full wafer (600) is stored, with the wafer map including a non-circuit bin containing data describing the inkless marker (620).
摘要翻译： 在用于制造具有管芯的全晶片（600）的方法和系统中，定向标记（606）和参考管芯（608）包括配置掩模版图案（602），该掩模版图案 m行和n列，其中m行以与定向标记（606）相邻的行开始，并且m和n是整数。 标线图案（602）被传送到全晶片（600）以顺序地形成一部分模具。 转移包括在相邻标线图案的n列之间放置一个或多个非电路管芯形式的无墨标记（620）。 重复转印标线图案（602）以形成模具的剩余部分以完成全晶片（600）。 存储用于全晶片（600）的晶片图，其中晶片图包括包含描述无墨标记（620）的数据的非电路箱。
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公开(公告)号：US07015068B2
公开(公告)日：2006-03-21
申请号：US10158885
申请日：2002-06-03
IPC分类号： H01L21/44
CPC分类号： H01L23/544 , H01L2223/54453 , H01L2223/54466 , H01L2924/0002 , H01L2924/00
摘要： A method of processing a partial wafer in accordance with one embodiment comprises includes after of loading partial wafer into wafer table of pick and place equipment after saw; downloading wafer map data for the wafer from wafer map data host. If the partial wafer has a reference die then positioning the wafer table to the reference die and then moving the wafer table to the last column of the partial wafer. If the partial wafer does not have a reference die the last column (LCOLUMN) information is obtained from wafer map data header field in one embodiment and using LCOLUMN information remove all dies in the right side of partial wafer map. The wafer table is moved to pseudo reference die which is the first die in the bottom right. The pseudo reference die coordinate (x1, y1) is calculated where x1=first column from right to left that has a die in the wafer map data and y1=first bottom most row in the column x1 from the wafer map data. If this partial wafer is not the last partial wafer of this wafer, the wafer table is moved to the last left column (LCOLUMN) of the partial wafer. The LCOLUMN is set as complete if this is the last partial wafer and then the LCOLUMN is updated in the wafer map data header field in the original wafer map. The LCOLUMN information is used remove all dies from the wafer map data that are not part of this partial wafer. The LCOLUMN is updated in the wafer map data header field. The wafer map data file is saved for next partial wafer of the same wafer to process in the pick and place equipment and the then pick and place operation.
摘要翻译： 根据一个实施例的处理部分晶片的方法包括：将部分晶片装入锯片后的拾取和放置设备的晶片台中; 从晶片地图数据主机下载晶片的晶片地图数据。 如果部分晶片具有参考管芯，则将晶片台定位到参考管芯，然后将晶片台移动到部分晶片的最后一列。 如果部分晶片没有参考芯片，则在一个实施例中从晶片映射数据头字段获得最后一列（LCOLUMN）信息，并且使用LCOLUMN信息去除部分晶片映射图右侧的所有裸片。 将晶片台移动到右下角的第一个模具的伪参考模具。 计算伪参考管芯坐标（x 1，y 1），其中x 1 =在晶片映射数据中具有管芯的从右到左的第一列，并且y 1 =晶片映射中的列x 1中的第一最下行 数据。 如果该部分晶片不是该晶片的最后部分晶片，则将晶片台移动到部分晶片的最左列（LCOLUMN）。 如果这是最后一个部分晶片，则LCOLUMN被设置为完整，然后在原始晶片图中的晶片映射数据头字段中更新LCOLUMN。 使用LCOLUMN信息从晶片映射数据中除去不属于该部分晶片的所有管芯。 在晶片地图数据头字段中更新LCOLUMN。 为相同晶片的下一个部分晶片保存晶圆地图数据文件，以在拾取和放置设备中进行处理，然后进行拾取和放置操作。
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