公开(公告)号：US20150221603A1

公开(公告)日：2015-08-06

申请号：US14563636

申请日：2014-12-08

Applicant: Broadcom Corporation

Inventor： Lynn Ooi ,  Sampath K.V. Karikalan

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L22/32 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embodiments described herein generally relate to connections for integrated circuit (IC) dies. For example, in an embodiment an integrated circuit (IC) die is provided. The IC die includes a plurality of clusters of pads formed on a surface of the IC die, each cluster being associated with a respective circuit formed in the IC die. Each cluster includes a plurality of micropads each electrically coupled to the circuit associated with the cluster through a respective via and a sacrificial pad coupled to the circuit through the plurality of micropads, the sacrificial pad being larger than each of the micropads.

Abstract translation: 本文描述的实施例通常涉及用于集成电路（IC）管芯的连接。 例如，在一个实施例中，提供集成电路（IC）管芯。 IC芯片包括形成在IC芯片的表面上的多个焊盘群，每个簇与形成在IC管芯中的相应电路相关联。 每个集群包括多个微型焊盘，每个微焊盘通过相应的通孔电耦合到与集束相关的电路，以及通过多个微焊盘耦合到电路的牺牲焊盘，所述牺牲焊盘大于每个微焊盘。

公开(公告)号：US20140151900A1

公开(公告)日：2014-06-05

申请号：US14175985

申请日：2014-02-07

Applicant: BROADCOM CORPORATION

Inventor： Kevin Kunzhong HU ,  Sam Ziqun Zhao ,  Rezaur Rahman Khan ,  Pieter Vorenkamp ,  Sampath K.V. Karikalan ,  Xiangdong Chen

IPC: H01L23/48 ,  H01L21/50

CPC classification number: H01L25/105 ,  H01L21/50 ,  H01L21/78 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/24011 ,  H01L2224/24146 ,  H01L2224/2919 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/821 ,  H01L2224/83 ,  H01L2224/9202 ,  H01L2224/92133 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: An exemplary implementation of the present disclosure includes a stacked package having a top die from a top reconstituted wafer situated over a bottom die from a bottom reconstituted wafer. The top die and the bottom die are insulated from one another by an insulation arrangement. The top die and the bottom die are also interconnected through the insulation arrangement. The insulation arrangement can include a top molding compound that flanks the top die and a bottom molding compound that flanks the bottom die. The top die and the bottom die can be interconnected through at least the top molding compound. Furthermore, the top die and the bottom die can be interconnected through a conductive via that extends within the insulation arrangement.

Abstract translation: 本公开的示例性实施方案包括具有来自位于底部重构晶片的底模上方的顶部重构晶片的顶模的堆叠封装。 顶部模具和底部模具通过绝缘装置彼此绝缘。 顶模和底模也通过绝缘装置互连。 绝缘装置可以包括在顶模侧面的顶部模塑料和位于底模侧面的底部模塑料。 顶部模具和底部模具可以通过至少顶部模塑料相互连接。 此外，顶模和底模可以通过在绝缘装置内延伸的导电通孔相互连接。