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    DISPLAY PANEL AND MANUFACTURING METHOD
    2.
    发明申请
    DISPLAY PANEL AND MANUFACTURING METHOD 有权

    公开(公告)号：US20210399185A1

    公开(公告)日：2021-12-23

    申请号：US17283512

    申请日：2020-05-08

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Dongni LIU ,  Minghua XUAN ,  Chao LIU ,  Yingwei LIU

    IPC: H01L33/62 ,  H01L33/00

    Abstract: The present disclosure provides a display panel and a manufacturing method. The display panel includes: a base substrate including a display surface and a display back surface arranged opposite to each other, and a side surface connected to the display surface and the display back surface; a plurality of first wirings on the display surface of the base substrate; a plurality of second wirings on the display back surface of the base substrate; a transition body on the side surface of the base substrate and in contact with the first wirings and the second wirings, a surface of the transition body away from the side surface being a smooth curved surface; and a plurality of connection lines covering an outer surface of the transition body, each first wiring being electrically connected to a corresponding second wiring via a corresponding connection line.

    DRIVING SUBSTRATE, METHOD FOR PREPARING THE SAME, AND DISPLAY DEVICE
    3.
    发明申请
    DRIVING SUBSTRATE, METHOD FOR PREPARING THE SAME, AND DISPLAY DEVICE 有权

    公开(公告)号：US20210359184A1

    公开(公告)日：2021-11-18

    申请号：US17265806

    申请日：2020-05-13

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Zhanfeng CAO ,  Yingwei LIU ,  Ke WANG ,  Dongni LIU ,  Minghua XUAN ,  Guangcai YUAN ,  Lei CHEN ,  Xue DONG

    IPC: H01L33/62 ,  G09G3/00 ,  G09G3/32

    Abstract: The present disclosure provides a driving substrate, a method for preparing the same, and a flexible display device. The driving substrate includes: a base substrate; a first driving function layer arranged on a first surface of the base substrate, the first driving function layer including a plurality of driving thin film transistors and a plurality of signal wirings, and at least one of the plurality of signal wirings being of a single-layer structure and having a thickness greater than a threshold; a pad layer arranged on a surface of the first driving function layer away from the base substrate, the pad layer including a plurality of first pads and a plurality of second pads, and each first pad being connected to a first electrode of the corresponding driving thin film transistor and each second pad being connected to a common electrode line in the plurality of signal wirings.

    DISPLAY PANEL, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
    4.
    发明申请
    DISPLAY PANEL, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE 有权

    公开(公告)号：US20210305283A1

    公开(公告)日：2021-09-30

    申请号：US17265228

    申请日：2020-05-19

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Muxin DI ,  Zhiwei LIANG ,  Yingwei LIU ,  Ke WANG ,  Zhanfeng CAO ,  Guangcai YUAN

    IPC: H01L27/12 ,  H01L23/498 ,  H01L25/075 ,  H01L29/786 ,  H01L33/62

    Abstract: A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.

    SUBSTRATE INTEGRATED WITH PASSIVE DEVICES AND MANUFACTURING METHOD THEREOF
    5.
    发明公开
    SUBSTRATE INTEGRATED WITH PASSIVE DEVICES AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20240153871A1

    公开(公告)日：2024-05-09

    申请号：US17773106

    申请日：2021-04-23

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Zhanfeng CAO ,  Jin YANG ,  Yingwei LIU ,  Ke WANG ,  Haixu LI

    IPC: H01L23/522 ,  H01F41/04

    CPC classification number: H01L23/5227 ,  H01F41/04 ,  H01L23/5222 ,  H01L23/5226

    Abstract: A substrate integrated with passive devices and a manufacturing method thereof are provided. The manufacturing method of the substrate integrated with passive devices includes: integrating the passive devices on a transparent dielectric layer; forming the passive devices includes at least forming an inductor, wherein the inductor includes first sub-structures on a first surface thereof and second sub-structures on a second surface thereof, and first connection electrodes in first connection vias, respectively, to sequentially connect the first sub-structures and the second sub-structures together; forming the inductor includes: forming a first metal film layer on the first surface and/or the second surface, and forming the first connection electrodes in the first connection vias through an electroplating process, to fill the first connection vias; and forming a pattern including the first sub-structures on the first surface and a pattern including the second sub-structures on the second surface, through patterning processes, respectively.

    SUBSTRATE INTEGRATED WITH PASSIVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
    6.
    发明公开
    SUBSTRATE INTEGRATED WITH PASSIVE DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20240047507A1

    公开(公告)日：2024-02-08

    申请号：US17641135

    申请日：2021-04-23

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Yingwei LIU ,  Zhanfeng CAO ,  Ke WANG

    IPC: H01L23/66 ,  H01L23/522

    CPC classification number: H01L28/10 ,  H01L23/5227 ,  H01L23/66 ,  H01L28/60 ,  H01L2223/6672

    Abstract: The present disclosure provides a substrate integrated with a passive device and a method for manufacturing the same. The method includes: providing and processing a transparent dielectric layer to obtain the transparent dielectric layer provided with a first connection via therein, with the transparent dielectric layer including a first surface and a second surface which are disposed oppositely; and integrating a passive device, which includes at least an inductor, on the transparent dielectric layer. The integrating a passive device on the transparent dielectric layer includes: forming a first sub-structure on the first surface of the transparent dielectric layer, forming a second sub-structure on the second surface of the transparent dielectric layer, and forming a first connection electrode in the first connection via; and the first sub-structure, the first connection electrode and the second sub-structure are connected to form a coil structure of the inductor.

    DRIVING BACKPLANE FOR DISPLAY AND METHOD OF MANUFACTURING THE SAME, DISPLAY PANEL, AND DISPLAY APPARATUS
    8.
    发明申请
    DRIVING BACKPLANE FOR DISPLAY AND METHOD OF MANUFACTURING THE SAME, DISPLAY PANEL, AND DISPLAY APPARATUS 有权

    公开(公告)号：US20220223775A1

    公开(公告)日：2022-07-14

    申请号：US17615075

    申请日：2020-11-04

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Yingwei LIU ,  Zhanfeng CAO ,  Zhiwei LIANG ,  Ke WANG ,  Muxin DI ,  Shuang LIANG ,  Yankai GAO

    IPC: H01L33/62 ,  H01L33/00 ,  H01L33/38 ,  H01L25/075 ,  G09F9/302

    Abstract: A method of manufacturing a driving backplane for display includes: forming a first conductive pattern layer including first conductive lines on a base; and forming a second conductive pattern layer including electrode groups and second conductive lines on a side of the first conductive pattern layer away from the base. The first conductive lines and the second conductive lines cross and are insulated from each other; an electrode group includes a first electrode and a second electrode electrically connected to a corresponding second conductive line. Orthogonal projections, on the base, of the first electrode and a corresponding first conductive line have an overlapping region, and a portion of the first electrode, whose orthogonal projection on the base is located in the overlapping region, is in contact with a portion of the first conductive line, whose orthogonal projection on the base is located in the overlapping region.

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