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公开(公告)号:US20240297177A1
公开(公告)日:2024-09-05
申请号:US18026508
申请日:2022-06-23
Applicant: BOE Technology Group Co., Ltd.
Inventor: Lizhong WANG , Jin YANG , Tianmin ZHOU , Hui GUO
IPC: H01L27/12 , G02F1/1343 , G02F1/1362 , G02F1/1368
CPC classification number: H01L27/124 , G02F1/134309 , G02F1/136286 , G02F1/1368 , H01L27/1248
Abstract: The present disclosure provides a display substrate, a display panel and a display apparatus. The display substrate includes a base substrate; a transistor, located on the base substrate, and including an active layer; and a data line, located between the active layer and the base substrate; the data line is connected with the active layer, and an orthographic projection of the active layer on the base substrate is located in an orthographic projection of the data line on the base substrate.
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公开(公告)号:US20170194224A1
公开(公告)日:2017-07-06
申请号:US15321172
申请日:2016-02-01
Inventor: Fan YANG , Kun GUO , Yuqing YANG , Qi LIU , Bo ZHANG , Fei CHEN , Tianyi CHENG , Zihua LI , Yan WU , Jin YANG , Liman PENG , Chao KONG
IPC: H01L23/08 , H01L23/24 , H01L23/13 , H01L23/053 , H01L23/15
CPC classification number: H01L23/08 , G02F1/133351 , G02F1/1339 , G02F1/13452 , H01L23/053 , H01L23/13 , H01L23/15 , H01L23/24 , H01L51/525
Abstract: A display panel and a method for forming the same are disclosed. The display panel includes a first substrate and a second substrate arranged opposite to each other. An integrated circuit (IC) is arranged at a non-display region of the first substrate, and at least one supporting component is arranged beyond a portion of the non-display region where the IC is arranged. A thickness of the at least one supporting component is larger than a thickness of the IC.
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公开(公告)号:US20210175320A1
公开(公告)日:2021-06-10
申请号:US17181124
申请日:2021-02-22
Inventor: Liman PENG , Qi LIU , Dianjie HOU , Xueguang HAO , Jin YANG , Zihua LI , Yan WU , Guoping ZHANG , Haifeng XU , Lei WANG , Wenxiu LI , Jianqiang WANG , Fan YANG
IPC: H01L27/32
Abstract: The present disclosure discloses an organic light emitting display device. The organic light emitting display device includes a substrate, an initializing voltage input line, a first electrode line, a thin film transistor, and an organic light emitting diode arranged on the substrate. The thin film transistor includes a first electrode, a second electrode and a control electrode, and the first electrode is coupled to the first electrode line, the initializing voltage input line is provided in the same layer and is made of the same material as one of the first electrode, the second electrode and the control electrode of the thin film transistor, and an extension direction of the initializing voltage input line is substantially the same as an extension direction of the first electrode line.
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公开(公告)号:US20240153871A1
公开(公告)日:2024-05-09
申请号:US17773106
申请日:2021-04-23
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Zhanfeng CAO , Jin YANG , Yingwei LIU , Ke WANG , Haixu LI
IPC: H01L23/522 , H01F41/04
CPC classification number: H01L23/5227 , H01F41/04 , H01L23/5222 , H01L23/5226
Abstract: A substrate integrated with passive devices and a manufacturing method thereof are provided. The manufacturing method of the substrate integrated with passive devices includes: integrating the passive devices on a transparent dielectric layer; forming the passive devices includes at least forming an inductor, wherein the inductor includes first sub-structures on a first surface thereof and second sub-structures on a second surface thereof, and first connection electrodes in first connection vias, respectively, to sequentially connect the first sub-structures and the second sub-structures together; forming the inductor includes: forming a first metal film layer on the first surface and/or the second surface, and forming the first connection electrodes in the first connection vias through an electroplating process, to fill the first connection vias; and forming a pattern including the first sub-structures on the first surface and a pattern including the second sub-structures on the second surface, through patterning processes, respectively.
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公开(公告)号:US20220215793A1
公开(公告)日:2022-07-07
申请号:US17509899
申请日:2021-10-25
Applicant: BOE Technology Group Co., Ltd.
Inventor: Seungwoo HAN , Haoliang ZHENG , Dongni LIU , Li XIAO , Liang CHEN , Hao CHEN , Jiao ZHAO , Jin YANG , Minghua XUAN
IPC: G09G3/32
Abstract: The present disclosure provides a display apparatus, a pixel circuit and a method of driving a pixel circuit. In one or more embodiments, the pixel circuit includes a driving transistor, a data signal module and a bias signal module. A first electrode of the driving transistor is connected with a first power signal terminal, a second electrode of the driving transistor is connected with a first terminal of a light emitting element, and the driving transistor includes a first control electrode and a second control electrode. The data signal module is connected with the driving transistor, a data writing signal terminal and a data signal terminal. The bias signal module is connected with the driving transistor, a bias writing signal terminal and a bias signal terminal, and is configured to adjust a threshold voltage of the driving transistor under control of the bias writing signal terminal and the bias signal terminal.
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公开(公告)号:US20240379631A1
公开(公告)日:2024-11-14
申请号:US18691021
申请日:2021-10-22
Applicant: BOE Technology Group Co., Ltd.
Inventor: Nianqi YAO , Jin YANG , Ce NING , Jiayu HE , Jie HUANG , Hehe HU , Kun ZHAO , Feifei LI , Zhengliang LI , Guangcai YUAN
Abstract: A light-emitting substrate and a display device are disclosed, the light-emitting substrate includes: a base substrate including a light-emitting region; a plurality of first pads on a side of the base substrate and in the light-emitting region, where a material of the first pads includes Cu; and an oxidation protection layer on a side of the first pads away from the base substrate, where the plurality of first pads is used for bonding connection with a plurality of light-emitting units through the oxidation protection layer, a material of the oxidation protection layer includes CuNiX, and X includes one or any combination of Al, Sn, Pb, Au, Ag, In, Zn, Bi, Mg, Ga, V, W, Y, Zr, Mo, Nb, Pt, Co or Sb.
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公开(公告)号:US20230098150A1
公开(公告)日:2023-03-30
申请号:US17041162
申请日:2020-04-29
Inventor: Liman PENG , Qi LIU , Liangliang LIU , Jianqiang WANG , Yan WU , Jin YANG
IPC: H10K59/122 , H10K71/00
Abstract: The disclosure provides an OLED display substrate, a manufacturing method thereof, and a display device, wherein the OLED display substrate is provided with a display area and an edge area surrounding the display area, the OLED display substrate includes a back plate and a pixel-defining layer on the back plate, and a protrusion is provided on the back plate at the edge area of the OLED display substrate.
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公开(公告)号:US20200185483A1
公开(公告)日:2020-06-11
申请号:US16531258
申请日:2019-08-05
Inventor: Liman PENG , Qi LIU , Yan WU , Jin YANG , Qianqian ZHANG , Zhiyong XUE
Abstract: An organic light emitting diode array substrate and an electronic device. The organic light emitting diode array substrate includes a display region, and a first package test electrode and a first package test lead which are outside the display region. The display region includes a first power supply line and a first signal line; the first package test lead is configured to connect the first package test electrode with the first power supply line to provide a first supply voltage for the display region; the first signal line is configured to provide a first electrical signal for the display region; and a thermal conductivity of the first package test lead is higher than a thermal conductivity of the first signal line.
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公开(公告)号:US20190165082A1
公开(公告)日:2019-05-30
申请号:US15970996
申请日:2018-05-04
Inventor: Liman PENG , Qi LIU , Jin YANG , Zihua LI , Yan WU , Guoping ZHANG , Haifeng XU , Wenxiu LI , Lei WANG , Jianqiang WANG , Fan YANG
Abstract: The present disclosure discloses a backplane for an organic light emitting display device, a method for fabricating the same, and an organic light emitting display apparatus. The backplane includes a substrate on which a wiring structure and a thin film transistor are provided, wherein the wiring structure includes an initializing voltage input line which is provided in the same layer and made of the same material as electrodes of the thin film transistor.
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