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公开(公告)号：US20250040049A1
公开(公告)日：2025-01-30
申请号：US18043219
申请日：2022-02-21
Inventor： Chao LIU , Ting CAI , Ming ZHAI , Lili WANG , Jing WANG , Mingming JIA , Sha FENG , Enkai DONG , Haiwei SUN , Ke WANG
Abstract: A wiring board includes a mother board and a daughter board that are stacked, a bonding layer disposed between the mother board and the daughter board, and at least one side wiring. The mother board includes a first substrate, and a first wiring layer disposed on the first substrate and including at least one first connection pad. The daughter board is disposed on a side of the first substrate away from the first wiring layer. The daughter board includes a second substrate, and a second wiring layer disposed on the second substrate and including at least one second connection pad. The at least one side wiring is connected, via a respective end thereof, to the at least one first connection pad in one-to-one correspondence, and the at least one side wiring is connected, via respective another end thereof, to the at least one second connection pad in one-to-one correspondence.
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公开(公告)号：US20230043951A1
公开(公告)日：2023-02-09
申请号：US17790308
申请日：2021-08-31
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ke WANG , Zhanfeng CAO , Xinhong LU , Qi QI , Yan QU , Zhiwei LIANG , Yingwei LIU , Dapeng XUE , Guoqiang WANG , Jianguo WANG , Song LIU , Yongfei LI , Ting ZENG , Huan LIU , Wanru DONG , Heren GUI , Jian YANG , Haifeng HU , Yu JIANG , Peng XU , Weiwei CHU , Qi GAO
IPC: H01L33/62 , H01L25/075 , H01L21/48 , H01L23/498
Abstract: An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer . The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.
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公开(公告)号：US20220352000A1
公开(公告)日：2022-11-03
申请号：US17427628
申请日：2020-10-30
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Haixu LI , Xiao ZHANG , Fei WANG , Mingxing WANG , Shulei LI , Xue DONG , Guangcai YUAN , Zhanfeng CAO , Xin GU , Ke WANG , Feng QU , Xuan LIANG , Junwei YAN
IPC: H01L21/683 , H01L25/075 , H01L33/62
Abstract: A light-emitting diode substrate, a manufacturing method thereof, and a display device are disclosed. The manufacturing method of the light-emitting diode substrate includes: forming an epitaxial layer group of M light-emitting diode chips on a substrate; transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate, an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2.
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公开(公告)号：US20220131044A1
公开(公告)日：2022-04-28
申请号：US17407919
申请日：2021-08-20
Applicant: BOE Technology Group Co., Ltd.
Inventor： Haixu LI , Mingxing WANG , Guangcai YUAN , Zhanfeng CAO , Ke WANG , Feng QU
IPC: H01L33/38 , H01L27/15 , H01L25/075 , H01L33/62
Abstract: A driving backplane, a display panel and a display apparatus are provided. The driving backplane includes: a base substrate, and a plurality of connection electrode groups and a plurality of correction structures disposed on the base substrate, each of the connection electrode groups includes: a first connection electrode and a second connection electrode the first connection electrode and the second connection electrode are arranged on a same layer; a first gap is formed between the first connection electrode and the second connection electrode, and a first group of opposite edges includes: an edge, close to the first gap, of the first connection electrode; and an edge, close to the first gap, of the second connection electrode; a second group of opposite edges includes: an edge, far away from the first gap, of the first connection electrode; and an edge, far away from the first gap, of the second connection electrode.
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公开(公告)号：US20220121072A1
公开(公告)日：2022-04-21
申请号：US17281709
申请日：2020-01-10
Applicant: BOE Technology Group Co., Ltd.
Inventor： Liang CHEN , Minghua XUAN , Dongni LIU , Haoliang ZHENG , Li XIAO , Zhenyu ZHANG , Hao CHEN , Ke WANG
IPC: G02F1/1362 , H01L27/32
Abstract: The present disclosure discloses a display panel and a display device. The display panel includes: a base substrate, including a plurality of substrate via holes located in a display area of the display panel; and a plurality of driving signal lines and a plurality of bonding terminals, respectively located on different sides of the base substrate. At least one of the plurality of driving signal lines is electrically connected to at least one of the plurality of bonding terminals through the substrate via hole(s).
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Patent Agency Ranking
公开(公告)号：US20220115572A1
公开(公告)日：2022-04-14
申请号：US17280387
申请日：2020-01-22
Applicant: BOE Technology Group Co., Ltd.
Abstract: The present application discloses a drive backplane and a preparation method thereof, a display panel, and a display device. The drive backplane includes a flexible substrate provided with a first via hole; a first passivation layer located on a side of the flexible substrate and provided with a second via hole, an orthographic projection of the second via hole being at least partially overlapped with an orthographic projection of the first via hole; a thin film transistor located on a side, facing away from the flexible substrate, of the first passivation layer; and an electrical connecting structure, including a signal trace and a connecting terminal.
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公开(公告)号：US20210359184A1
公开(公告)日：2021-11-18
申请号：US17265806
申请日：2020-05-13
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhanfeng CAO , Yingwei LIU , Ke WANG , Dongni LIU , Minghua XUAN , Guangcai YUAN , Lei CHEN , Xue DONG
Abstract: The present disclosure provides a driving substrate, a method for preparing the same, and a flexible display device. The driving substrate includes: a base substrate; a first driving function layer arranged on a first surface of the base substrate, the first driving function layer including a plurality of driving thin film transistors and a plurality of signal wirings, and at least one of the plurality of signal wirings being of a single-layer structure and having a thickness greater than a threshold; a pad layer arranged on a surface of the first driving function layer away from the base substrate, the pad layer including a plurality of first pads and a plurality of second pads, and each first pad being connected to a first electrode of the corresponding driving thin film transistor and each second pad being connected to a common electrode line in the plurality of signal wirings.
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公开(公告)号：US20210305283A1
公开(公告)日：2021-09-30
申请号：US17265228
申请日：2020-05-19
Applicant: BOE Technology Group Co., Ltd.
Inventor： Muxin DI , Zhiwei LIANG , Yingwei LIU , Ke WANG , Zhanfeng CAO , Guangcai YUAN
IPC: H01L27/12 , H01L23/498 , H01L25/075 , H01L29/786 , H01L33/62
Abstract: A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.
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公开(公告)号：US20210223631A1
公开(公告)日：2021-07-22
申请号：US16958564
申请日：2019-12-11
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Shengguang BAN , Zhanfeng CAO , Ke WANG
IPC: G02F1/1335 , G02F1/13357
Abstract: A backlight assembly, a manufacturing method thereof, and a display device are provided. The backlight assembly includes: a substrate, an anode trace and a cathode trace of an LED on the substrate, a planarization layer on a layer where the anode trace and the cathode trace of the LED are located, and an anode connection pad and a cathode connection pad on the planarization layer. The anode trace of the LED is coupled to the anode connection pad through a first via hole penetrating through the planarization layer, and the cathode trace of the LED is coupled to the cathode connection pad through a second via hole penetrating through the planarization layer. An exhaust channel is further arranged on the planarization layer to discharge gas accumulated in the planarization layer.
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公开(公告)号：US20210125549A1
公开(公告)日：2021-04-29
申请号：US17081834
申请日：2020-10-27
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ke WANG , Zhanfeng CAO
Abstract: A driving backplane includes a base, electroplating electrodes and driving electrodes. The base has first through holes in a sub-pixel region. The electroplating electrodes are disposed in the sub-pixel region, and at least a portion of each electroplating electrode is disposed within a respective one of the first through holes. The driving electrodes are disposed in the sub-pixel region and on a first side of the base, and each driving electrode is connected to a respective one of the electroplating electrodes.
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