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1.发明公开公开(公告)号：US20240313036A1
公开(公告)日：2024-09-19
申请号：US18028452
申请日：2022-05-18
发明人： Mingxing WANG , Wei LI , Huajie YAN , Qian SUN , Xue DONG , Guangcai YUAN , Qi QI , Xuan LIANG , Fei WANG
IPC分类号： H01L27/15
CPC分类号： H01L27/156
摘要： Provided in the disclosure are a light-emitting chip and a preparation method thereof, a light-emitting substrate, and a display device. The light-emitting chip includes: a silicon-based substrate including a plurality of sub-pixel openings; a plurality of light-emitting devices formed on one side of the silicon-based substrate; wherein the light-emitting devices are in one-to-one correspondence to the sub-pixel openings, and orthographic projections of the light-emitting devices on the silicon-based substrate overlap with the sub-pixel openings; and a plurality of photoluminescent color films located in at least part of the sub-pixel openings.
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公开(公告)号：US20220376137A1
公开(公告)日：2022-11-24
申请号：US17435016
申请日：2020-11-06
发明人： Mingxing WANG , Binbin TONG , Lizhen ZHANG , Chenyang ZHANG , Zhen ZHANG , Xiawei YUN , Guangcai YUAN , Xue DONG , Muxin DI , Zhiwei LIANG , Ke WANG , Zhanfeng CAO
IPC分类号： H01L33/38 , H01L33/46 , H01L33/62 , H01L33/00 , H01L25/075
摘要： A light-emitting diode (LED) chip includes a plurality of epitaxial structures, at least one first electrode, and a plurality of second electrodes. Any two adjacent epitaxial structures of the plurality of epitaxial structures have a gap therebetween. Each epitaxial structure includes a first semiconductor pattern, a light-emitting pattern and a second semiconductor pattern stacked in sequence. First semiconductor patterns in at least two of the plurality of epitaxial structures are connected to each other to form a first semiconductor layer. A first electrode is electrically connected to the first semiconductor layer. Each second electrode is electrically connected to the second semiconductor pattern in at least one of the plurality of epitaxial structures.
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公开(公告)号：US20220238594A1
公开(公告)日：2022-07-28
申请号：US17488243
申请日：2021-09-28
发明人： Xue DONG , Guangcai YUAN , Qi YAO , Zhanfeng CAO , Shi SHU , Mingxing WANG , Xiang LI
IPC分类号： H01L27/15 , H01L25/065 , H01L25/00
摘要： A LED chip, including: substrate; LEDs on side of the substrate, each including first semiconductor pattern, light emission pattern, second semiconductor pattern sequentially stacked, the first semiconductor patterns of at least two LEDs being formed as single piece to constitute first semiconductor layer; at least one first electrode on side of first semiconductor layer away from the substrate and electrically coupled to first semiconductor layer; second electrodes on side of the second semiconductor patterns away from the substrate, each being electrically coupled to second semiconductor pattern of corresponding LED; pixel defining layer on side of the substrate away from LED, and having pixel openings in one-to-one correspondence with LEDs; and a color conversion pattern within at least two pixel openings, and converting light of first color emitted by the light emission pattern into light of target color other than the first color. The LED chip is Mini-LED or Micro-LED chip.
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公开(公告)号：US20240347678A1
公开(公告)日：2024-10-17
申请号：US18579356
申请日：2022-08-29
发明人： Huajie YAN , Qian SUN , Mingxing WANG , Wei LI , Zhiqiang JIAO , Qingyu HUANG , Mengna SUN
CPC分类号： H01L33/502 , H01L33/0075 , H01L33/14 , H01L33/24 , H01L33/32 , H01L2933/0041 , H01L2933/0083
摘要： The present disclosure provides a light-emitting device, a method for manufacturing a light-emitting device and a display apparatus, and belongs to the field of display technology, and can solve the problem that the light-emitting device in the related art has low luminescence efficiency. The light-emitting device of the present disclosure includes: a substrate, a light-emitting diode on the substrate and a color conversion layer on a side of the light-emitting diode away from the substrate; the light-emitting device further includes: nano-metal particles; a plurality of grooves are formed in a surface of the light-emitting diode away from the substrate; and the nano-metal particles are filled in the plurality of grooves.
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公开(公告)号：US20220352000A1
公开(公告)日：2022-11-03
申请号：US17427628
申请日：2020-10-30
发明人： Haixu LI , Xiao ZHANG , Fei WANG , Mingxing WANG , Shulei LI , Xue DONG , Guangcai YUAN , Zhanfeng CAO , Xin GU , Ke WANG , Feng QU , Xuan LIANG , Junwei YAN
IPC分类号： H01L21/683 , H01L25/075 , H01L33/62
摘要： A light-emitting diode substrate, a manufacturing method thereof, and a display device are disclosed. The manufacturing method of the light-emitting diode substrate includes: forming an epitaxial layer group of M light-emitting diode chips on a substrate; transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate, an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2.
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公开(公告)号：US20220131044A1
公开(公告)日：2022-04-28
申请号：US17407919
申请日：2021-08-20
发明人： Haixu LI , Mingxing WANG , Guangcai YUAN , Zhanfeng CAO , Ke WANG , Feng QU
IPC分类号： H01L33/38 , H01L27/15 , H01L25/075 , H01L33/62
摘要： A driving backplane, a display panel and a display apparatus are provided. The driving backplane includes: a base substrate, and a plurality of connection electrode groups and a plurality of correction structures disposed on the base substrate, each of the connection electrode groups includes: a first connection electrode and a second connection electrode the first connection electrode and the second connection electrode are arranged on a same layer; a first gap is formed between the first connection electrode and the second connection electrode, and a first group of opposite edges includes: an edge, close to the first gap, of the first connection electrode; and an edge, close to the first gap, of the second connection electrode; a second group of opposite edges includes: an edge, far away from the first gap, of the first connection electrode; and an edge, far away from the first gap, of the second connection electrode.
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公开(公告)号：US20240243239A1
公开(公告)日：2024-07-18
申请号：US18016681
申请日：2022-02-25
发明人： Xuan LIANG , Fei WANG , Mingxing WANG , Can WANG , Xue DONG , Qi QI , Mingkun YANG
摘要： A light emitting device and a light emitting apparatus are provided. The light emitting device includes at least two epitaxial structures provided in a first direction and connected in series, wherein two current diffusion layers and a transparent adhesive layer are provided between two adjacent epitaxial structures, a current diffusion layer is provided at one side of each of the two adjacent epitaxial structures, the transparent adhesive layer is provided between the two current diffusion layers, and metal nanoparticles are provided in the transparent adhesive layer.
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公开(公告)号：US20220216183A1
公开(公告)日：2022-07-07
申请号：US17422220
申请日：2020-10-21
发明人： Mingxing WANG , Meng YAN , Qingxun ZHANG , Qian WU , Xuan FENG , Xiawei YUN , Guangcai YUAN , Xue DONG , Muxin DI , Zhiwei LIANG , Ke WANG
IPC分类号： H01L25/065 , H01L27/15 , H01L23/498 , H01L23/00
摘要： A display substrate and a display device are provided. The display substrate includes a backplane including a plurality of pixel regions; and light emitting units arranged in one-to-one correspondence with the plurality of pixel regions. Each light emitting unit includes light emitting sub-units arranged in a plurality of rows and a plurality of columns, each row of light emitting sub-units includes a plurality of light emitting sub-units arranged along a row direction, each column of light emitting sub-units includes one light emitting sub-unit, and orthographic projections of light emitting regions of two adjacent columns of light emitting sub-units on a first straight line extending along a column direction are not overlapped; and in each light emitting unit, there is no gap between orthographic projections of the light emitting regions of the two adjacent columns of light emitting sub-units on a second straight line extending along the row direction.
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公开(公告)号：US20220115562A1
公开(公告)日：2022-04-14
申请号：US17332852
申请日：2021-05-27
发明人： Lizhen ZHANG , Guangcai YUAN , Qi YAO , Mingxing WANG
摘要： An embodiment of the present disclosure provides a light emitting diode chip, including: a light emitting functional layer including a first semiconductor layer, a light emitting layer and a second semiconductor layer which are sequentially stacked, and a second semiconductor layer including a plurality of second semiconductor patterns which are arranged at intervals; a first electrode layer including a first electrode pattern electrically coupled to the first semiconductor layer; a second electrode layer disposed on a side, away from the light emitting layer, of the second semiconductor layer and including a plurality of second electrode patterns in one-to-one correspondence with the second semiconductor patterns, and the second electrode patterns are electrically coupled to the second semiconductor patterns correspondingly. Embodiments of the present disclosure further provide a method for manufacturing a light emitting diode chip and a display device.
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