公开(公告)号：US20220393087A1

公开(公告)日：2022-12-08

申请号：US17775959

申请日：2021-05-20

申请人： Hefei Xinsheng Optoelectronics Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Ting ZENG ,  Xinhong LU ,  Heren GUI ,  Jian YANG ,  Yongfei LI

IPC分类号： H01L33/62 ,  H01L33/00 ,  H01L33/44

摘要： The present disclosure provides a display substrate, including: a base substrate including a display area and a bonding area; a first metal conductive layer pattern on the base substrate; a first passivation layer on the first metal conductive layer pattern; a second metal conductive layer pattern on the first passivation layer; a second passivation layer on the second metal conductive layer pattern; a first blackening layer pattern is disposed between the first metal conductive layer pattern and the first passivation layer, an orthographic projection of which on the base substrate is located in that of the first metal conductive layer pattern on the base substrate; and/or a second blackening layer pattern is disposed between the second metal conductive layer pattern and the second passivation layer, an orthographic projection of which on the base substrate is located in that of the second metal conductive layer pattern on the base substrate.

公开(公告)号：US20230043951A1

公开(公告)日：2023-02-09

申请号：US17790308

申请日：2021-08-31

申请人： BOE TECHNOLOGY GROUP CO., LTD.

发明人： Ke WANG ,  Zhanfeng CAO ,  Xinhong LU ,  Qi QI ,  Yan QU ,  Zhiwei LIANG ,  Yingwei LIU ,  Dapeng XUE ,  Guoqiang WANG ,  Jianguo WANG ,  Song LIU ,  Yongfei LI ,  Ting ZENG ,  Huan LIU ,  Wanru DONG ,  Heren GUI ,  Jian YANG ,  Haifeng HU ,  Yu JIANG ,  Peng XU ,  Weiwei CHU ,  Qi GAO

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L21/48 ,  H01L23/498

摘要： An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer . The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.

公开(公告)号：US20220397998A1

公开(公告)日：2022-12-15

申请号：US17771916

申请日：2021-07-12

申请人： Hefei Xinsheng Optoelectronics Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Yu JIANG ,  Ting ZENG ,  Huan LIU ,  Haifeng HU ,  Heren GUI ,  Yongfei LI ,  Jian YANG

IPC分类号： G06F3/041

摘要： A touch substrate includes: a substrate, which includes a touch area and a bonding area on one side of the touch area; and a plurality of pads on the substrate, wherein the plurality of pads are arranged in the bonding area at intervals, wherein the pad includes a first metal layer, a first organic layer and a second metal layer, arranged in this order on the substrate, a first via is formed in the first metal layer, a second via is formed in the first organic layer, an orthographic projection of the first via on the substrate and an orthographic projection of the second via on the substrate do not overlap, a part of the first organic layer is in the first via, and a part of the second metal layer is in contact with the first metal layer through the second via.