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公开(公告)号：US20230097502A1
公开(公告)日：2023-03-30
申请号：US16982217
申请日：2019-12-19
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei LIANG , Yingwei LIU , Zhijun LV , Ke WANG , Zhanfeng CAO , Hsuanwei MAI , Guangcai YUAN , Muxin DI
IPC: H01L33/62 , H01L25/075 , H01L23/00
Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.
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公开(公告)号：US20210074689A1
公开(公告)日：2021-03-11
申请号：US16984511
申请日：2020-08-04
Applicant: BOE Technology Group Co., Ltd.
Inventor： Hsuanwei MAI , Zhanfeng Cao , Ke Wang , Haixu Li , Zhiwei Liang , Zhijun Lv
IPC: H01L25/075 , H01L33/00
Abstract: Disclosed are a transfer carrier and a manufacturing method thereof, and a method for transferring a light-emitting diode chip. The transfer carrier includes: a substrate having a plurality of via holes penetrating a thickness of the substrate, the substrate having a first surface and second surface which are opposite to each other; and thermoplastic structures filling corresponding ones of the via holes, one end of the thermoplastic structures protruding from the second surface of the substrate, and the other end covering a surrounding area on the first surface, of the corresponding via holes.
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公开(公告)号：US20210005632A1
公开(公告)日：2021-01-07
申请号：US16913435
申请日：2020-06-26
Applicant: BOE Technology Group Co., Ltd.
Inventor： Hsuanwei MAI , Hua HUANG , Shulei LI , Song FANG
Abstract: The present disclosure provides a display substrate and a method of manufacturing the same, and a display device. The display substrate includes a base substrate; a driving circuit layer disposed on the base substrate; and a planarization layer disposed on a side of the driving circuit layer away from the base substrate and having a plurality of conductive pads therein, the plurality of conductive pads are respectively electrically coupled to electrodes in the driving circuit layer, and a surface of each of the plurality of conductive pads away from the base substrate is flush with a surface of the planarization layer away from the base substrate.
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Patent Agency Ranking
公开(公告)号：US20220199862A1
公开(公告)日：2022-06-23
申请号：US17279488
申请日：2020-05-28
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiwei LIANG , Yingwei LIU , Guoqiang WANG , Muxin DI , Ke WANG , Hsuanwei MAI , Zhanfeng CAO
Abstract: Embodiments of the present disclosure provide an intermediate substrate, including: a first substrate; a black photoresist layer on a side of the first substrate; and a plurality of light emitting devices on a side of the black photoresist layer away from the first substrate. Each of the plurality of light emitting devices has a light-exiting side for emergence of light emitted by the light emitting device, the light-exiting side is in contact with the black photoresist layer, and the light emitting device includes a driving electrode for introducing a driving signal.
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公开(公告)号：US20210090496A1
公开(公告)日：2021-03-25
申请号：US16850323
申请日：2020-04-16
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Han YUE , Hsuanwei MAI
IPC: G09G3/3225 , H02H9/04
Abstract: The present disclosure provides a protection circuit for protecting a light emitting element, a pixel unit including the protection circuit, a display panel, and a driving method of the protection circuit. The protection circuit for protecting the light emitting element includes: a bonding protection sub-circuit including a sacrificial metal region, configured to electrically couple the sacrificial metal region to an anode pad and a cathode pad on the backplane for bonding the light emitting element during a period of bonding the light emitting element to the backplane.
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公开(公告)号：US20230378414A1
公开(公告)日：2023-11-23
申请号：US18228281
申请日：2023-07-31
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei LIANG , Yingwei LIU , Zhijun LV , Ke WANG , Zhanfeng CAO , Hsuanwei MAI , Guangcai YUAN , Muxin DI
IPC: H01L33/62 , H01L23/00 , H01L25/075
CPC classification number: H01L33/62 , H01L24/03 , H01L24/05 , H01L25/0753 , H01L2224/02166 , H01L2224/02185 , H01L2224/0219 , H01L2224/03013 , H01L2224/03462 , H01L2224/03614 , H01L2224/03622 , H01L2224/0401 , H01L2224/05017 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/0518 , H01L2933/0066
Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.
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公开(公告)号：US20210408331A1
公开(公告)日：2021-12-30
申请号：US16959097
申请日：2019-08-16
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiwei LIANG , Yingwei LIU , Han YUE , Minghua XUAN , Hsuanwei MAI , Zhanfeng CAO , Ke WANG , Huijuan WANG , Guangcai YUAN , Zhijun LV , Xinhong LU
Abstract: A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.
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公开(公告)号：US20210407841A1
公开(公告)日：2021-12-30
申请号：US16770655
申请日：2019-06-13
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xue DONG , Guangcai YUAN , Zhijun LV , Haixu LI , Zhiwei LIANG , Huijuan WANG , Ke WANG , Zhanfeng CAO , Hsuanwei MAI
IPC: H01L21/683 , H01L25/075 , H01L33/62
Abstract: The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.
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