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公开(公告)号:US12198903B2
公开(公告)日:2025-01-14
申请号:US17548219
申请日:2021-12-10
Applicant: Applied Materials, Inc.
Inventor: Joseph Frederick Sommers , Joseph Frederick Behnke , Xue Yang Chang , Anwar Husain , Alexander Alhajj Sulyman , Timothy Joseph Franklin , David J. Coumou
Abstract: A method includes depositing a first layer of a first material onto a surface of a chamber component of a processing chamber. The first material comprises a polymer, the polymer having a dielectric strength of at least 40 MV/m. The method further includes depositing a second layer of a second material onto the first layer. The second material comprises a first ceramic material impregnated into the first polymer or a second polymer. The method further includes depositing a third layer. The third layer is of a third material. The third material includes the first ceramic material or a second ceramic material. The third material does not adhere to the first polymer or the second polymer. The third material does adhere to the first ceramic material or the second ceramic material of the second layer.
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公开(公告)号:US20230187182A1
公开(公告)日:2023-06-15
申请号:US17548219
申请日:2021-12-10
Applicant: Applied Materials, Inc.
Inventor: Joseph Frederick Sommers , Joseph Frederick Behnke , Xue Yang Chang , Anwar Husain , Alexander Alhajj Sulyman , Timothy Joseph Franklin , David J. Coumou
CPC classification number: H01J37/32495 , B05D7/58 , B05D1/12 , B05D3/12 , H01J37/32715 , H01J37/32467 , H01J2237/334
Abstract: A method includes depositing a first layer of a first material onto a surface of a chamber component of a processing chamber. The first material comprises a polymer, the polymer having a dielectric strength of at least 40 MV/m. The method further includes depositing a second layer of a second material onto the first layer. The second material comprises a first ceramic material impregnated into the first polymer or a second polymer. The method further includes depositing a third layer. The third layer is of a third material. The third material includes the first ceramic material or a second ceramic material. The third material does not adhere to the first polymer or the second polymer. The third material does adhere to the first ceramic material or the second ceramic material of the second layer.
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公开(公告)号:US20240420984A1
公开(公告)日:2024-12-19
申请号:US18210328
申请日:2023-06-15
Applicant: Applied Materials, Inc.
Inventor: Andrew Nguyen , Yogananda Sarode Vishwanath , Tom K. Cho , Jennifer Y. Sun , Xue Yang Chang
IPC: H01L21/683 , H01J37/32 , H01L21/3065 , H01L21/673
Abstract: An electrostatic chuck (ESC) including a ceramic body having a first surface with two or more regions defined on the first surface arranged concentrically with respect to each other on the first surface. Each region includes a retaining ring arranged on the first surface and defining an outer edge of the region, and structures arranged on the first surface and within the region configured to support a surface of a substrate when the substrate is retained by the electrostatic chuck. The ESC includes gas conduits configured to introduce a gas into the two or more regions through the ceramic body and to the first surface, and embedded electrodes within the ceramic body and arranged with respect to the first surface and configured to generate a retaining force on the surface of the substrate.
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公开(公告)号:US10811233B2
公开(公告)日:2020-10-20
申请号:US15673403
申请日:2017-08-09
Applicant: APPLIED MATERIALS, INC.
Inventor: Andrew Nguyen , Xue Yang Chang , Haitao Wang , Kei-Yu Ko , Reza Sadjadi
IPC: H01J37/32
Abstract: Process chambers having a tunable showerhead and a tunable liner are disclosed herein. In some embodiments, a processing chamber includes a showerhead; a chamber liner; a first impedance circuit coupled to the showerhead to tune an impedance of the showerhead; a second impedance circuit coupled to the chamber liner to tune an impedance of the chamber liner; and a controller coupled to the first and second impedance circuits to control relative impedances of the showerhead and the chamber liner.
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公开(公告)号:US20240420932A1
公开(公告)日:2024-12-19
申请号:US18209649
申请日:2023-06-14
Applicant: Applied Materials, Inc.
Inventor: Yogananda Sarode Vishwanath , Xue Yang Chang
IPC: H01J37/32 , H01L21/683 , H01L21/687
Abstract: Substrate support components including an integrally formed insulator body including a first surface and a second surface opposite the first surface, and a thickness of the insulator body exceeds an arcing threshold between the first body and the second body when the insulator body is arranged between a first electrically conductive body and a second electrically conductive body. The insulator body includes gas conduits within the insulator body and forming a gas flow path from the first surface to the second surface, including a gas conductance plug embedded within a first portion of the gas conduit and having at least a threshold gas conductance through the gas conductance plug, wherein the gas conductance plug obstructs an electrical discharge path between the first body and the second body when the insulator body is arranged with respect to the first body and the second body.
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公开(公告)号:USD1049067S1
公开(公告)日:2024-10-29
申请号:US29833393
申请日:2022-04-04
Applicant: Applied Materials, Inc.
Designer: Rohan Vijay Rane , Xue Yang Chang , Timothy Joseph Franklin , Daniel Sang Byun
Abstract: FIG. 1 is a top, front, right isometric view of a ring for an anti-rotation process kit for a substrate processing chamber, showing our new design.
FIG. 2 is a bottom, left, back isometric view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a front elevation view thereof.
FIG. 6 is a back elevation view thereof.
FIG. 7 is a left elevation view thereof.
FIG. 8 is a right elevation view thereof; and,
FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG. 3 with the enlargements taken from the dashed-dot encircled portions labeled, “FIG. 9,” in FIG. 3.
The even dashed broken lines in FIG. 9 represent unclaimed environment and form no part of the claimed design. The dash-dot lines represent the boundary lines of the enlarged portion view of FIG. 9 shown in FIGS. 3 and 9 and form no part of the claimed design.-
公开(公告)号:US11069547B2
公开(公告)日:2021-07-20
申请号:US15880086
申请日:2018-01-25
Applicant: Applied Materials, Inc.
Inventor: Xue Yang Chang , Andrew Nguyen
Abstract: Apparatuses and methods for in-situ temperature measurement of a process chamber are described herein. A process chamber includes an infrared (IR) sensor mounted to the chamber wall. The IR sensor is mounted such that it can be oriented to receive an IR wave from targets within the process chamber through a view port in the chamber wall to detect a temperature of a surface inside the chamber, or to receive an IR wave from a target outside of the process chamber to detect an atmospheric temperature or a temperature of an exterior surface of the process chamber. As the orientation of the IR sensor is controllable to receive the IR wave from selected directions, it may be used to detect the temperature of various targets inside and outside the process chamber. The obtained temperature information is useful to improve overall chamber matching, processing throughput, and uniformity.
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公开(公告)号:US12211734B2
公开(公告)日:2025-01-28
申请号:US17688712
申请日:2022-03-07
Applicant: Applied Materials, Inc.
Inventor: Alexander Sulyman , Carlaton Wong , Rajinder Dhindsa , Timothy Joseph Franklin , Steven Babayan , Anwar Husain , James Hugh Rogers , Xue Yang Chang
IPC: H01L21/67 , H01L21/683 , H01L21/687
Abstract: Methods and apparatus for a lift pin mechanism for substrate processing chambers are provided herein. In some embodiments, the lift pin mechanism includes a lift pin comprising a shaft with a top end, a bottom end, and a coupling end at the bottom end; a bellows assembly disposed about the shaft. The bellows assembly includes an upper bellows flange having an opening for axial movement of the shaft; a bellows having a first end coupled to a lower surface of the upper bellows flange such that the shaft extends into a central volume surrounded by the bellows; and a bellows guide assembly coupled to a second end of the bellows to seal the central volume. The shaft is coupled to the bellows guide assembly at the coupling end. The bellows guide assembly is axially movable to move the lift pin with respect to the upper bellows flange.
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公开(公告)号:US12100576B2
公开(公告)日:2024-09-24
申请号:US16863541
申请日:2020-04-30
Applicant: APPLIED MATERIALS, INC.
Inventor: Andrew Nguyen , Xue Yang Chang , Yu Lei , Xianmin Tang , John C. Forster , Yogananda Sarode Vishwanath , Abilash Sainath , Tza-Jing Gung
CPC classification number: H01J37/32477 , C23C16/4412 , H01J37/3244 , H01J37/32495 , H01J37/32633 , H01J37/32651
Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a chamber liner having a tubular body with an upper portion and a lower portion; a confinement plate coupled to the lower portion of the chamber liner and extending radially inward from the chamber liner, wherein the confinement plate includes a plurality of slots; a shield ring disposed within the chamber liner and movable between the upper portion of the chamber liner and the lower portion of the chamber liner; and a plurality of ground straps coupled to the shield ring at a first end of each ground strap of the plurality of ground straps and to the confinement plate at a second end of each ground strap to maintain electrical connection between the shield ring and the chamber liner when the shield ring moves.
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公开(公告)号:US12020977B2
公开(公告)日:2024-06-25
申请号:US17688705
申请日:2022-03-07
Applicant: Applied Materials, Inc.
Inventor: Alexander Sulyman , Anwar Husain , Timothy Joseph Franklin , Carlaton Wong , Xue Yang Chang
IPC: H01L21/687 , H01L21/683
CPC classification number: H01L21/68742 , H01L21/6833 , H01L21/68785
Abstract: Methods and apparatus for lift pin assemblies for substrate processing chambers are provided. In some embodiments, a lift pin assembly includes a lift pin comprising a shaft, a head, and a coupling end, the head configured to rest against an electrostatic chuck; an upper guide comprising a top end, a bottom end, and a first opening extending from the top end to the bottom end, wherein the shaft is disposed and axially movable through the first opening; a lower guide comprising a top end, a bottom end, and a second opening and a third opening extending from the top end to the bottom end, wherein the third opening is larger than the second opening, and wherein the shaft is disposed and axially movable through the second opening and the third opening; and a biasing mechanism coupled to the shaft and configured to bias the lift pin against the electrostatic chuck.
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