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    ADJUSTING CHAMBER PERFORMANCE BY EQUIPMENT CONSTANT UPDATES
    2.
    发明公开
    ADJUSTING CHAMBER PERFORMANCE BY EQUIPMENT CONSTANT UPDATES 审中-公开

    公开(公告)号：US20240176334A1

    公开(公告)日：2024-05-30

    申请号：US18070453

    申请日：2022-11-28

    Applicant: Applied Materials, Inc.

    Inventor： Sidharth Bhatia ,  Roger Lindley ,  Upendra Ummethala ,  Thomas Li ,  Michael Howells ,  Steven Babayan ,  Mimi-Diemmy Dao

    IPC: G05B19/418

    CPC classification number: G05B19/41865 ,  G05B19/4188 ,  G05B19/41885 ,  G05B2219/45031

    Abstract: A method includes receiving, by a processing device, first trace data associated with a first processing chamber, wherein the first processing chamber satisfies one or more performance metrics. The method further includes generating target trace data based on the first trace data associated with the first processing chamber. The method further includes receiving second trace data associated with a second processing chamber, wherein the second processing chamber does not satisfy the one or more performance metrics. The method further includes generating, based on the target trace data and the second trace data, a first recommended corrective action associated with the second processing chamber, wherein the first recommended corrective action includes updating one or more equipment constants of the second processing chamber. The method further includes performing the first recommended corrective action.

    Lift pin mechanism
    5.
    发明授权
    Lift pin mechanism 有权

    公开(公告)号：US12211734B2

    公开(公告)日：2025-01-28

    申请号：US17688712

    申请日：2022-03-07

    Applicant: Applied Materials, Inc.

    Inventor： Alexander Sulyman ,  Carlaton Wong ,  Rajinder Dhindsa ,  Timothy Joseph Franklin ,  Steven Babayan ,  Anwar Husain ,  James Hugh Rogers ,  Xue Yang Chang

    IPC: H01L21/67 ,  H01L21/683 ,  H01L21/687

    Abstract: Methods and apparatus for a lift pin mechanism for substrate processing chambers are provided herein. In some embodiments, the lift pin mechanism includes a lift pin comprising a shaft with a top end, a bottom end, and a coupling end at the bottom end; a bellows assembly disposed about the shaft. The bellows assembly includes an upper bellows flange having an opening for axial movement of the shaft; a bellows having a first end coupled to a lower surface of the upper bellows flange such that the shaft extends into a central volume surrounded by the bellows; and a bellows guide assembly coupled to a second end of the bellows to seal the central volume. The shaft is coupled to the bellows guide assembly at the coupling end. The bellows guide assembly is axially movable to move the lift pin with respect to the upper bellows flange.

    DETERMINING EQUIPMENT CONSTANT UPDATES BY MACHINE LEARNING
    6.
    发明公开
    DETERMINING EQUIPMENT CONSTANT UPDATES BY MACHINE LEARNING 审中-公开

    公开(公告)号：US20240176312A1

    公开(公告)日：2024-05-30

    申请号：US18070448

    申请日：2022-11-28

    Applicant: Applied Materials, Inc.

    Inventor： Sidharth Bhatia ,  Roger Lindley ,  Upendra Ummethala ,  Thomas Li ,  Michael Howells ,  Steven Babayan ,  Mimi-Diemmy Dao

    IPC: G05B13/02 ,  G05B13/04

    CPC classification number: G05B13/027 ,  G05B13/048

    Abstract: A method includes providing, as input to a first trained machine learning model, trace data associated with one or more substrate processing procedures. The input further includes equipment constants associated with the one or more substrate processing procedures. The input further includes trace data of a first processing chamber. The input further includes equipment constants of the first processing chamber. The method further includes obtaining, as output from the first trained machine learning model, a recommended update to a first equipment constant of the first processing chamber. The method further includes updated the first equipment constant of the first processing chamber responsive to obtaining the output from the first trained machine learning model.

    PROCESS KIT ENCLOSURE SYSTEM
    7.
    发明申请
    PROCESS KIT ENCLOSURE SYSTEM 审中-公开

    公开(公告)号：US20200373190A1

    公开(公告)日：2020-11-26

    申请号：US16417348

    申请日：2019-05-20

    Applicant: Applied Materials, Inc.

    Inventor： Helder Lee ,  Nicholas Michael Kopec ,  Leon Volfovski ,  Douglas R. McAllister ,  Andreas Schmid ,  Jeffrey Hudgens ,  Yogananda Sarode Vishwanath ,  Steven Babayan

    IPC: H01L21/687 ,  H01L21/673 ,  H01L21/68 ,  H01L21/677

    Abstract: A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.

    Process kit enclosure system
    8.
    发明授权
    Process kit enclosure system 有权

    公开(公告)号：US12165905B2

    公开(公告)日：2024-12-10

    申请号：US16417348

    申请日：2019-05-20

    Applicant: Applied Materials, Inc.

    Inventor： Helder Lee ,  Nicholas Michael Kopec ,  Leon Volfovski ,  Douglas R. McAllister ,  Andreas Schmid ,  Jeffrey Hudgens ,  Yogananda Sarode Vishwanath ,  Steven Babayan

    IPC: H01L21/687 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68

    Abstract: A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.

    CHAMBER MATCHING BY EQUIPMENT CONSTANT UPDATES
    9.
    发明公开
    CHAMBER MATCHING BY EQUIPMENT CONSTANT UPDATES 审中-公开

    公开(公告)号：US20240176336A1

    公开(公告)日：2024-05-30

    申请号：US18070456

    申请日：2022-11-28

    Applicant: Applied Materials, Inc.

    Inventor： Sidharth Bhatia ,  Roger Lindley ,  Upendra Ummethala ,  Thomas Li ,  Michael Howells ,  Steven Babayan ,  Mimi-Diemmy Dao

    IPC: G05B19/418

    CPC classification number: G05B19/41875 ,  G05B2219/32368

    Abstract: A method includes receiving, by a processing device, data indicative of performance of a plurality of process chambers. The method further includes providing the data indicative of performance of the plurality of process chambers to a model. The method further includes receiving as output from the model a first recommended equipment constant update associated with a first process chamber of the plurality of process chambers and a second recommended equipment constant update associated with a second process chamber of the plurality of process chambers. The method further includes updating a first equipment constant of the first process chamber and a second equipment constant of the second process chamber in view of the first recommended equipment constant update and the second recommended equipment constant update.

    SUBSTRATE PLACEMENT OPTIMIZATION USING SUBSTRATE MEASUREMENTS
    10.
    发明公开
    SUBSTRATE PLACEMENT OPTIMIZATION USING SUBSTRATE MEASUREMENTS 审中-公开

    公开(公告)号：US20240069537A1

    公开(公告)日：2024-02-29

    申请号：US17822009

    申请日：2022-08-24

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Gautham Gururaj Bammanahalli ,  Steven Babayan ,  Deepak Sridharan

    IPC: G05B19/418 ,  G05B13/02 ,  H01L21/67

    CPC classification number: G05B19/41885 ,  G05B13/0265 ,  H01L21/67259 ,  G05B2219/35162

    Abstract: A method includes processing a first substrate in a process chamber of a substrate processing system according to a recipe while the first substrate is supported by a substrate support of the process chamber. The first substrate includes a first surface profile after the processing. The method further includes generating a first profile map of the first surface profile of the first substrate using a substrate measurement system of the substrate processing system. The method further includes processing data from the first profile map using a model. The model outputs a first estimated substrate placement value for a placement of the first substrate relative to one or more components of the substrate support. The method further includes determining a recommended placement for substrates on the substrate support based on the first estimated substrate placement value.

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