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公开(公告)号：US11508558B2
公开(公告)日：2022-11-22
申请号：US16834814
申请日：2020-03-30
摘要： Embodiments described herein generally related to a substrate processing apparatus, and more specifically to an improved showerhead assembly for a substrate processing apparatus. The showerhead assembly includes a chill plate, a gas plate, and a gas distribution plate having a top surface and a bottom surface. A plurality of protruded features contacts the top surface of the gas distribution plate. A fastener and an energy storage structure is provided on the protruded features. The energy storage structure is compressed by the fastener and axially loads at least one of the protruded features to compress the chill plate, the gas plate and the gas distribution plate.
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公开(公告)号：US11560626B2
公开(公告)日：2023-01-24
申请号：US16876845
申请日：2020-05-18
发明人： Timothy Joseph Franklin , Adam Fischbach , Edward Haywood , Abhijit B. Mallick , Pramit Manna , Carlaton Wong , Stephen C. Garner , Eswaranand Venkatasubramanian
IPC分类号： C23C16/458 , H01J37/32 , C23C16/46 , C23C16/50 , C23C16/455 , H01L21/02 , H01L21/033
摘要： Embodiments of the present disclosure generally relate to apparatus and methods utilized in the manufacture of semiconductor devices. More particularly, embodiments of the present disclosure relate to a substrate processing chamber, and components thereof, for forming semiconductor devices.
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公开(公告)号：US11557466B2
公开(公告)日：2023-01-17
申请号：US16993759
申请日：2020-08-14
发明人： Samuel E. Gottheim , Abhijit B. Mallick , Pramit Manna , Eswaranand Venkatasubramanian , Timothy Joseph Franklin , Edward Haywood , Stephen C. Garner , Adam Fischbach
IPC分类号： C23C16/509 , H01J37/32
摘要： Embodiments described herein provide magnetic and electromagnetic housing systems and a method for controlling the properties of plasma generated in a process volume of a process chamber to affect deposition properties of a film. In one embodiment, the method includes rotation of the rotational magnetic housing about a center axis of the process volume to create dynamic magnetic fields. The magnetic fields modify the shape of the plasma, concentration of ions and radicals, and movement of concentration of ions and radicals to control the density profile of the plasma. Controlling the density profile of the plasma tunes the uniformity and properties of a deposited or etched film.
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公开(公告)号：US11189517B2
公开(公告)日：2021-11-30
申请号：US16791875
申请日：2020-02-14
IPC分类号： H01L21/683 , H01J37/32
摘要： Embodiments described herein relate to apparatus and methods for substantially reducing an occurrence of radio frequency (RF) coupling through a chucking electrode. The chucking electrode is disposed in an electrostatic chuck positioned on a substrate support. The substrate support is coupled to a process chamber body. An RF source is used to generate a plasma in a process volume adjacent to the substrate support. An impedance matching circuit is disposed between the RF source and the chucking electrode is disposed in the electrostatic chuck. An electrostatic chuck filter is coupled between the chucking electrode and the chucking power source.
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公开(公告)号：US11257698B2
公开(公告)日：2022-02-22
申请号：US16997807
申请日：2020-08-19
摘要： Embodiments include a real time etch rate sensor and methods of for using a real time etch rate sensor. In an embodiment, the real time etch rate sensor includes a resonant system and a conductive housing. The resonant system may include a resonating body, a first electrode formed over a first surface of the resonating body, a second electrode formed over a second surface of the resonating body, and a sacrificial layer formed over the first electrode. In an embodiment, at least a portion of the first electrode is not covered by the sacrificial layer. In an embodiment, the conductive housing may secure the resonant system. Additionally, the conductive housing contacts the first electrode, and at least a portion of an interior edge of the conductive housing may be spaced away from the sacrificial layer.
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公开(公告)号：US10790175B2
公开(公告)日：2020-09-29
申请号：US15955375
申请日：2018-04-17
摘要： Embodiments include a real time etch rate sensor and methods of for using a real time etch rate sensor. In an embodiment, the real time etch rate sensor includes a resonant system and a conductive housing. The resonant system may include a resonating body, a first electrode formed over a first surface of the resonating body, a second electrode formed over a second surface of the resonating body, and a sacrificial layer formed over the first electrode. In an embodiment, at least a portion of the first electrode is not covered by the sacrificial layer. In an embodiment, the conductive housing may secure the resonant system. Additionally, the conductive housing contacts the first electrode, and at least a portion of an interior edge of the conductive housing may be spaced away from the sacrificial layer.
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公开(公告)号：US11587764B2
公开(公告)日：2023-02-21
申请号：US16671330
申请日：2019-11-01
发明人： Srinivas Gandikota , Tza-Jing Gung , Samuel E. Gottheim , Timothy Joseph Franklin , Pramit Manna , Eswaranand Venkatasubramanian , Edward Haywood , Stephen C. Garner , Adam Fischbach
IPC分类号： H01L21/00 , H01J37/32 , C23C16/505 , C23C16/455 , H01L21/3065 , H01L21/02
摘要： Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film. In one embodiment, a plurality of retaining brackets is disposed in a rotational magnetic housing of the magnetic housing systems. Each retaining bracket of the plurality of retaining brackets is disposed in the rotational magnetic housing with a distance d between each retaining bracket. The plurality of retaining brackets has a plurality of magnets removably disposed therein. The plurality of magnets is configured to travel in a circular path when the rotational magnetic housing is rotated around the round central opening.
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公开(公告)号：US20210050189A1
公开(公告)日：2021-02-18
申请号：US16993759
申请日：2020-08-14
发明人： Samuel E. GOTTHEIM , Abhijit B. Mallick , Pramit Manna , Eswaranand Venkatasubramanian , Timothy Joseph Franklin , Edward Haywood , Stephen C. Garner
IPC分类号： H01J37/32 , C23C16/509
摘要： Embodiments described herein provide magnetic and electromagnetic housing systems and a method for controlling the properties of plasma generated in a process volume of a process chamber to affect deposition properties of a film. In one embodiment, the method includes rotation of the rotational magnetic housing about a center axis of the process volume to create dynamic magnetic fields. The magnetic fields modify the shape of the plasma, concentration of ions and radicals, and movement of concentration of ions and radicals to control the density profile of the plasma. Controlling the density profile of the plasma tunes the uniformity and properties of a deposited or etched film.
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公开(公告)号：US20200381280A1
公开(公告)日：2020-12-03
申请号：US16997807
申请日：2020-08-19
摘要： Embodiments include a real time etch rate sensor and methods of for using a real time etch rate sensor. In an embodiment, the real time etch rate sensor includes a resonant system and a conductive housing. The resonant system may include a resonating body, a first electrode formed over a first surface of the resonating body, a second electrode formed over a second surface of the resonating body, and a sacrificial layer formed over the first electrode. In an embodiment, at least a portion of the first electrode is not covered by the sacrificial layer. In an embodiment, the conductive housing may secure the resonant system. Additionally, the conductive housing contacts the first electrode, and at least a portion of an interior edge of the conductive housing may be spaced away from the sacrificial layer.
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公开(公告)号：US10607817B2
公开(公告)日：2020-03-31
申请号：US15405758
申请日：2017-01-13
摘要： Embodiments described herein generally related to a substrate processing apparatus, and more specifically to an improved showerhead assembly for a substrate processing apparatus. The showerhead assembly includes a gas distribution plate and one or more temperature detection assemblies. The gas distribution plate includes a body having a top surface and a bottom surface. The one or more temperature detection assemblies are interfaced with the top surface of the gas distribution plate such that a thermal bond is formed between the gas distribution plate and each of the one or more temperature detection assemblies. Each temperature detection assembly includes a protruded feature and a temperature probe. The protruded feature is interfaced with the top surface of the gas distribution plate such that an axial load is placed on the gas distribution plate along an axis of the protruded feature. The temperature probe is positioned in a body of the protruded feature.
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