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    Sheath and temperature control of a process kit in a substrate processing chamber
    2.
    发明授权
    Sheath and temperature control of a process kit in a substrate processing chamber 有权

    公开(公告)号：US11551916B2

    公开(公告)日：2023-01-10

    申请号：US16853600

    申请日：2020-04-20

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Jaeyong Cho ,  Rajinder Dhindsa ,  James Rogers ,  Anwar Husain

    IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

    Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a ceramic plate having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic plate includes an electrode embedded in the ceramic plate; a ceramic ring disposed about the ceramic plate and having a first side and a second side opposite the first side, wherein the ceramic ring includes a chucking electrode and a heating element embedded in the ceramic ring; and a cooling plate coupled to the second side of the ceramic plate and the second side of the ceramic ring, wherein the cooling plate includes a radially inner portion, a radially outer portion, and a thermal break disposed therebetween.

    Temperature controlled secondary electrode for ion control at substrate edge
    5.
    发明授权
    Temperature controlled secondary electrode for ion control at substrate edge 有权

    公开(公告)号：US11424096B2

    公开(公告)日：2022-08-23

    申请号：US16674982

    申请日：2019-11-05

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Hamid Noorbakhsh ,  Kartik Ramaswamy ,  Anwar Husain

    IPC: H01L21/683 ,  H01J37/04 ,  H01J37/32

    Abstract: Embodiments of process kits for use in substrate processing chambers are provided herein. In some embodiments, a process kit for use in a substrate processing chamber includes an annular electrode configured to surround an electrostatic chuck, wherein the annular electrode includes an upper portion bonded to a lower portion and an annular channel disposed at an interface between the upper portion and the lower portion; wherein the annular electrode includes a first channel extending from a lower surface of the lower portion to the annular channel and a second channel extending from the lower surface of the lower portion to the annular channel; wherein the annular electrode is configured to flow a coolant from the first channel to the second channel via the annular channel to cool the annular electrode; and wherein the annular electrode includes at least one of a dielectric coating or a ceramic cap to reduce or prevent arcing between the annular electrode and the electrostatic chuck.

    Lift pin mechanism
    6.
    发明授权
    Lift pin mechanism 有权

    公开(公告)号：US12211734B2

    公开(公告)日：2025-01-28

    申请号：US17688712

    申请日：2022-03-07

    Applicant: Applied Materials, Inc.

    Inventor： Alexander Sulyman ,  Carlaton Wong ,  Rajinder Dhindsa ,  Timothy Joseph Franklin ,  Steven Babayan ,  Anwar Husain ,  James Hugh Rogers ,  Xue Yang Chang

    IPC: H01L21/67 ,  H01L21/683 ,  H01L21/687

    Abstract: Methods and apparatus for a lift pin mechanism for substrate processing chambers are provided herein. In some embodiments, the lift pin mechanism includes a lift pin comprising a shaft with a top end, a bottom end, and a coupling end at the bottom end; a bellows assembly disposed about the shaft. The bellows assembly includes an upper bellows flange having an opening for axial movement of the shaft; a bellows having a first end coupled to a lower surface of the upper bellows flange such that the shaft extends into a central volume surrounded by the bellows; and a bellows guide assembly coupled to a second end of the bellows to seal the central volume. The shaft is coupled to the bellows guide assembly at the coupling end. The bellows guide assembly is axially movable to move the lift pin with respect to the upper bellows flange.

    Lift pin assembly
    7.
    发明授权
    Lift pin assembly 有权

    公开(公告)号：US12020977B2

    公开(公告)日：2024-06-25

    申请号：US17688705

    申请日：2022-03-07

    Applicant: Applied Materials, Inc.

    Inventor： Alexander Sulyman ,  Anwar Husain ,  Timothy Joseph Franklin ,  Carlaton Wong ,  Xue Yang Chang

    IPC: H01L21/687 ,  H01L21/683

    CPC classification number: H01L21/68742 ,  H01L21/6833 ,  H01L21/68785

    Abstract: Methods and apparatus for lift pin assemblies for substrate processing chambers are provided. In some embodiments, a lift pin assembly includes a lift pin comprising a shaft, a head, and a coupling end, the head configured to rest against an electrostatic chuck; an upper guide comprising a top end, a bottom end, and a first opening extending from the top end to the bottom end, wherein the shaft is disposed and axially movable through the first opening; a lower guide comprising a top end, a bottom end, and a second opening and a third opening extending from the top end to the bottom end, wherein the third opening is larger than the second opening, and wherein the shaft is disposed and axially movable through the second opening and the third opening; and a biasing mechanism coupled to the shaft and configured to bias the lift pin against the electrostatic chuck.

    Helical plug for reduction or prevention of arcing in a substrate support
    8.
    发明授权
    Helical plug for reduction or prevention of arcing in a substrate support 有权

    公开(公告)号：US11551960B2

    公开(公告)日：2023-01-10

    申请号：US16777877

    申请日：2020-01-30

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Reyn T. Wakabayashi ,  Hamid Noorbakhsh ,  Anwar Husain

    IPC: H01L21/683 ,  H01J37/32

    Abstract: Embodiments of a plug for use in an electrostatic chuck are provided herein. In some embodiments, a plug for use in an electrostatic chuck includes a polymer sleeve having a central opening; and a core disposed in the central opening of the polymer sleeve, the core having a central protrusion and a peripheral ledge, wherein an outer surface of the core includes a helical channel extending from a lower surface of the core towards the peripheral ledge to at least partially define a gas flow path through the plug, and wherein the peripheral ledge is disposed between an upper surface of the polymer sleeve and the lower surface of the core.

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