公开(公告)号：US11842917B2

公开(公告)日：2023-12-12

申请号：US17216439

申请日：2021-03-29

申请人： Applied Materials, Inc.

发明人： Leon Volfovski ,  Andreas Schmid ,  Denis Martin Koosau ,  Nicholas Michael Kopec ,  Steven Babayan ,  Douglas R. McAllister ,  Helder Lee ,  Jeffrey Hudgens ,  Damon K. Cox

IPC分类号： H01L21/68 ,  H01L21/687 ,  H01L21/683 ,  H01L21/677

CPC分类号： H01L21/68735 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68742 ,  H01L21/677

摘要： A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.

公开(公告)号：US11260500B2

公开(公告)日：2022-03-01

申请号：US17011952

申请日：2020-09-03

申请人： Applied Materials, Inc.

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey P. Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B37/32 ,  B24B37/34 ,  B24B37/27

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

公开(公告)号：US20210217650A1

公开(公告)日：2021-07-15

申请号：US17216439

申请日：2021-03-29

申请人： Applied Materials, Inc.

发明人： Leon Volfovski ,  Andreas Schmid ,  Denis Martin Koosau ,  Nicholas Michael Kopec ,  Steven Babayan ,  Douglas R. McAllister ,  Helder Lee ,  Jeffrey Hudgens ,  Damon K. Cox

IPC分类号： H01L21/687 ,  H01L21/68 ,  H01L21/683

摘要： A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.

公开(公告)号：US09186773B2

公开(公告)日：2015-11-17

申请号：US14069207

申请日：2013-10-31

申请人： Applied Materials, Inc.

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey P. Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B37/32

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

摘要翻译： 保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。 保持环的底面可以包括平坦的，倾斜的和弯曲的部分。 可以使用专用于研磨保持环底面的机器进行研磨。 在研磨期间，可以允许环围绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。

公开(公告)号：US09937601B2

公开(公告)日：2018-04-10

申请号：US14927193

申请日：2015-10-29

申请人： Applied Materials, Inc.

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey P. Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B37/32

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

公开(公告)号：US20140053981A1

公开(公告)日：2014-02-27

申请号：US14069207

申请日：2013-10-31

申请人： Applied Materials, Inc.

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey P. Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Daniel Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B37/32

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

摘要翻译： 保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。 保持环的底面可以包括平坦的，倾斜的和弯曲的部分。 可以使用专用于研磨保持环底面的机器进行研磨。 在研磨期间，可以允许环围绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。

公开(公告)号：US11850703B2

公开(公告)日：2023-12-26

申请号：US18167007

申请日：2023-02-09

申请人： Applied Materials, Inc.

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey P. Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B37/32

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

公开(公告)号：US20220285180A1

公开(公告)日：2022-09-08

申请号：US17685181

申请日：2022-03-02

申请人： Applied Materials, Inc.

发明人： John C. Menk ,  Rachel Sara Stolzman ,  Douglas R. McAllister

IPC分类号： H01L21/67 ,  H01L21/677 ,  G06K19/07

摘要： An enclosure system includes walls including sidewalls and a bottom wall. The enclosure system further includes an enclosure lid configured to removably attach to one or more of the sidewalls. The walls and the enclosure lid at least partially enclose an interior volume of the enclosure system. The enclosure system further includes an upper window disposed in the enclosure lid. The upper window is configured for orientation verification of objects disposed in the interior volume. The enclosure system further includes a radio-frequency identification (RFID) holder coupled to a rear wall. The RFID holder is configured to secure an RFID component. The enclosure system further includes shelves disposed in the interior volume. Each of the shelves is configured to support a corresponding object of the objects.

公开(公告)号：US10964584B2

公开(公告)日：2021-03-30

申请号：US16417369

申请日：2019-05-20

申请人： Applied Materials, Inc.

发明人： Leon Volfovski ,  Andreas Schmid ,  Denis Martin Koosau ,  Nicholas Michael Kopec ,  Steven Babayan ,  Douglas R. McAllister ,  Helder Lee ,  Jeffrey Hudgens ,  Damon K. Cox

IPC分类号： H01L21/68 ,  H01L21/687 ,  H01L21/683 ,  H01L21/677

摘要： A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.

公开(公告)号：US20180185979A1

公开(公告)日：2018-07-05

申请号：US15908605

申请日：2018-02-28

申请人： Applied Materials, Inc.

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey P. Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC分类号： B24B37/32

CPC分类号： B24B37/32 ,  Y10T29/49815

摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.