公开(公告)号：US20240170311A1

公开(公告)日：2024-05-23

申请号：US17989980

申请日：2022-11-18

Applicant: Applied Materials, Inc.

Inventor： Ralph P. ANTONIO ,  Lee Guan TAY ,  Peter LAI ,  Sudhir R. GONDHALEKAR ,  Tzu-Fang HUANG ,  Jeffrey HUDGENS

IPC: H01L21/67 ,  B25J9/16 ,  B25J11/00 ,  B25J13/08 ,  B25J19/02 ,  G01S17/89 ,  H01L21/677

CPC classification number: H01L21/67259 ,  B25J9/161 ,  B25J11/0095 ,  B25J13/088 ,  B25J19/021 ,  G01S17/89 ,  H01L21/67742

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, an apparatus for processing a substrate comprises a transfer robot configured to position a substrate on a substrate support disposed within an interior of a processing chamber configured to process the substrate and a sensor disposed on the transfer robot, operably connected to a controller of the processing chamber, and configured with an angle of view to provide in-situ continuous closed loop feedback relating to spatial information of the interior of the processing chamber to the controller.

公开(公告)号：US20220008946A1

公开(公告)日：2022-01-13

申请号：US17365727

申请日：2021-07-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Yao-Hung YANG ,  Shantanu Rajiv GADGIL ,  Tanmay Pramod GURJAR ,  Sudhir R. GONDHALEKAR

IPC: B05B15/18 ,  C23C16/455 ,  B05B1/18

Abstract: Embodiments of showerheads for use in a process chamber and methods of reducing drooping of a showerhead faceplate are provided herein. In some embodiments, a showerhead for use in a process chamber includes: a faceplate having a plurality of gas distribution holes disposed therethrough; and one or more cables that engage with the faceplate and configured to prestress the faceplate.

公开(公告)号：US20250062104A1

公开(公告)日：2025-02-20

申请号：US18234731

申请日：2023-08-16

Applicant: Applied Materials, Inc.

Inventor： Sudhir R. GONDHALEKAR ,  Peter LAI ,  Suresh KARAVINAKOPPA ,  Pavankumar Ramanand HARAPANHALLI

IPC: H01J37/32 ,  H03H7/38

Abstract: Embodiments of substrate supports for use in process chambers are provided herein. In some embodiments, a substrate support for a process chamber includes: a pedestal having a support surface for supporting a substrate, one or more heating elements disposed therein, and an RF electrode disposed therein; a hollow shaft coupled to a lower surface of the pedestal; and an RF rod extending through the hollow shaft and having an upper portion that includes an upper end coupled to the RF electrode, wherein the upper end of the RF rod has at least one of (a) a cross sectional width that is wider than a lower portion of the RF rod or (b) one or more slots.

公开(公告)号：US20230402304A1

公开(公告)日：2023-12-14

申请号：US17748270

申请日：2022-05-19

Applicant: Applied Materials, Inc.

Inventor： Gaurav SHRIVASTAVA ,  Pavankumar Ramanand HARAPANHALLI ,  Yao-Hung YANG ,  Sudhir R. GONDHALEKAR ,  Chih-Yang CHANG

IPC: H01L21/67 ,  G01K7/22 ,  G01K7/04

CPC classification number: H01L21/67248 ,  G01K7/04 ,  G01K7/223

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a processing volume for processing a substrate and a pressure system in fluid communication with the processing volume and comprising a throttle valve assembly including a housing, a sensing device disposed in an interior of the housing, and a fan open to the interior of the housing, wherein, during operation of the pressure system to control a pressure within the processing volume, the sensing device is responsive to temperature changes in the interior of the housing such that the fan remains off when a temperature of the interior of the housing is less than a predetermined temperature and automatically turns on when the temperature within interior of the housing is equal to or greater than the predetermined temperature.

公开(公告)号：US20150221480A1

公开(公告)日：2015-08-06

申请号：US14601274

申请日：2015-01-21

Applicant: Applied Materials, Inc.

Inventor： Ren-Guan DUAN ,  Juan Carlos ROCHA-ALVAREZ ,  Jianhua ZHOU ,  Ningli LIU ,  Yihong CHEN ,  Abhijit Basu MALLICK ,  Sudhir R. GONDHALEKAR

IPC: H01J37/32 ,  C09D1/00

CPC classification number: H01J37/32477 ,  C09D1/00 ,  C09D7/61 ,  H01J37/32467

Abstract: In one embodiment, a processing chamber is disclosed wherein at least one surface of the processing chamber has a coating comprising SivYwMgxAlyOz, wherein v ranges from about 0.0196 to 0.2951, w ranges from about 0.0131 to 0.1569, x ranges from about 0.0164 to 0.0784, y ranges from about 0.0197 to 0.1569, z ranges from about 0.5882 to 0.6557, and v+w+x+y+z=1.

Abstract translation: 在一个实施方案中，公开了一种处理室，其中处理室的至少一个表面具有包含SivYwMg x AlyO z的涂层，其中v为约0.0196至0.2951，w为约0.0131至0.1569，x为约0.0164至0.0784，y为 范围为约0.0197至0.1569，z范围为约0.5882至0.6557，v + w + x + y + z = 1。

公开(公告)号：US20240307908A1

公开(公告)日：2024-09-19

申请号：US18671616

申请日：2024-05-22

Applicant: Applied Materials, Inc.

Inventor： Yao-Hung YANG ,  Shantanu Rajiv GADGIL ,  Tanmay Pramod GURJAR ,  Sudhir R. GONDHALEKAR

IPC: B05B15/18 ,  B05B1/18 ,  C23C16/455

CPC classification number: B05B15/18 ,  B05B1/18 ,  C23C16/45565

Abstract: Embodiments of showerheads for use in a process chamber and methods of reducing drooping of a showerhead faceplate are provided herein. In some embodiments, a method of reducing drooping of a faceplate for use in a process chamber includes: applying a compressive force to the faceplate via one or more cables that engage with the faceplate proximate an outer periphery thereof.

公开(公告)号：US20240124980A1

公开(公告)日：2024-04-18

申请号：US17964260

申请日：2022-10-12

Applicant: Applied Materials, Inc.

Inventor： Gaurav SHRIVASTAVA ,  Pavankumar Ramanand HARAPANHALLI ,  Sudhir R. GONDHALEKAR ,  Yao-Hung YANG ,  Chih-Yang CHANG

IPC: C23C16/455

CPC classification number: C23C16/45563

Abstract: A bimetallic faceplate for substrate processing is provided including a plate having a plurality of gas distribution holes and formed of a first metal having a first coefficient of thermal expansion, the plate having at least one groove around a center of the plate and spaced from the center of the plate; and a metallic element disposed in the at least one groove and fixed to the plate in the at least one groove, the metallic element having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, the metallic element being symmetrically arranged on or in the plate. A chamber for substrate processing is provided that includes a bimetallic faceplate. Also, a method of making a bimetallic faceplate is provided.

公开(公告)号：US20200185202A1

公开(公告)日：2020-06-11

申请号：US16664620

申请日：2019-10-25

Applicant: Applied Materials, Inc.

Inventor： Ian WIDLOW ,  Govinda RAJ ,  Gary U. KEPPERS ,  Aravind Dugganna NAIK ,  Francisco RODARTE ,  Sudhir R. GONDHALEKAR ,  Ravikumara KODINAGANHALLI

IPC: H01J37/32 ,  C23C16/44

Abstract: A component, a method of manufacturing a component, and a method of cleaning a component is provided. The component includes a gas flow system within the component, wherein the gas flow system fluidly couples one or more inlet holes and one or more outlet holes. The manufacturing of the component results in an arc shaped groove and a circumferential groove created in the body of the ring. The component undergoes one or more cleaning operations, including rinsing, baking, or purging operations. The cleaning operations remove debris or particles in or on the component, where the debris or particles can be caused during manufacturing of the component, or during use of the component in a semiconductor processing system.