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公开(公告)号:US20240124980A1
公开(公告)日:2024-04-18
申请号:US17964260
申请日:2022-10-12
Applicant: Applied Materials, Inc.
Inventor: Gaurav SHRIVASTAVA , Pavankumar Ramanand HARAPANHALLI , Sudhir R. GONDHALEKAR , Yao-Hung YANG , Chih-Yang CHANG
IPC: C23C16/455
CPC classification number: C23C16/45563
Abstract: A bimetallic faceplate for substrate processing is provided including a plate having a plurality of gas distribution holes and formed of a first metal having a first coefficient of thermal expansion, the plate having at least one groove around a center of the plate and spaced from the center of the plate; and a metallic element disposed in the at least one groove and fixed to the plate in the at least one groove, the metallic element having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, the metallic element being symmetrically arranged on or in the plate. A chamber for substrate processing is provided that includes a bimetallic faceplate. Also, a method of making a bimetallic faceplate is provided.
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公开(公告)号:US20230402311A1
公开(公告)日:2023-12-14
申请号:US17839235
申请日:2022-06-13
Applicant: Applied Materials, Inc.
IPC: H01L21/687 , C23C16/458 , C23C16/46
CPC classification number: H01L21/6875 , C23C16/4586 , C23C16/46
Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support includes: a first plate having a plurality of openings extending into the first plate from an upper surface of the first plate to a bottom surface of each respective opening of the plurality of openings; a plurality of tabs comprising three or more tabs disposed in each respective opening and extending towards the upper surface of the first plate; and a plurality of support elements disposed in each of the plurality of openings, wherein the plurality of tabs are disposed around each of the plurality of support elements and configured to retain the plurality of support elements in the plurality of openings.
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公开(公告)号:US20230402304A1
公开(公告)日:2023-12-14
申请号:US17748270
申请日:2022-05-19
Applicant: Applied Materials, Inc.
Inventor: Gaurav SHRIVASTAVA , Pavankumar Ramanand HARAPANHALLI , Yao-Hung YANG , Sudhir R. GONDHALEKAR , Chih-Yang CHANG
CPC classification number: H01L21/67248 , G01K7/04 , G01K7/223
Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a processing volume for processing a substrate and a pressure system in fluid communication with the processing volume and comprising a throttle valve assembly including a housing, a sensing device disposed in an interior of the housing, and a fan open to the interior of the housing, wherein, during operation of the pressure system to control a pressure within the processing volume, the sensing device is responsive to temperature changes in the interior of the housing such that the fan remains off when a temperature of the interior of the housing is less than a predetermined temperature and automatically turns on when the temperature within interior of the housing is equal to or greater than the predetermined temperature.
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