公开(公告)号：US20240399504A1

公开(公告)日：2024-12-05

申请号：US18203727

申请日：2023-05-31

Applicant: Applied Materials, Inc.

Inventor： Yao-Hung YANG ,  Chih-Yang CHANG ,  Shannon WANG ,  Jianqi WANG

IPC: B23K26/352 ,  B23K26/122 ,  B23K26/70

Abstract: Methods for texturing a surface of a component which include partially submerging the component within a liquid such that a first portion of the component is not submerged in the liquid and a second portion of the component is submerged in the liquid; and contacting at least the first portion of the component with a laser beam at a power and for a period of time sufficient to texture the first portion of the component to a first surface roughness, wherein the second portion of the component is either not textured by the laser beam, or is textured to a lesser degree than the first portion of the component and has a second surface roughness which is less than the first surface roughness.

公开(公告)号：US20230402311A1

公开(公告)日：2023-12-14

申请号：US17839235

申请日：2022-06-13

Applicant: Applied Materials, Inc.

Inventor： Fred Eric RUHLAND ,  Pavankumar Ramanand HARAPANHALLI ,  Gaurav SHRIVASTAVA ,  Yao-Hung YANG

IPC: H01L21/687 ,  C23C16/458 ,  C23C16/46

CPC classification number: H01L21/6875 ,  C23C16/4586 ,  C23C16/46

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support includes: a first plate having a plurality of openings extending into the first plate from an upper surface of the first plate to a bottom surface of each respective opening of the plurality of openings; a plurality of tabs comprising three or more tabs disposed in each respective opening and extending towards the upper surface of the first plate; and a plurality of support elements disposed in each of the plurality of openings, wherein the plurality of tabs are disposed around each of the plurality of support elements and configured to retain the plurality of support elements in the plurality of openings.

公开(公告)号：US20230272855A1

公开(公告)日：2023-08-31

申请号：US17851150

申请日：2022-06-28

Applicant: Applied Materials, Inc.

Inventor： Yao-Hung YANG ,  Fred Eric RUHLAND ,  Chih-Yang CHANG ,  Chiache LIN ,  Saurabh Murlidhar CHAUDHARI ,  Sridhar KENCHANAPURA NAGARAJU ,  Kishan RAO

IPC: F16J15/02

CPC classification number: F16J15/022

Abstract: An apparatus for inserting a seal member into a seal groove includes a tray. The tray includes a holding groove formed in a front surface for containing the seal member. The holding groove is sized and shaped to correspond with the seal groove. A method of installing a seal member into a seal groove includes aligning the holding groove with the seal groove, and applying a pressure to a back surface of the tray, thereby deforming the tray and inserting the seal member into the seal groove.

公开(公告)号：US20240410773A1

公开(公告)日：2024-12-12

申请号：US18208010

申请日：2023-06-09

Applicant: Applied Materials, Inc.

Inventor： Chih-Yang CHANG ,  Shantanu Rajiv GADGIL ,  Chien-Min LIAO ,  Shannon WANG ,  Yao-Hung YANG ,  Tom K. CHO

IPC: G01L13/06 ,  C23C16/455 ,  C23C16/52 ,  G01M13/005

Abstract: Methods and apparatus provide in-situ pressure sensors for apparatus used in semiconductor manufacturing processes. In some embodiments, the apparatus may comprise a showerhead body, a first gas channel of the showerhead body, a second gas channel of the showerhead body, one or more first gas pressure sensors positioned on a surface of the first gas channel, and one or more second gas pressure sensors positioned on a surface of the second gas channel. The apparatus may be formed by additive manufacturing including the pressure sensors and electrical connections to the pressure sensors. In some embodiments, a controller may be utilized to control semiconductor processes based on the pressure readings from the in-situ pressure sensors.

公开(公告)号：US20240271702A1

公开(公告)日：2024-08-15

申请号：US18108427

申请日：2023-02-10

Applicant: Applied Materials, Inc.

Inventor： Yao-Hung YANG ,  Chih-Yang CHANG ,  Shannon WANG

IPC: F16J15/328

CPC classification number: F16J15/328

Abstract: A method for forming an elastomer gasket in-situ on a part used for substrate processing that is tunable to a cross-section and/or length of a sealing surface such as a gasket groove or planar sealing surface. The method may include forming, in-situ, a first layer of at least one type of gasket material directly onto a bottom of the sealing surface of the part, forming subsequent layers of the at least one type of gasket material on at least one previously formed layer, and adjusting a number of subsequent layers of the at least one type of gasket material based on dimensions of the sealing surface.

公开(公告)号：US20240026975A1

公开(公告)日：2024-01-25

申请号：US18215604

申请日：2023-06-28

Applicant: Applied Materials, Inc.

Inventor： Yao-Hung YANG ,  Chih-Yang CHANG ,  Sam Hyungsam KIM

IPC: F16J15/06 ,  F16J15/10 ,  F16J15/02

CPC classification number: F16J15/062 ,  F16J15/102 ,  F16J15/025

Abstract: A sealing member includes a monolithic body including a first portion adjoining a second portion. The first portion forms part of a circle. The second portion includes first and second lobes. Each lobe adjoins the first portion with a concave surface. In one example, each lobe includes a rounded tip, and a convex surface extends from one rounded tip to the other rounded tip.

公开(公告)号：US20210035767A1

公开(公告)日：2021-02-04

申请号：US16525465

申请日：2019-07-29

Applicant: Applied Materials, Inc.

Inventor： Gang Grant PENG ,  Wai-Fan YAU ,  David W. GROECHEL ,  Frank F. HOOSHDARAN ,  Tom K. CHO ,  Yao-Hung YANG

IPC: H01J9/24 ,  B23K26/082 ,  B23K26/12 ,  B23K26/352

Abstract: Embodiments of the present disclosure generally relate to a method for forming and treating a component in semiconductor manufacturing. In one embodiment, a method for treating a chamber component used in vacuum processing includes obtaining the chamber component including a recess formed in a surface of the chamber component, the surface being fabricated from a metal, and the recess has a depth ranging from about 0.5 mm to about 10 mm and a width ranging from about 1 mm to about 15 mm. The method further includes polishing the bottom surface of the recess using a laser to form a polished bottom surface having an Ra number of 1 micron or less. The laser can achieve high quality surface finishing.

公开(公告)号：US20240162065A1

公开(公告)日：2024-05-16

申请号：US17987356

申请日：2022-11-15

Applicant: Applied Materials, Inc.

Inventor： Yao-Hung YANG ,  Chih-Yang CHANG ,  Shannon WANG

IPC: H01L21/67 ,  G01M5/00 ,  G05B19/418

CPC classification number: H01L21/67276 ,  G01M5/0066 ,  G05B19/41875 ,  G05B2219/32368

Abstract: A method of determining an operational status of a semiconductor manufacturing assembly uses internal vibrations of an in-situ assembly to detect defects. The method may include initiating a first test vibration in an internal structure of the semiconductor manufacturing assembly while the semiconductor manufacturing assembly is in-situ in a semiconductor processing chamber, receiving a first vibration signal caused by the first test vibration, transforming the first vibration signal into a first frequency domain representation of the first vibration signal, determining the operational status of the semiconductor manufacturing assembly based on the first frequency domain representation, and performing a corrective action for the semiconductor manufacturing assembly in response to the operational status.

公开(公告)号：US20240162030A1

公开(公告)日：2024-05-16

申请号：US18412127

申请日：2024-01-12

Applicant: Applied Materials, Inc.

Inventor： Yao-Hung YANG ,  Shantanu Rajiv GADGIL ,  Kaushik RAO ,  Vincent Joseph KIRCHHOFF ,  Sagir KADIWALA ,  Munirah MAHYUDIN ,  Daniel CHOU

IPC: H01K1/20

CPC classification number: H01K1/20 ,  H01K7/00

Abstract: A lamp and epitaxial processing apparatus are described herein. In one example, the lamp includes a bulb, a filament, and a plurality of filament supports disposed in spaced-apart relation to the filament, each of the filament supports having a hook support and a hook. The hook includes a connector configured to fasten the hook to the hook support, a first vertical portion extending from the connector toward the filament, and a rounded portion extending from an end of the first vertical portion distal from the connector and configured to wrap around the filament. A second vertical portion extends from an end of the rounded portion distal from the first vertical portion and the second vertical portion has a length between 60% and 100% of the length of the first vertical portion.

公开(公告)号：US20230402304A1

公开(公告)日：2023-12-14

申请号：US17748270

申请日：2022-05-19

Applicant: Applied Materials, Inc.

Inventor： Gaurav SHRIVASTAVA ,  Pavankumar Ramanand HARAPANHALLI ,  Yao-Hung YANG ,  Sudhir R. GONDHALEKAR ,  Chih-Yang CHANG

IPC: H01L21/67 ,  G01K7/22 ,  G01K7/04

CPC classification number: H01L21/67248 ,  G01K7/04 ,  G01K7/223

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a processing volume for processing a substrate and a pressure system in fluid communication with the processing volume and comprising a throttle valve assembly including a housing, a sensing device disposed in an interior of the housing, and a fan open to the interior of the housing, wherein, during operation of the pressure system to control a pressure within the processing volume, the sensing device is responsive to temperature changes in the interior of the housing such that the fan remains off when a temperature of the interior of the housing is less than a predetermined temperature and automatically turns on when the temperature within interior of the housing is equal to or greater than the predetermined temperature.