公开(公告)号：US20230060141A1

公开(公告)日：2023-03-02

申请号：US17977794

申请日：2022-10-31

Applicant: Applied Materials, Inc.

Inventor： Shantanu Rajiv GADGIL ,  Sumit Subhash PATANKAR ,  Nathan Arron DAVIS ,  Michael J. COUGHLIN ,  Allen L. D'AMBRA

IPC: B24B53/017 ,  B24B37/34 ,  C09D5/00 ,  B65D81/32 ,  B05C17/00

Abstract: Chemically impregnated applicators used to provide hydrophobic surfaces on chemical mechanical polishing system components and related application methods are shown. A method of forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove a polishing fluid residue therefrom and applying a hydrophobicity causing chemical solution to the surface of the polishing system component.

公开(公告)号：US20220008946A1

公开(公告)日：2022-01-13

申请号：US17365727

申请日：2021-07-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Yao-Hung YANG ,  Shantanu Rajiv GADGIL ,  Tanmay Pramod GURJAR ,  Sudhir R. GONDHALEKAR

IPC: B05B15/18 ,  C23C16/455 ,  B05B1/18

Abstract: Embodiments of showerheads for use in a process chamber and methods of reducing drooping of a showerhead faceplate are provided herein. In some embodiments, a showerhead for use in a process chamber includes: a faceplate having a plurality of gas distribution holes disposed therethrough; and one or more cables that engage with the faceplate and configured to prestress the faceplate.

公开(公告)号：US20240162030A1

公开(公告)日：2024-05-16

申请号：US18412127

申请日：2024-01-12

Applicant: Applied Materials, Inc.

Inventor： Yao-Hung YANG ,  Shantanu Rajiv GADGIL ,  Kaushik RAO ,  Vincent Joseph KIRCHHOFF ,  Sagir KADIWALA ,  Munirah MAHYUDIN ,  Daniel CHOU

IPC: H01K1/20

CPC classification number: H01K1/20 ,  H01K7/00

Abstract: A lamp and epitaxial processing apparatus are described herein. In one example, the lamp includes a bulb, a filament, and a plurality of filament supports disposed in spaced-apart relation to the filament, each of the filament supports having a hook support and a hook. The hook includes a connector configured to fasten the hook to the hook support, a first vertical portion extending from the connector toward the filament, and a rounded portion extending from an end of the first vertical portion distal from the connector and configured to wrap around the filament. A second vertical portion extends from an end of the rounded portion distal from the first vertical portion and the second vertical portion has a length between 60% and 100% of the length of the first vertical portion.

公开(公告)号：US20240307908A1

公开(公告)日：2024-09-19

申请号：US18671616

申请日：2024-05-22

Applicant: Applied Materials, Inc.

Inventor： Yao-Hung YANG ,  Shantanu Rajiv GADGIL ,  Tanmay Pramod GURJAR ,  Sudhir R. GONDHALEKAR

IPC: B05B15/18 ,  B05B1/18 ,  C23C16/455

CPC classification number: B05B15/18 ,  B05B1/18 ,  C23C16/45565

Abstract: Embodiments of showerheads for use in a process chamber and methods of reducing drooping of a showerhead faceplate are provided herein. In some embodiments, a method of reducing drooping of a faceplate for use in a process chamber includes: applying a compressive force to the faceplate via one or more cables that engage with the faceplate proximate an outer periphery thereof.

公开(公告)号：US20240306262A1

公开(公告)日：2024-09-12

申请号：US18222979

申请日：2023-07-17

Applicant: Applied Materials, Inc.

Inventor： Yao-Hung YANG ,  Shantanu Rajiv GADGIL ,  Kaushik RAO ,  Ngoc LE ,  Jeffrey Donald OLSON

IPC: H05B3/00 ,  B23K1/19 ,  H05B3/02

CPC classification number: H05B3/0047 ,  B23K1/19 ,  H05B3/02

Abstract: Embodiments of lamp housings for a process chamber are provided herein. In some embodiments, a lamp housing for a process chamber includes: a first plate having a plurality of first openings; a copper plate having a plurality of second openings; a plurality of tubes brazed via a braze alloy to the first plate at first ends of the plurality of tubes and brazed to the copper plate via the braze alloy at second ends of the plurality of tubes, wherein the plurality of tubes have central openings that are aligned with the plurality of first openings and the plurality of second openings, and wherein the braze alloy comprises a nickel containing alloy or a copper containing alloy, wherein the copper containing alloy does not include gold; and an annular jacket circumscribing the plurality of tubes and brazed to the first plate via the braze alloy.

公开(公告)号：US20240410773A1

公开(公告)日：2024-12-12

申请号：US18208010

申请日：2023-06-09

Applicant: Applied Materials, Inc.

Inventor： Chih-Yang CHANG ,  Shantanu Rajiv GADGIL ,  Chien-Min LIAO ,  Shannon WANG ,  Yao-Hung YANG ,  Tom K. CHO

IPC: G01L13/06 ,  C23C16/455 ,  C23C16/52 ,  G01M13/005

Abstract: Methods and apparatus provide in-situ pressure sensors for apparatus used in semiconductor manufacturing processes. In some embodiments, the apparatus may comprise a showerhead body, a first gas channel of the showerhead body, a second gas channel of the showerhead body, one or more first gas pressure sensors positioned on a surface of the first gas channel, and one or more second gas pressure sensors positioned on a surface of the second gas channel. The apparatus may be formed by additive manufacturing including the pressure sensors and electrical connections to the pressure sensors. In some embodiments, a controller may be utilized to control semiconductor processes based on the pressure readings from the in-situ pressure sensors.

公开(公告)号：US20210276144A1

公开(公告)日：2021-09-09

申请号：US16813275

申请日：2020-03-09

Applicant: Applied Materials, Inc.

Inventor： Shantanu Rajiv GADGIL ,  Sumit Subhash PATANKAR ,  Nathan Arron DAVIS ,  Michael J. COUGHLIN ,  Allen L. D'AMBRA

IPC: B24B37/34 ,  B65D81/32 ,  C09D5/00

Abstract: Embodiments herein relate to chemically impregnated applicators which may be used to provide hydrophobic surfaces on CMP system components and related application methods. In one embodiment, a method of forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove a polishing fluid residue therefrom and applying a hydrophobicity causing chemical solution to the surface of the polishing system component.